TW200634041A - Composition comprising a hydrogenated bisglycidyl ether and a crosslinker - Google Patents
Composition comprising a hydrogenated bisglycidyl ether and a crosslinkerInfo
- Publication number
- TW200634041A TW200634041A TW095102253A TW95102253A TW200634041A TW 200634041 A TW200634041 A TW 200634041A TW 095102253 A TW095102253 A TW 095102253A TW 95102253 A TW95102253 A TW 95102253A TW 200634041 A TW200634041 A TW 200634041A
- Authority
- TW
- Taiwan
- Prior art keywords
- crosslinker
- composition
- bisglycidyl ether
- hydrogenated
- hydrogenated bisglycidyl
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1405—Polycondensates modified by chemical after-treatment with inorganic compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Epoxy Compounds (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Low-Molecular Organic Synthesis Reactions Using Catalysts (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005003116A DE102005003116A1 (de) | 2005-01-21 | 2005-01-21 | Zusammensetzung enthaltend einen hydrierten Bisglycidylether und ein Vernetzungsmittel |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200634041A true TW200634041A (en) | 2006-10-01 |
Family
ID=35871067
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095102253A TW200634041A (en) | 2005-01-21 | 2006-01-20 | Composition comprising a hydrogenated bisglycidyl ether and a crosslinker |
Country Status (7)
Country | Link |
---|---|
US (1) | US20080139728A1 (zh) |
EP (1) | EP1844085A1 (zh) |
JP (1) | JP2008528715A (zh) |
CN (1) | CN101107284A (zh) |
DE (1) | DE102005003116A1 (zh) |
TW (1) | TW200634041A (zh) |
WO (1) | WO2006077081A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI385191B (zh) * | 2008-12-30 | 2013-02-11 | Ind Tech Res Inst | 熱硬化型防焊膜組成物 |
US8420745B2 (en) | 2008-12-30 | 2013-04-16 | Industrial Technology Research Institute | Thermally curable solder resist composition |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2102178B1 (de) * | 2006-12-07 | 2010-11-24 | Basf Se | Epoxidharzzusammensetzungen und verfahren zu ihrer herstellung |
JP5260447B2 (ja) * | 2009-08-27 | 2013-08-14 | 三洋化成工業株式会社 | エポキシ樹脂およびエポキシ樹脂組成物 |
WO2011023227A1 (en) * | 2009-08-27 | 2011-03-03 | Abb Research Ltd | Curable epoxy resin composition |
WO2015138128A1 (en) | 2014-03-12 | 2015-09-17 | Dow Global Technologies Llc | Epoxy resin compositions |
EP3339391B1 (en) * | 2016-12-23 | 2020-02-05 | Evonik Operations GmbH | Apcha as a building block in curing agent formulations for structural adhesives |
CN106970473B (zh) * | 2017-05-22 | 2019-01-25 | 温州佳宏百丽科技有限公司 | 一种碳纤维眼镜腿及其制备工艺 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002037856A (ja) * | 2000-07-28 | 2002-02-06 | Dainippon Ink & Chem Inc | エポキシ樹脂組成物 |
DE60223872T2 (de) * | 2001-06-25 | 2008-11-06 | Mitsubishi Chemical Corp. | Alizyklische Epoxyverbindungen und Verfahren zu deren Herstellung, alizyklische Epoxyharzzusammensetzung, und Verkapselung für Leuchtdiode |
EP1699557A1 (de) * | 2003-12-22 | 2006-09-13 | Basf Aktiengesellschaft | Ruthenium-heterogenkatalysator, verfahren zur hydrierung einer carbocyclischen aromatischen gruppe und kernhydrierte bisglycidylether der bisphenole a und f |
DE10361157A1 (de) * | 2003-12-22 | 2005-07-21 | Basf Ag | Ruthenium-Heterogenkatalysator und Verfahren zur Herstellung eines Bisglycidylethers der Formel I |
CA2567344C (en) * | 2004-05-27 | 2016-04-19 | Arizona Chemical Company | Compositions and articles containing a crosslinked polymer matrix and an immobilized active liquid, as well as methods of making and using the same |
-
2005
- 2005-01-21 DE DE102005003116A patent/DE102005003116A1/de not_active Withdrawn
-
2006
- 2006-01-18 WO PCT/EP2006/000389 patent/WO2006077081A1/de not_active Application Discontinuation
- 2006-01-18 EP EP06701121A patent/EP1844085A1/de not_active Withdrawn
- 2006-01-18 JP JP2007551602A patent/JP2008528715A/ja not_active Withdrawn
- 2006-01-18 CN CNA2006800029287A patent/CN101107284A/zh active Pending
- 2006-01-18 US US11/814,005 patent/US20080139728A1/en not_active Abandoned
- 2006-01-20 TW TW095102253A patent/TW200634041A/zh unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI385191B (zh) * | 2008-12-30 | 2013-02-11 | Ind Tech Res Inst | 熱硬化型防焊膜組成物 |
US8420745B2 (en) | 2008-12-30 | 2013-04-16 | Industrial Technology Research Institute | Thermally curable solder resist composition |
Also Published As
Publication number | Publication date |
---|---|
JP2008528715A (ja) | 2008-07-31 |
CN101107284A (zh) | 2008-01-16 |
EP1844085A1 (de) | 2007-10-17 |
WO2006077081A1 (de) | 2006-07-27 |
DE102005003116A1 (de) | 2006-07-27 |
US20080139728A1 (en) | 2008-06-12 |
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