FR2949181B1 - Dissipateur thermique pour composants electroniques et methode d'assemblage associee - Google Patents

Dissipateur thermique pour composants electroniques et methode d'assemblage associee

Info

Publication number
FR2949181B1
FR2949181B1 FR0903982A FR0903982A FR2949181B1 FR 2949181 B1 FR2949181 B1 FR 2949181B1 FR 0903982 A FR0903982 A FR 0903982A FR 0903982 A FR0903982 A FR 0903982A FR 2949181 B1 FR2949181 B1 FR 2949181B1
Authority
FR
France
Prior art keywords
assembly
electronic components
associated method
thermal dissipator
dissipator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0903982A
Other languages
English (en)
Other versions
FR2949181A1 (fr
Inventor
Florent Villard
Jean Marie Verdun
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Itrenew France Fr
Original Assignee
SPLITTED DESKTOP SYSTEMS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SPLITTED DESKTOP SYSTEMS filed Critical SPLITTED DESKTOP SYSTEMS
Priority to FR0903982A priority Critical patent/FR2949181B1/fr
Publication of FR2949181A1 publication Critical patent/FR2949181A1/fr
Application granted granted Critical
Publication of FR2949181B1 publication Critical patent/FR2949181B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geometry (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR0903982A 2009-08-14 2009-08-14 Dissipateur thermique pour composants electroniques et methode d'assemblage associee Expired - Fee Related FR2949181B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0903982A FR2949181B1 (fr) 2009-08-14 2009-08-14 Dissipateur thermique pour composants electroniques et methode d'assemblage associee

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0903982A FR2949181B1 (fr) 2009-08-14 2009-08-14 Dissipateur thermique pour composants electroniques et methode d'assemblage associee

Publications (2)

Publication Number Publication Date
FR2949181A1 FR2949181A1 (fr) 2011-02-18
FR2949181B1 true FR2949181B1 (fr) 2017-02-24

Family

ID=41818886

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0903982A Expired - Fee Related FR2949181B1 (fr) 2009-08-14 2009-08-14 Dissipateur thermique pour composants electroniques et methode d'assemblage associee

Country Status (1)

Country Link
FR (1) FR2949181B1 (fr)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3067399B2 (ja) * 1992-07-03 2000-07-17 株式会社日立製作所 半導体冷却装置
JP2794154B2 (ja) * 1993-06-04 1998-09-03 ダイヤモンド電機 株式会社 ヒートシンク
TWM240615U (en) * 2003-03-17 2004-08-11 Shuttle Inc Combination structure of CPU heat dissipating device and power supply
US20070053168A1 (en) * 2004-01-21 2007-03-08 General Electric Company Advanced heat sinks and thermal spreaders
US7028754B2 (en) * 2004-04-26 2006-04-18 Hewlett-Packard Development Company, L.P. High surface area heat sink
US7147041B2 (en) * 2004-05-03 2006-12-12 Parker-Hannifin Corporation Lightweight heat sink
TWI299976B (en) * 2005-03-02 2008-08-11 Mitac Technology Corp Air blown chip heat dissipation device and manufacturing method thereof
JP4539425B2 (ja) * 2005-04-28 2010-09-08 日立電線株式会社 ヒートパイプ式ヒートシンク及びその製造方法
WO2007102226A1 (fr) * 2006-03-09 2007-09-13 Fujitsu Limited appareil ventilateur, APPAREIL électronique, et leur procédé de commande
US7542293B2 (en) * 2006-04-10 2009-06-02 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Thermal module
US7529090B2 (en) * 2007-08-29 2009-05-05 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device

Also Published As

Publication number Publication date
FR2949181A1 (fr) 2011-02-18

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