TW200707673A - Semiconductor encapsulating epoxy resin composition and semiconductor device - Google Patents

Semiconductor encapsulating epoxy resin composition and semiconductor device

Info

Publication number
TW200707673A
TW200707673A TW095114547A TW95114547A TW200707673A TW 200707673 A TW200707673 A TW 200707673A TW 095114547 A TW095114547 A TW 095114547A TW 95114547 A TW95114547 A TW 95114547A TW 200707673 A TW200707673 A TW 200707673A
Authority
TW
Taiwan
Prior art keywords
epoxy resin
weight
parts
resin composition
semiconductor
Prior art date
Application number
TW095114547A
Other languages
Chinese (zh)
Other versions
TWI415230B (en
Inventor
Shoichi Osada
Yasuo Kimura
Eiichi Asano
Toshio Shiobara
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200707673A publication Critical patent/TW200707673A/en
Application granted granted Critical
Publication of TWI415230B publication Critical patent/TWI415230B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/221—Oxides; Hydroxides of metals of rare earth metal
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/66—Substances characterised by their function in the composition
    • C08L2666/72—Fillers; Inorganic pigments; Reinforcing additives

Abstract

An epoxy resin composition comprising (A) a naphthalene type epoxy resin in which 35-85 parts by weight of 1,1-bis(2-glycidyloxy-1-naphthyl)alkane and 1-35 parts by weight of 1,1-bis(2,7-diglycidyloxy-1-naphthyl)alkane are included per 100 parts by weight of the resin, (B) a curing agent in the form of a naphthalene type phenolic resin, (C) an inorganic filler, and (D) a rare earth oxide or hydrotalcite compound is best suited for semiconductor encapsulation because it has good flow, a low coefficient of linear expansion, a high Tg, minimal moisture absorption, and crack resistance upon lead-free soldering.
TW095114547A 2005-04-25 2006-04-24 Epoxy resin composition for semiconductor sealing and semiconductor device TWI415230B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005125897 2005-04-25
JP2006105155A JP4844725B2 (en) 2005-04-25 2006-04-06 Epoxy resin composition for semiconductor encapsulation and semiconductor device

Publications (2)

Publication Number Publication Date
TW200707673A true TW200707673A (en) 2007-02-16
TWI415230B TWI415230B (en) 2013-11-11

Family

ID=37550383

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095114547A TWI415230B (en) 2005-04-25 2006-04-24 Epoxy resin composition for semiconductor sealing and semiconductor device

Country Status (3)

Country Link
JP (1) JP4844725B2 (en)
KR (1) KR101204196B1 (en)
TW (1) TWI415230B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070029682A1 (en) * 2005-08-05 2007-02-08 Shin-Etsu Chemical Co., Ltd. Epoxy resin composition and semiconductor device
JP2009102635A (en) * 2007-10-04 2009-05-14 Hitachi Chem Co Ltd Epoxy resin molding material for sealing, and electronic component device having element sealed with the epoxy resin molding material for sealing
JP5187101B2 (en) * 2008-09-26 2013-04-24 住友ベークライト株式会社 Epoxy resin composition and semiconductor device
JP5904078B2 (en) * 2011-10-07 2016-04-13 信越化学工業株式会社 Prepreg, metal-clad laminate, printed wiring board, and semiconductor device
JP7043861B2 (en) * 2018-02-05 2022-03-30 Dic株式会社 Resist material
KR102483006B1 (en) * 2020-05-14 2022-12-29 삼성에스디아이 주식회사 Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated using the same

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3137202B2 (en) * 1990-10-30 2001-02-19 大日本インキ化学工業株式会社 Epoxy resin, method for producing the same, and epoxy resin composition
US5302672A (en) * 1991-02-27 1994-04-12 Dainippon Ink And Chemicals, Inc. 2,7-dihydroxynaphthalene based epoxy resin, intermediate thereof, processes for producing them, and epoxy resin composition
JPH04300914A (en) * 1991-03-29 1992-10-23 Shin Etsu Chem Co Ltd Epoxy resin composition and semiconductor device
US5358980A (en) * 1991-10-03 1994-10-25 Shin-Etsu Chemical Company, Limited Naphthol novolac epoxy resin compositions and semiconductor devices encapsulated therewith
JP2768088B2 (en) * 1991-10-03 1998-06-25 信越化学工業株式会社 Thermosetting resin composition and semiconductor device
JP2591392B2 (en) * 1991-11-26 1997-03-19 信越化学工業株式会社 Thermosetting resin composition and semiconductor device
JP3049898B2 (en) * 1991-12-25 2000-06-05 日立化成工業株式会社 Epoxy resin molding material for sealing electronic parts and IC package using the same
JP3204461B2 (en) * 1992-03-13 2001-09-04 日本化薬株式会社 Epoxy resin composition and cured product thereof
JP2705527B2 (en) * 1993-05-25 1998-01-28 松下電工株式会社 Epoxy resin composition
JP3022135B2 (en) * 1994-01-26 2000-03-15 信越化学工業株式会社 Epoxy resin composition
EP0749996B1 (en) * 1995-01-05 2004-08-18 Sumitomo Bakelite Co., Ltd. Epoxy resin composition
JP4004160B2 (en) * 1998-09-21 2007-11-07 協和化学工業株式会社 Hydrotalcite compounds with low uranium (U) content and process for producing the same
JP3537082B2 (en) * 1999-02-09 2004-06-14 住友ベークライト株式会社 Epoxy resin composition and semiconductor device
JP2002053734A (en) * 2000-08-08 2002-02-19 Nitto Denko Corp Epoxy resin composition for sealing semiconductor, and semiconductor device made by using it
US6794031B2 (en) * 2001-09-28 2004-09-21 Ube Industries, Ltd. Cover-lay film and printed circuit board having the same
DE10224887A1 (en) * 2002-06-05 2003-12-18 Bayer Ag Molding composition, useful for the production of switches, plug moldings, spray bodies and fuse boxes contains red phosphorous, zinc borate, talc and a lanthanide and/or lanthanide compound
JP4661033B2 (en) * 2003-06-27 2011-03-30 Ｄｉｃ株式会社 Epoxy resin composition, semiconductor sealing material, and semiconductor device

Also Published As

Publication number Publication date
KR101204196B1 (en) 2012-11-26
KR20060111851A (en) 2006-10-30
JP2006328362A (en) 2006-12-07
TWI415230B (en) 2013-11-11
JP4844725B2 (en) 2011-12-28

Similar Documents

Publication Publication Date Title
SG160407A1 (en) Epoxy resin composition and semiconductor device
TW200707673A (en) Semiconductor encapsulating epoxy resin composition and semiconductor device
MY144740A (en) Epoxy resin composition and semiconductor device
MY142243A (en) Curing accelerator, epoxy resin composition, and semiconductor device
MY148463A (en) Epoxy resin composition and semiconductor device
SG158878A1 (en) Epoxy resin composition, method of rendering the same latent, and semiconductor device
EP1705199A3 (en) Semiconductor encapsulating epoxy resin composition and semiconductor device
MY144685A (en) Epoxy resin composition for semiconductor encapsulating use, and semiconductor device
TW200940672A (en) Adhesive film composition for semiconductor assembly, adhesive film, dicing die bonding film, device package, and associated methods
MY151958A (en) Resin composition and semiconductor device produced by using the same.
DE60336302D1 (en) BENZOXAZINE CONTAINING NETWORKING ABN
TW200716707A (en) Epoxy resin composition and semiconductor
TW200730577A (en) Weather-resistant epoxy resin system
TW200631981A (en) The novel curable resin, the method of manufacturing the same, the epoxy resin composition and the electronic parts/devices
SG126882A1 (en) Die attach adhesives with improved stress performance
MY144739A (en) Epoxy resin composition for encapsulating semiconductor and semiconductor device
ATE365758T1 (en) NON-FLOWING UNDERFILL COMPOSITION
TW200517438A (en) Epoxy resin composition and semiconductor device
MY145438A (en) Epoxy resin composition for encapsulation of semiconductors and semiconductor devices
MY141745A (en) Epoxy resin composition for semiconductor encapsulating and semiconductor device
TW200420658A (en) Epoxy resin composition and semiconductor device
TW200801064A (en) Semiconductor encapsulating epoxy resin composition and semiconductor device
MY137564A (en) Resin composition for encapsulating semiconductor chip and semiconductor device therewith
MY142389A (en) Biphenylaralkyl epoxy and phenolic resins
MY162107A (en) Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same