TW200625503A - Non-contact suction holding apparatus - Google Patents

Non-contact suction holding apparatus

Info

Publication number
TW200625503A
TW200625503A TW094124956A TW94124956A TW200625503A TW 200625503 A TW200625503 A TW 200625503A TW 094124956 A TW094124956 A TW 094124956A TW 94124956 A TW94124956 A TW 94124956A TW 200625503 A TW200625503 A TW 200625503A
Authority
TW
Taiwan
Prior art keywords
suction
wafer
contact
holding apparatus
suction table
Prior art date
Application number
TW094124956A
Other languages
English (en)
Other versions
TWI417985B (zh
Inventor
Tsuyoshi Kurita
Kan Nakada
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of TW200625503A publication Critical patent/TW200625503A/zh
Application granted granted Critical
Publication of TWI417985B publication Critical patent/TWI417985B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
TW094124956A 2004-10-14 2005-07-22 Non - contact type adsorption holding device TWI417985B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004299507A JP4541824B2 (ja) 2004-10-14 2004-10-14 非接触型吸着保持装置

Publications (2)

Publication Number Publication Date
TW200625503A true TW200625503A (en) 2006-07-16
TWI417985B TWI417985B (zh) 2013-12-01

Family

ID=36148160

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094124956A TWI417985B (zh) 2004-10-14 2005-07-22 Non - contact type adsorption holding device

Country Status (6)

Country Link
US (1) US20090026676A1 (zh)
JP (1) JP4541824B2 (zh)
KR (1) KR101098025B1 (zh)
CN (1) CN100495680C (zh)
TW (1) TWI417985B (zh)
WO (1) WO2006040858A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI607519B (zh) * 2012-11-30 2017-12-01 尼康股份有限公司 吸引裝置、搬入方法、搬送系統及曝光裝置、以及元件製造方法

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KR100674440B1 (ko) * 2005-08-12 2007-01-25 주식회사 파이컴 프로브 카드 제조 방법 및 장치
JP5013400B2 (ja) * 2006-09-29 2012-08-29 国立大学法人東北大学 塗布膜コーティング装置
JP5205214B2 (ja) * 2008-10-27 2013-06-05 リンテック株式会社 板状部材の支持装置および支持方法
DE102009018434B4 (de) * 2009-04-22 2023-11-30 Ev Group Gmbh Aufnahmeeinrichtung zur Aufnahme von Halbleitersubstraten
MY154643A (en) * 2010-08-20 2015-07-15 First Solar Inc Tape applicator
CN102103987B (zh) * 2010-12-21 2013-01-23 上海技美电子科技有限公司 晶圆贴膜方法及晶圆贴膜装置
CN103199049B (zh) * 2012-01-04 2015-09-09 沈阳芯源微电子设备有限公司 一种可兼容不同尺寸晶圆的伯努利承片台
JP5888051B2 (ja) * 2012-03-27 2016-03-16 三菱電機株式会社 ウエハ吸着方法、ウエハ吸着ステージ、ウエハ吸着システム
JP5454971B2 (ja) * 2012-04-13 2014-03-26 株式会社日本製鋼所 移動ステージ
SG11201503660VA (en) * 2012-11-27 2015-06-29 Acm Res Shanghai Inc Substrate supporting apparatus
KR20230055404A (ko) * 2012-11-30 2023-04-25 가부시키가이샤 니콘 반송 시스템, 노광 장치, 반송 방법, 노광 방법 및 디바이스 제조방법, 및 흡인 장치
JP2014135390A (ja) * 2013-01-10 2014-07-24 Olympus Corp 基板搬送装置、基板検査装置及び基板搬送方法
KR101476061B1 (ko) * 2013-11-22 2014-12-30 윤웅 반도체 웨이퍼 ｏｃｒ 소터
JP6250435B2 (ja) * 2014-02-26 2017-12-20 光洋機械工業株式会社 両頭平面研削法
CN104096980B (zh) * 2014-06-26 2016-01-20 长春光华微电子设备工程中心有限公司 激光切割真空吸附平台
JP6576172B2 (ja) * 2015-09-03 2019-09-18 株式会社ディスコ チャックテーブル
KR102347236B1 (ko) 2016-07-28 2022-01-04 래쉬파이 인코포레이티드 인공 속눈썹 연장물
CA3206108A1 (en) 2016-12-20 2018-06-28 Lashify, Inc. Applicators and cases for artificial lash extensions
CN108878338B (zh) * 2017-05-11 2020-10-13 北京北方华创微电子装备有限公司 一种吸片装置
CN109461691A (zh) * 2017-09-06 2019-03-12 富士迈半导体精密工业（上海）有限公司 晶圆支撑装置
DE102018125682B4 (de) * 2018-10-16 2023-01-19 Asm Assembly Systems Gmbh & Co. Kg Ejektorvorrichtung sowie Verfahren zum Unterstützen eines Ablösens eines auf einer Haltefolie angeordneten elektrischen Bauteils
JP1687380S (zh) 2018-10-19 2021-06-07
USD863679S1 (en) 2018-10-19 2019-10-15 Lashify, Inc. False eyelash applicator
CN212661179U (zh) 2018-10-19 2021-03-09 莱施菲公司 储存睫毛延长物的盒体
EP4344569A3 (en) 2019-01-14 2024-06-19 Lashify, Inc. Socks, applicators for lash extensions, and methods of manufacture and use thereof
CN111557515A (zh) 2019-10-03 2020-08-21 莱施菲公司 人造睫毛装置、睫毛延长方法及睫毛延长装置
JP7383147B2 (ja) * 2020-05-25 2023-11-17 株式会社日立ハイテク 基板保持装置及び基板処理装置
CN112201610A (zh) * 2020-09-30 2021-01-08 南京华易泰电子科技有限公司 一种非接触式晶片支撑装置
CN114194807A (zh) * 2021-12-06 2022-03-18 浙江人和光伏科技有限公司 接线盒的加锡装置
WO2024008359A1 (en) * 2022-07-07 2024-01-11 Asml Netherlands B.V. Substrate holding system and lithographic apparatus
USD995914S1 (en) 2022-07-20 2023-08-15 Lashify, Inc. Combined tweezer and applicator for artificial lash extensions

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JPH0666381B2 (ja) * 1989-05-18 1994-08-24 株式会社エンヤシステム ウエハチヤツク方法及び装置
JPH03102850A (ja) * 1989-09-18 1991-04-30 Fujitsu Ltd ウェハホルダ
DE69133413D1 (de) * 1990-05-07 2004-10-21 Canon Kk Substratträger des Vakuumtyps
US5685513A (en) * 1995-05-17 1997-11-11 Nihon Biso Co., Ltd. Vacuum-suction attachment pad
JPH09266242A (ja) * 1996-03-27 1997-10-07 Kuroda Precision Ind Ltd 吸着用チャック装置
IT1299177B1 (it) * 1998-05-20 2000-02-29 Quintilio Lupi Sistema per la lavorazionme a contorno con maschera di lastre di marmo, pietra, vetro o simili
US5967578A (en) * 1998-05-29 1999-10-19 Sez North America, Inc. Tool for the contact-free support of plate-like substrates
JP2000332096A (ja) * 1999-05-21 2000-11-30 Bridgestone Corp 製品ホルダー
US6196532B1 (en) * 1999-08-27 2001-03-06 Applied Materials, Inc. 3 point vacuum chuck with non-resilient support members
JP2002043400A (ja) * 2000-07-24 2002-02-08 Hiroshi Akashi 回転支持装置
TW456582U (en) * 2000-11-17 2001-09-21 Ind Tech Res Inst Non-contact sheet clamping device
JP2003142557A (ja) * 2001-11-07 2003-05-16 Toshiba Mach Co Ltd ウエーハ搬送装置
US6672576B1 (en) * 2001-12-03 2004-01-06 United Defense Lp Apparatus for and method of utilizing vacuum in machine tool operations
JP4058482B2 (ja) * 2002-04-11 2008-03-12 レーザーテック株式会社 基板保持装置
JP4177068B2 (ja) * 2002-10-08 2008-11-05 葵精機株式会社 基板処理装置およびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI607519B (zh) * 2012-11-30 2017-12-01 尼康股份有限公司 吸引裝置、搬入方法、搬送系統及曝光裝置、以及元件製造方法

Also Published As

Publication number Publication date
JP4541824B2 (ja) 2010-09-08
JP2006114640A (ja) 2006-04-27
US20090026676A1 (en) 2009-01-29
CN101036221A (zh) 2007-09-12
WO2006040858A1 (ja) 2006-04-20
KR101098025B1 (ko) 2011-12-22
TWI417985B (zh) 2013-12-01
CN100495680C (zh) 2009-06-03
KR20070069162A (ko) 2007-07-02

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees