FI20085945A0 - Elektroniikkalaitteen jäähdytysrakenne ja menetelmä - Google Patents

Elektroniikkalaitteen jäähdytysrakenne ja menetelmä

Info

Publication number
FI20085945A0
FI20085945A0 FI20085945A FI20085945A FI20085945A0 FI 20085945 A0 FI20085945 A0 FI 20085945A0 FI 20085945 A FI20085945 A FI 20085945A FI 20085945 A FI20085945 A FI 20085945A FI 20085945 A0 FI20085945 A0 FI 20085945A0
Authority
FI
Finland
Prior art keywords
electronic device
cooling structure
cooling
electronic
Prior art date
Application number
FI20085945A
Other languages
English (en)
Swedish (sv)
Other versions
FI20085945L (fi
Inventor
Matti Smalen
Timo Koivuluoma
Matti Laitinen
Original Assignee
Abb Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Abb Oy filed Critical Abb Oy
Priority to FI20085945A priority Critical patent/FI20085945L/fi
Publication of FI20085945A0 publication Critical patent/FI20085945A0/fi
Priority to PCT/FI2009/050792 priority patent/WO2010040896A1/en
Priority to CN200980139724.1A priority patent/CN102172109B/zh
Priority to EP09748360A priority patent/EP2347643B1/en
Publication of FI20085945L publication Critical patent/FI20085945L/fi
Priority to US13/080,191 priority patent/US8379384B2/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FI20085945A 2008-10-08 2008-10-08 Elektroniikkalaitteen jäähdytysrakenne ja menetelmä FI20085945L (fi)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FI20085945A FI20085945L (fi) 2008-10-08 2008-10-08 Elektroniikkalaitteen jäähdytysrakenne ja menetelmä
PCT/FI2009/050792 WO2010040896A1 (en) 2008-10-08 2009-10-01 Cooling structure for electronic device, and a method
CN200980139724.1A CN102172109B (zh) 2008-10-08 2009-10-01 用于电子装置的冷却装置和方法
EP09748360A EP2347643B1 (en) 2008-10-08 2009-10-01 Cooling structure for electronic device, and a method
US13/080,191 US8379384B2 (en) 2008-10-08 2011-04-05 Cooling structure for electronic device, and a method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20085945A FI20085945L (fi) 2008-10-08 2008-10-08 Elektroniikkalaitteen jäähdytysrakenne ja menetelmä

Publications (2)

Publication Number Publication Date
FI20085945A0 true FI20085945A0 (fi) 2008-10-08
FI20085945L FI20085945L (fi) 2010-04-09

Family

ID=39924590

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20085945A FI20085945L (fi) 2008-10-08 2008-10-08 Elektroniikkalaitteen jäähdytysrakenne ja menetelmä

Country Status (5)

Country Link
US (1) US8379384B2 (fi)
EP (1) EP2347643B1 (fi)
CN (1) CN102172109B (fi)
FI (1) FI20085945L (fi)
WO (1) WO2010040896A1 (fi)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9192079B2 (en) * 2008-09-26 2015-11-17 Rockwell Automation Technologies, Inc. Power electronic module cooling system and method
CN101950197A (zh) * 2010-05-24 2011-01-19 深圳市傲星泰科技有限公司 一种计算机电源
JP5348623B2 (ja) * 2010-09-10 2013-11-20 株式会社安川電機 電子機器装置
EP2557676B1 (de) * 2011-08-09 2014-02-26 Siemens Aktiengesellschaft Umrichteranordnung mit einem Luftkühlsystem
US8634193B2 (en) * 2011-12-05 2014-01-21 Rockwell Automation Technologies, Inc. Device and method using induction to improve natural convection cooling
US8842432B2 (en) * 2012-09-22 2014-09-23 Facebook, Inc. Arrangement of computing assets in a data center
KR102094887B1 (ko) * 2013-07-08 2020-03-30 엘지전자 주식회사 디지털 사이니지 및 그 구동방법
WO2016041145A1 (zh) * 2014-09-16 2016-03-24 深圳市大疆创新科技有限公司 散热装置及采用该散热装置的uav
US10653992B2 (en) * 2017-10-12 2020-05-19 Quanta Computer Inc. Server dust collector
EP3490353A1 (de) * 2017-11-27 2019-05-29 Siemens Aktiengesellschaft Kühlsystem mit parallelen kühlkanälen
ES2914353T3 (es) 2018-06-28 2022-06-09 Signify Holding Bv Poste de alumbrado público
DK3912441T3 (da) * 2019-01-18 2024-07-08 Bitzer Electronics As Varmeoverføringsindretning og effektelektronikindretning
US10908657B2 (en) * 2019-02-15 2021-02-02 Pensando Systems Inc. Methods and systems for thermal control
JP7275380B2 (ja) 2020-03-27 2023-05-17 株式会社ソニー・インタラクティブエンタテインメント 電子機器
WO2021193879A1 (ja) * 2020-03-27 2021-09-30 株式会社ソニー・インタラクティブエンタテインメント 電子機器

Family Cites Families (24)

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Publication number Priority date Publication date Assignee Title
DE2151010B2 (de) 1971-10-08 1978-07-20 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Aufgesetzte wetterschutzhaube fuer durchzugsbelueftete elektrische maschinen
JP2525806B2 (ja) 1987-05-19 1996-08-21 株式会社東芝 冷却空気瀘過装置付回転電機
DE68920513T2 (de) 1988-08-31 1995-05-04 Hitachi Ltd Wechselrichtervorrichtung.
JP2878017B2 (ja) 1992-04-03 1999-04-05 日本電気株式会社 空気の塵埃除去装置
JPH0795771A (ja) * 1993-09-20 1995-04-07 Sansha Electric Mfg Co Ltd 電源装置の冷却構造
US5694294A (en) * 1995-01-27 1997-12-02 Hitachi, Ltd. Portable computer with fan moving air from a first space created between a keyboard and a first circuit board and a second space created between the first circuit board and a second circuit board
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DE50001558D1 (de) * 1999-06-01 2003-04-30 Volker Dalheimer Gehäuseanordnung zur aufnahme elektronischer baugruppen, insbesondere flaches desktop-pc- oder multimedia-gehäuse
GB2369249B (en) 2000-11-06 2004-06-09 3Com Corp Cooling apparatus including a flow guide
JP2005079175A (ja) * 2003-08-28 2005-03-24 Toshiba Corp 放熱装置
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FI20031714A0 (fi) * 2003-11-24 2003-11-24 Abb Oy Invertteri
JP3784813B2 (ja) * 2003-11-26 2006-06-14 本田技研工業株式会社 車両モータ用高圧電装の冷却装置及びハイブリッド車両
DE102004015829B4 (de) * 2004-03-31 2016-11-24 Valeo Klimasysteme Gmbh Ansaugstutzen
US7345873B2 (en) * 2004-09-29 2008-03-18 General Electric Company System and method for cooling electronic systems
PL193094B1 (pl) * 2004-11-15 2007-01-31 Adb Polska Sp Urządzenie elektroniczne z płytą montażową z obwodami drukowanymi i płyta montażowa z obwodami drukowanymi
US7218517B2 (en) * 2004-12-07 2007-05-15 International Business Machines Corporation Cooling apparatus for vertically stacked printed circuit boards
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TWI284017B (en) * 2005-09-22 2007-07-11 Delta Electronics Inc Heat dissipating system and dissipating method thereof
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JP2010080456A (ja) 2007-01-10 2010-04-08 Ntt Electornics Corp 電子ユニット
JP5011016B2 (ja) * 2007-07-30 2012-08-29 株式会社日立産機システム 電力変換装置
US8335081B2 (en) * 2010-07-16 2012-12-18 Rockwell Automation Technologies, Inc. Heat sink cooling arrangement for multiple power electronic circuits

Also Published As

Publication number Publication date
CN102172109B (zh) 2014-05-14
US8379384B2 (en) 2013-02-19
FI20085945L (fi) 2010-04-09
US20110198064A1 (en) 2011-08-18
EP2347643B1 (en) 2013-03-20
WO2010040896A1 (en) 2010-04-15
CN102172109A (zh) 2011-08-31
EP2347643A1 (en) 2011-07-27

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