TW200617400A - Circuit device inspecting electrode apparatus, method for manufacturing the same and circuit device inspecting apparatus - Google Patents

Circuit device inspecting electrode apparatus, method for manufacturing the same and circuit device inspecting apparatus

Info

Publication number
TW200617400A
TW200617400A TW094134332A TW94134332A TW200617400A TW 200617400 A TW200617400 A TW 200617400A TW 094134332 A TW094134332 A TW 094134332A TW 94134332 A TW94134332 A TW 94134332A TW 200617400 A TW200617400 A TW 200617400A
Authority
TW
Taiwan
Prior art keywords
circuit device
electrodes
device inspecting
electrode
inspecting
Prior art date
Application number
TW094134332A
Other languages
English (en)
Chinese (zh)
Inventor
Kiyoshi Kimura
Sugiro Shimoda
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200617400A publication Critical patent/TW200617400A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
TW094134332A 2004-09-30 2005-09-30 Circuit device inspecting electrode apparatus, method for manufacturing the same and circuit device inspecting apparatus TW200617400A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004285678 2004-09-30

Publications (1)

Publication Number Publication Date
TW200617400A true TW200617400A (en) 2006-06-01

Family

ID=36119001

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094134332A TW200617400A (en) 2004-09-30 2005-09-30 Circuit device inspecting electrode apparatus, method for manufacturing the same and circuit device inspecting apparatus

Country Status (2)

Country Link
TW (1) TW200617400A (ja)
WO (1) WO2006035856A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI585426B (zh) * 2013-05-06 2017-06-01 三星顯示器有限公司 電子裝置之基板及包含其之電子裝置
TWI658277B (zh) * 2014-04-24 2019-05-01 日商日本電產理德股份有限公司 電極結構體、檢測夾具及電極結構體之製造方法
CN111948567A (zh) * 2019-04-30 2020-11-17 烽火通信科技股份有限公司 一种主板上电前短路检测方法及系统

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITMI20120453A1 (it) * 2012-03-22 2013-09-23 Technoprobe Spa Struttura di connessione di tipo ibrido

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63208237A (ja) * 1987-02-25 1988-08-29 Hitachi Ltd 半導体装置の測定装置
JPH11204177A (ja) * 1998-01-07 1999-07-30 Jsr Corp シート状コネクター
JP2000241485A (ja) * 1999-02-24 2000-09-08 Jsr Corp 回路基板の電気抵抗測定装置および方法
JP4083350B2 (ja) * 1999-06-30 2008-04-30 Ｈｏｙａ株式会社 バンプ付きメンブレンリングの製造方法
JP2002062313A (ja) * 2000-08-22 2002-02-28 Toppan Printing Co Ltd 電気検査用治具及びその製造方法
JP3690796B2 (ja) * 2002-01-31 2005-08-31 株式会社コーヨーテクノス 検査冶具及びその製造方法並びに回路基板の製造方法
JP3700721B2 (ja) * 2003-01-17 2005-09-28 Ｊｓｒ株式会社 回路基板の検査装置および回路基板の検査方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI585426B (zh) * 2013-05-06 2017-06-01 三星顯示器有限公司 電子裝置之基板及包含其之電子裝置
TWI658277B (zh) * 2014-04-24 2019-05-01 日商日本電產理德股份有限公司 電極結構體、檢測夾具及電極結構體之製造方法
CN111948567A (zh) * 2019-04-30 2020-11-17 烽火通信科技股份有限公司 一种主板上电前短路检测方法及系统
CN111948567B (zh) * 2019-04-30 2023-04-25 烽火通信科技股份有限公司 一种主板上电前短路检测方法及系统

Also Published As

Publication number Publication date
WO2006035856A1 (ja) 2006-04-06

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