TW200618116A - Epitaxial crystal growing method - Google Patents

Epitaxial crystal growing method

Info

Publication number
TW200618116A
TW200618116A TW094131541A TW94131541A TW200618116A TW 200618116 A TW200618116 A TW 200618116A TW 094131541 A TW094131541 A TW 094131541A TW 94131541 A TW94131541 A TW 94131541A TW 200618116 A TW200618116 A TW 200618116A
Authority
TW
Taiwan
Prior art keywords
epitaxial crystal
growing
compound semiconductor
semiconductor substrate
growing method
Prior art date
Application number
TW094131541A
Other languages
English (en)
Other versions
TWI374505B (zh
Inventor
Manabu Kawabe
Ryuichi Hirano
Original Assignee
Nikko Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikko Materials Co Ltd filed Critical Nikko Materials Co Ltd
Publication of TW200618116A publication Critical patent/TW200618116A/zh
Application granted granted Critical
Publication of TWI374505B publication Critical patent/TWI374505B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/18Epitaxial-layer growth characterised by the substrate
    • C30B25/20Epitaxial-layer growth characterised by the substrate the substrate being of the same materials as the epitaxial layer
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/16Controlling or regulating
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • H01L21/02387Group 13/15 materials
    • H01L21/02392Phosphides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/02433Crystal orientation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02538Group 13/15 materials
    • H01L21/02543Phosphides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/0257Doping during depositing
    • H01L21/02573Conductivity type
    • H01L21/02576N-type

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Chemical Vapour Deposition (AREA)
TW094131541A 2004-09-17 2005-09-13 Epitaxial crystal growing method TW200618116A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004271297 2004-09-17

Publications (2)

Publication Number Publication Date
TW200618116A true TW200618116A (en) 2006-06-01
TWI374505B TWI374505B (zh) 2012-10-11

Family

ID=36059826

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094131541A TW200618116A (en) 2004-09-17 2005-09-13 Epitaxial crystal growing method

Country Status (6)

Country Link
US (1) US7465353B2 (zh)
EP (1) EP1791171B1 (zh)
JP (1) JP4696070B2 (zh)
KR (1) KR101092289B1 (zh)
TW (1) TW200618116A (zh)
WO (1) WO2006030565A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5859423B2 (ja) * 2010-03-02 2016-02-10 Jx日鉱日石金属株式会社 半導体エピタキシャル基板及び半導体センサ用基板の製造方法
JP6454981B2 (ja) * 2014-04-24 2019-01-23 住友電気工業株式会社 半導体積層体および受光素子

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2966494B2 (ja) 1990-08-30 1999-10-25 三洋電機株式会社 可視光半導体レーザ
JP2750331B2 (ja) 1992-04-23 1998-05-13 株式会社ジャパンエナジー エピタキシャル成長用基板およびエピタキシャル成長方法
JPH07211642A (ja) * 1994-01-12 1995-08-11 Nippon Telegr & Teleph Corp <Ntt> 化合物半導体の気相成長方法
JP3129112B2 (ja) 1994-09-08 2001-01-29 住友電気工業株式会社 化合物半導体エピタキシャル成長方法とそのためのInP基板
JP3714486B2 (ja) * 1995-01-27 2005-11-09 日本電信電話株式会社 化合物半導体の気相成長法
JPH1064828A (ja) * 1996-08-15 1998-03-06 Nippon Telegr & Teleph Corp <Ntt> 窒化物半導体結晶構造体
JP4694144B2 (ja) * 2004-05-14 2011-06-08 住友電気工業株式会社 SiC単結晶の成長方法およびそれにより成長したSiC単結晶

Also Published As

Publication number Publication date
KR20070059103A (ko) 2007-06-11
KR101092289B1 (ko) 2011-12-13
WO2006030565A1 (ja) 2006-03-23
US20070261631A1 (en) 2007-11-15
EP1791171A4 (en) 2009-10-28
EP1791171B1 (en) 2014-02-26
JPWO2006030565A1 (ja) 2008-05-08
EP1791171A1 (en) 2007-05-30
JP4696070B2 (ja) 2011-06-08
US7465353B2 (en) 2008-12-16
TWI374505B (zh) 2012-10-11

Similar Documents

Publication Publication Date Title
TW200833885A (en) Nitride semiconductor device and nitride semiconductor manufacturing method
PH12012501605A1 (en) Silicon carbide and related wide-bandgap transistors on semi insulating epitaxy
TW200943390A (en) Group III nitride semiconductor crystal growing method, group III nitride semiconductor crystal substrate fabrication method, and group III nitride semiconductor crystal substrate
TW200510252A (en) Semiconductor layer
TW200710295A (en) Nitride semiconductor substrate, and method for working nitride semiconductor substrate
TW200614379A (en) Silicon epitaxial wafer and manufacturing method for same
JP2008528420A5 (zh)
TW200746430A (en) Method of manufacturing semiconductor device, and semiconductor device
TW200506117A (en) Semi-insulating GaN and method of making the same
CN101661878B (zh) 一种双元素delta掺杂生长P型GaN基材料的方法
ATE488622T1 (de) Verringerung von karottendefekten bei der siliciumcarbid-epitaxie
WO2009066464A1 (ja) 窒化物半導体および窒化物半導体の結晶成長方法
TW200625459A (en) Method of producing an epitaxial layer on a semiconductor substrate and device produced with such a method
TW200633022A (en) Method of manufacturing an epitaxial semiconductor substrate and method of manufacturing a semiconductor device
EP1598450A4 (en) B-Ga2o3 MONOCRYSTALLINE GROWTH PROCESS, THIN FILM MONOCRYSTALLINE GROWTH METHOD, gA2O3 ELECTROLUMINESCENT DEVICE AND METHOD OF MANUFACTURING SAME
RU2008121906A (ru) СПОСОБ ВЫРАЩИВАНИЯ КРИСТАЛЛА GaN И КРИСТАЛЛИЧЕСКАЯ ПОДЛОЖКА ИЗ GaN
WO2007044322A3 (en) Conductive layer for biaxially oriented semiconductor film growth
TW200604102A (en) Gallium oxide single-crystal complex, its manufacturing method, and method for manufacturing nitride semiconductor film using the same
TW200600620A (en) Semiconductor substrate and semiconductor device, and manufacturing methods thereof
TW200603445A (en) Gallium nitride-based semiconductor stacked structure, production method thereof, and compound semiconductor and light-emitting device each using the stacked structure
TW200631104A (en) In situ formed halo region in a transistor device
TW200603267A (en) Method for making compound semiconductor and method for making semiconductor device
WO2005043582A3 (en) Method for manufacturing p-type group iii nitride semiconductor, and group iii nitride semiconductor light-emitting device
CN102881784A (zh) Cδ掺杂的p型GaN/AlGaN结构、LED外延片结构及制备方法
EP2063457A3 (en) Group III nitride semiconductor crystal growing method, group III nitride semiconductor crystal substrate fabrication method, and group III nitride semiconductor crystal substrate