TW200633623A - Air blown chip heat dissipation device and manufacturing method thereof - Google Patents
Air blown chip heat dissipation device and manufacturing method thereofInfo
- Publication number
- TW200633623A TW200633623A TW094106356A TW94106356A TW200633623A TW 200633623 A TW200633623 A TW 200633623A TW 094106356 A TW094106356 A TW 094106356A TW 94106356 A TW94106356 A TW 94106356A TW 200633623 A TW200633623 A TW 200633623A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat dissipation
- manufacturing
- heat
- air blown
- slip
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
- C25D15/02—Combined electrolytic and electrophoretic processes with charged materials
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3732—Diamonds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
- B23P2700/10—Heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094106356A TWI299976B (en) | 2005-03-02 | 2005-03-02 | Air blown chip heat dissipation device and manufacturing method thereof |
DE102006003754A DE102006003754A1 (de) | 2005-03-02 | 2006-01-25 | Luftkühlvorrichtung für Chip und Verfahren zu deren Herstellung |
US11/307,809 US20060256528A1 (en) | 2005-03-02 | 2006-02-23 | Air Blown Chip Dissipation Device and Manufacturing Method Thereof |
JP2006051279A JP2006245577A (ja) | 2005-03-02 | 2006-02-27 | 強制空冷式チップ冷却装置及びその装置の作成方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094106356A TWI299976B (en) | 2005-03-02 | 2005-03-02 | Air blown chip heat dissipation device and manufacturing method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200633623A true TW200633623A (en) | 2006-09-16 |
TWI299976B TWI299976B (en) | 2008-08-11 |
Family
ID=36848282
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094106356A TWI299976B (en) | 2005-03-02 | 2005-03-02 | Air blown chip heat dissipation device and manufacturing method thereof |
Country Status (4)
Country | Link |
---|---|
US (1) | US20060256528A1 (zh) |
JP (1) | JP2006245577A (zh) |
DE (1) | DE102006003754A1 (zh) |
TW (1) | TWI299976B (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080298021A1 (en) * | 2007-05-31 | 2008-12-04 | Ali Ihab A | Notebook computer with hybrid diamond heat spreader |
US9754857B2 (en) | 2009-03-23 | 2017-09-05 | Hewlett-Packard Development Company, L.P. | Folded fin heat transfer device |
FR2949181B1 (fr) * | 2009-08-14 | 2017-02-24 | Splitted Desktop Systems | Dissipateur thermique pour composants electroniques et methode d'assemblage associee |
CN103419004A (zh) * | 2012-05-17 | 2013-12-04 | 宝山钢铁股份有限公司 | 干熄焦预热器径向换热管的加工方法 |
CN104597996A (zh) * | 2015-02-02 | 2015-05-06 | 孟书芳 | 一种散热模组 |
CN108213855A (zh) * | 2016-12-15 | 2018-06-29 | 宁波江丰电子材料股份有限公司 | 铜靶材组件及其制造方法 |
CN106756798A (zh) * | 2016-12-15 | 2017-05-31 | 九江市计行塑胶有限公司 | 一种镀铝层表面冷却系统 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5642779A (en) * | 1909-06-30 | 1997-07-01 | Sumitomo Electric Industries, Ltd. | Heat sink and a process for the production of the same |
US4782893A (en) * | 1986-09-15 | 1988-11-08 | Trique Concepts, Inc. | Electrically insulating thermally conductive pad for mounting electronic components |
US5008737A (en) * | 1988-10-11 | 1991-04-16 | Amoco Corporation | Diamond composite heat sink for use with semiconductor devices |
JPH02224265A (ja) * | 1988-10-19 | 1990-09-06 | Hitachi Ltd | 半導体チップの冷却装置及びその製造方法 |
US5366688A (en) * | 1992-12-09 | 1994-11-22 | Iowa State University Research Foundation, Inc. | Heat sink and method of fabricating |
US5389400A (en) * | 1993-04-07 | 1995-02-14 | Applied Sciences, Inc. | Method for making a diamond/carbon/carbon composite useful as an integral dielectric heat sink |
KR970005712B1 (ko) * | 1994-01-11 | 1997-04-19 | 삼성전자 주식회사 | 고 열방출용 반도체 패키지 |
US5591034A (en) * | 1994-02-14 | 1997-01-07 | W. L. Gore & Associates, Inc. | Thermally conductive adhesive interface |
US5472043A (en) * | 1994-03-22 | 1995-12-05 | Aavid Laboratories, Inc. | Two-phase component cooler with radioactive initiator |
US5513070A (en) * | 1994-12-16 | 1996-04-30 | Intel Corporation | Dissipation of heat through keyboard using a heat pipe |
JP3942248B2 (ja) * | 1997-02-24 | 2007-07-11 | 富士通株式会社 | ヒートシンクおよびそれを搭載した情報処理装置 |
US6250378B1 (en) * | 1998-05-29 | 2001-06-26 | Mitsubishi Denki Kabushiki Kaisha | Information processing apparatus and its heat spreading method |
US6055154A (en) * | 1998-07-17 | 2000-04-25 | Lucent Technologies Inc. | In-board chip cooling system |
US6496373B1 (en) * | 1999-11-04 | 2002-12-17 | Amerasia International Technology, Inc. | Compressible thermally-conductive interface |
US20020023733A1 (en) * | 1999-12-13 | 2002-02-28 | Hall David R. | High-pressure high-temperature polycrystalline diamond heat spreader |
JP2001339022A (ja) * | 1999-12-24 | 2001-12-07 | Ngk Insulators Ltd | ヒートシンク材及びその製造方法 |
US6407916B1 (en) * | 2000-06-12 | 2002-06-18 | Intel Corporation | Computer assembly for cooling high powered microprocessors |
EA006968B1 (ru) * | 2001-04-30 | 2006-06-30 | Термо Композит, Ллс | Терморегулирующий материал, устройство и способ его изготовления |
US7147367B2 (en) * | 2002-06-11 | 2006-12-12 | Saint-Gobain Performance Plastics Corporation | Thermal interface material with low melting alloy |
JP2004221604A (ja) * | 2004-02-04 | 2004-08-05 | Furukawa Electric Co Ltd:The | 冷却装置 |
-
2005
- 2005-03-02 TW TW094106356A patent/TWI299976B/zh not_active IP Right Cessation
-
2006
- 2006-01-25 DE DE102006003754A patent/DE102006003754A1/de not_active Ceased
- 2006-02-23 US US11/307,809 patent/US20060256528A1/en not_active Abandoned
- 2006-02-27 JP JP2006051279A patent/JP2006245577A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
DE102006003754A1 (de) | 2006-09-07 |
US20060256528A1 (en) | 2006-11-16 |
JP2006245577A (ja) | 2006-09-14 |
TWI299976B (en) | 2008-08-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |