TW200617096A - Epoxy resin composition for encapsulating semiconductor and semiconductor device - Google Patents
Epoxy resin composition for encapsulating semiconductor and semiconductor deviceInfo
- Publication number
- TW200617096A TW200617096A TW094109534A TW94109534A TW200617096A TW 200617096 A TW200617096 A TW 200617096A TW 094109534 A TW094109534 A TW 094109534A TW 94109534 A TW94109534 A TW 94109534A TW 200617096 A TW200617096 A TW 200617096A
- Authority
- TW
- Taiwan
- Prior art keywords
- resin composition
- epoxy resin
- semiconductor
- semiconductor device
- fatty acid
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 5
- 239000003822 epoxy resin Substances 0.000 title abstract 3
- 229920000647 polyepoxide Polymers 0.000 title abstract 3
- 239000000203 mixture Substances 0.000 title abstract 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 abstract 6
- 229910052799 carbon Inorganic materials 0.000 abstract 1
- 125000004432 carbon atom Chemical group C* 0.000 abstract 1
- 238000006482 condensation reaction Methods 0.000 abstract 1
- 230000018044 dehydration Effects 0.000 abstract 1
- 238000006297 dehydration reaction Methods 0.000 abstract 1
- 230000001747 exhibiting effect Effects 0.000 abstract 1
- 239000000194 fatty acid Substances 0.000 abstract 1
- 229960001545 hydrotalcite Drugs 0.000 abstract 1
- 229910001701 hydrotalcite Inorganic materials 0.000 abstract 1
- -1 hydrotalcite compound Chemical class 0.000 abstract 1
- 239000011256 inorganic filler Substances 0.000 abstract 1
- 229910003475 inorganic filler Inorganic materials 0.000 abstract 1
- 239000005011 phenolic resin Substances 0.000 abstract 1
- 239000011342 resin composition Substances 0.000 abstract 1
- 150000004671 saturated fatty acids Chemical class 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/101—Esters; Ether-esters of monocarboxylic acids
- C08K5/103—Esters; Ether-esters of monocarboxylic acids with polyalcohols
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004100256 | 2004-03-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200617096A true TW200617096A (en) | 2006-06-01 |
| TWI404760B TWI404760B (zh) | 2013-08-11 |
Family
ID=35125026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094109534A TWI404760B (zh) | 2004-03-30 | 2005-03-28 | 半導體密封用環氧樹脂組成物及半導體裝置 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7723856B2 (zh) |
| JP (1) | JP4788916B2 (zh) |
| KR (1) | KR101118435B1 (zh) |
| CN (1) | CN1934190B (zh) |
| MY (1) | MY145438A (zh) |
| TW (1) | TWI404760B (zh) |
| WO (1) | WO2005097892A1 (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI403552B (zh) * | 2006-10-06 | 2013-08-01 | Sumitomo Bakelite Co | 半導體密封用環氧樹脂組成物及半導體裝置 |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5124808B2 (ja) * | 2005-08-05 | 2013-01-23 | 信越化学工業株式会社 | エポキシ樹脂組成物及び半導体装置 |
| JP4956982B2 (ja) * | 2005-12-13 | 2012-06-20 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
| JP5070972B2 (ja) * | 2007-07-26 | 2012-11-14 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物および半導体装置 |
| KR100949835B1 (ko) * | 2008-02-20 | 2010-03-29 | 주식회사 두본 | 우수한 내열성을 갖는 하이드로탈사이트 및 그의 제조방법 |
| JP5187440B2 (ja) * | 2009-04-03 | 2013-04-24 | 株式会社島津製作所 | 放射線検出器、およびそれを備えた放射線撮影装置 |
| JP5272199B2 (ja) * | 2010-11-10 | 2013-08-28 | 日立化成株式会社 | 半導体装置の製法 |
| CN102585845B (zh) * | 2010-12-31 | 2014-04-09 | 梁清源 | 一种无机矿物复合阻燃剂及其制备方法 |
| JP6183061B2 (ja) * | 2013-08-27 | 2017-08-23 | 日立化成株式会社 | 半導体封止用エポキシ樹脂組成物及びそれを用いた樹脂封止型半導体装置 |
| EP3456781A4 (en) * | 2016-05-30 | 2020-02-19 | Hitachi Chemical Company, Ltd. | GASKET COMPOSITION AND SEMICONDUCTOR COMPONENT |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997024402A1 (fr) * | 1995-12-28 | 1997-07-10 | Toray Industries, Inc. | Composition de resine epoxy |
| DE69803267T2 (de) * | 1997-07-02 | 2002-05-16 | Sumitomo Bakelite Co. Ltd., Tokio/Tokyo | Epoxidharzzusammensetzungen für die versiegelung von halbleitern und halbleitervorrichtung |
| JP2002053734A (ja) * | 2000-08-08 | 2002-02-19 | Nitto Denko Corp | 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置 |
| JP4411760B2 (ja) * | 2000-09-06 | 2010-02-10 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
| JP2002161193A (ja) * | 2000-11-27 | 2002-06-04 | Sumitomo Bakelite Co Ltd | 金型離型回復樹脂組成物 |
| JP4770024B2 (ja) * | 2001-01-17 | 2011-09-07 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
| JP2002220511A (ja) | 2001-01-25 | 2002-08-09 | Matsushita Electric Works Ltd | 封止用エポキシ樹脂組成物及び半導体装置 |
-
2005
- 2005-03-10 JP JP2006511958A patent/JP4788916B2/ja active Active
- 2005-03-10 US US10/594,322 patent/US7723856B2/en not_active Expired - Fee Related
- 2005-03-10 CN CN2005800090030A patent/CN1934190B/zh active Active
- 2005-03-10 WO PCT/JP2005/004705 patent/WO2005097892A1/ja active Application Filing
- 2005-03-10 KR KR1020067019465A patent/KR101118435B1/ko active IP Right Grant
- 2005-03-28 TW TW094109534A patent/TWI404760B/zh not_active IP Right Cessation
- 2005-03-30 MY MYPI20051424A patent/MY145438A/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI403552B (zh) * | 2006-10-06 | 2013-08-01 | Sumitomo Bakelite Co | 半導體密封用環氧樹脂組成物及半導體裝置 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI404760B (zh) | 2013-08-11 |
| CN1934190A (zh) | 2007-03-21 |
| KR20070012654A (ko) | 2007-01-26 |
| WO2005097892A1 (ja) | 2005-10-20 |
| MY145438A (en) | 2012-02-15 |
| KR101118435B1 (ko) | 2012-03-06 |
| CN1934190B (zh) | 2010-11-24 |
| JP4788916B2 (ja) | 2011-10-05 |
| US20070216040A1 (en) | 2007-09-20 |
| US7723856B2 (en) | 2010-05-25 |
| JPWO2005097892A1 (ja) | 2008-02-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |