TW200635158A - Anisotropic conductive connector for inspecting wafer, manufacturing method thereof, waver inspection probe card, manufacturing method thereof, and wafer inspection device - Google Patents
Anisotropic conductive connector for inspecting wafer, manufacturing method thereof, waver inspection probe card, manufacturing method thereof, and wafer inspection deviceInfo
- Publication number
- TW200635158A TW200635158A TW094136560A TW94136560A TW200635158A TW 200635158 A TW200635158 A TW 200635158A TW 094136560 A TW094136560 A TW 094136560A TW 94136560 A TW94136560 A TW 94136560A TW 200635158 A TW200635158 A TW 200635158A
- Authority
- TW
- Taiwan
- Prior art keywords
- manufacturing
- wafer
- anisotropic conductive
- material layer
- conductive connector
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
Landscapes
- Measuring Leads Or Probes (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Non-Insulated Conductors (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004308963 | 2004-10-22 | ||
JP2005021477 | 2005-01-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200635158A true TW200635158A (en) | 2006-10-01 |
Family
ID=36203044
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094136560A TW200635158A (en) | 2004-10-22 | 2005-10-19 | Anisotropic conductive connector for inspecting wafer, manufacturing method thereof, waver inspection probe card, manufacturing method thereof, and wafer inspection device |
Country Status (2)
Country | Link |
---|---|
TW (1) | TW200635158A (zh) |
WO (1) | WO2006043628A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102396113A (zh) * | 2009-04-28 | 2012-03-28 | 日立化成工业株式会社 | 电路连接材料、使用该材料的膜状电路连接材料、电路部件的连接结构以及电路部件的连接方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112753135B (zh) * | 2018-10-11 | 2024-05-10 | 积水保力马科技株式会社 | 电连接片及带端子的玻璃板构造 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5193393A (en) * | 1975-02-12 | 1976-08-16 | Erasuteitsuku kontakutoshiitonoseizohoho | |
JPS6032285B2 (ja) * | 1977-05-31 | 1985-07-27 | ジェイエスアール株式会社 | 加圧導電性エラストマ−の製造方法 |
JPS61250906A (ja) * | 1985-04-26 | 1986-11-08 | ジェイエスアール株式会社 | 導電性エラストマ−シ−ト |
JPH1140224A (ja) * | 1997-07-11 | 1999-02-12 | Jsr Corp | 異方導電性シート |
JP2002280092A (ja) * | 2001-03-19 | 2002-09-27 | Jsr Corp | 異方導電性シートおよびその応用製品 |
KR20050115297A (ko) * | 2003-03-26 | 2005-12-07 | 제이에스알 가부시끼가이샤 | 전기 저항 측정용 커넥터, 전기 저항 측정용 커넥터 장치및 그 제조 방법 및 회로 기판의 전기 저항 측정 장치 및측정 방법 |
-
2005
- 2005-10-19 TW TW094136560A patent/TW200635158A/zh unknown
- 2005-10-20 WO PCT/JP2005/019306 patent/WO2006043628A1/ja active Application Filing
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102396113A (zh) * | 2009-04-28 | 2012-03-28 | 日立化成工业株式会社 | 电路连接材料、使用该材料的膜状电路连接材料、电路部件的连接结构以及电路部件的连接方法 |
CN102396113B (zh) * | 2009-04-28 | 2014-09-24 | 日立化成株式会社 | 电路连接材料、使用该材料的膜状电路连接材料、电路部件的连接结构以及电路部件的连接方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2006043628A1 (ja) | 2006-04-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1182460A3 (en) | Fritting inspection method and apparatus | |
ATE480636T1 (de) | Elektrochemische testvorrichtung und damit verbundene verfahren | |
ATE378607T1 (de) | Verfahren und vorrichtung zum testen elektrischer eigenschaften eines zu prüfenden objekts | |
ATE550784T1 (de) | Effizientes verfahren zum freilegen und kontaktieren von wafer-durchkontaktierungen | |
TW200617410A (en) | Semiconductor wafer and inspection method thereof | |
TW200622266A (en) | Test probe and tester, method for manufacturing the test probe | |
JP2002334732A5 (zh) | ||
WO2010013985A2 (ko) | 박막 트랜지스터 어레이 기판의 제조방법 및 제조장치 | |
TW200625725A (en) | Anisotropic conductive connector for inspecting wafer, manufacturing method thereof, waver inspection probe card, manufacturing method thereof, and wafer inspection device | |
TW200602641A (en) | Probe card and method for constructing same | |
TW200729311A (en) | Liquid processing method and liquid processing apparatus | |
TW200635158A (en) | Anisotropic conductive connector for inspecting wafer, manufacturing method thereof, waver inspection probe card, manufacturing method thereof, and wafer inspection device | |
WO2004088739A3 (en) | Real-time in-line testing of semiconductor wafers | |
TW200709316A (en) | Substrate and testing method thereof | |
TW200602712A (en) | Array substrate inspecting method and array substrate manufacturing method | |
WO2007130517A3 (en) | Extended probe tips | |
TW200710411A (en) | Method and apparatus for electrical testing of a unit under test, as well as a method for production of a contact-making apparatus which is used for testing | |
ATE353457T1 (de) | Verfahren zum zusammenbauen eines elektronischen komponent auf einem substrat | |
EP1677355A3 (en) | Process for manufacturing an image sensor using deuterium | |
WO2011141139A3 (de) | Verfahren zur herstellung einer einseitig kontaktierbaren solarzelle aus einem silizium-halbleitersubstrat | |
TW200635159A (en) | Adapter, manufacturing method thereof, and electric inspection device for circuit device | |
WO2004008566A3 (de) | Vorrichtung und zur prüfung einer elektroden-membran-einheit | |
JP2004226270A (ja) | ワイヤプローブ装置及び検査冶具 | |
TWI266379B (en) | Strip test method and functional test device | |
TW200630623A (en) | Electrical inspection device for flexible printed board |