TW200616746A - Method of attaching a solder element to a contact and the contact assembly formed thereby - Google Patents

Method of attaching a solder element to a contact and the contact assembly formed thereby

Info

Publication number
TW200616746A
TW200616746A TW094131832A TW94131832A TW200616746A TW 200616746 A TW200616746 A TW 200616746A TW 094131832 A TW094131832 A TW 094131832A TW 94131832 A TW94131832 A TW 94131832A TW 200616746 A TW200616746 A TW 200616746A
Authority
TW
Taiwan
Prior art keywords
contact
solder element
attaching
contact assembly
assembly formed
Prior art date
Application number
TW094131832A
Other languages
English (en)
Other versions
TWI326235B (en
Inventor
Kirk B Peloza
Richard A Faje
Ronald C Hodge
Jon S Gould
Original Assignee
Molex Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex Inc filed Critical Molex Inc
Publication of TW200616746A publication Critical patent/TW200616746A/zh
Application granted granted Critical
Publication of TWI326235B publication Critical patent/TWI326235B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0235—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for applying solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Multi-Conductor Connections (AREA)
TW094131832A 2004-09-15 2005-09-15 Method of attaching a solder element to a contact and the contact assembly formed thereby TWI326235B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US61006904P 2004-09-15 2004-09-15

Publications (2)

Publication Number Publication Date
TW200616746A true TW200616746A (en) 2006-06-01
TWI326235B TWI326235B (en) 2010-06-21

Family

ID=35453393

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094131832A TWI326235B (en) 2004-09-15 2005-09-15 Method of attaching a solder element to a contact and the contact assembly formed thereby

Country Status (5)

Country Link
US (1) US7695329B2 (zh)
JP (1) JP4576431B2 (zh)
CN (1) CN100596260C (zh)
TW (1) TWI326235B (zh)
WO (1) WO2006032035A1 (zh)

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JP4894464B2 (ja) * 2006-11-01 2012-03-14 山一電機株式会社 半田付き接触子及びその製造方法
US20090239419A1 (en) * 2008-03-18 2009-09-24 Chamuel Steve R Connector header with wire wrap pins
US8425239B2 (en) 2009-07-09 2013-04-23 Tyco Electronics Corporation Electrical connector for a solar module assembly
DE102009040830A1 (de) * 2009-09-13 2011-03-17 Few Fahrzeugelektrik Werk Gmbh & Co. Kg Elektrischer Kontakt sowie dessen Herstellungsverfahren
US7837522B1 (en) * 2009-11-12 2010-11-23 Samtec, Inc. Electrical contacts with solder members and methods of attaching solder members to electrical contacts
US8202101B2 (en) 2010-08-05 2012-06-19 Hon Hai Precision Ind. Co., Ltd. Electrical connector with improved pedestal for mounting a fusible element and method for making the same
CN102064455A (zh) * 2010-11-03 2011-05-18 东莞骅国电子有限公司 电连接器的制造方法
US8827733B2 (en) * 2011-03-15 2014-09-09 Omron Corporation Connecting terminal with a fixed portion and a contact
CN202189913U (zh) * 2011-03-29 2012-04-11 番禺得意精密电子工业有限公司 电连接器
CN102510676B (zh) * 2011-10-20 2013-11-27 东莞生益电子有限公司 Pcb板于cam制作中泪滴的添加方法
CN103682933B (zh) * 2012-09-14 2016-01-06 庆良电子股份有限公司 焊料件与焊接端子的挂设方法、其挂设结构及连接器
DE102012110217B4 (de) * 2012-10-25 2016-03-24 Ims Connector Systems Gmbh Koaxialkabelbuchse mit Lotdepot und Verfahren zur Herstellung
US20140174823A1 (en) * 2012-12-21 2014-06-26 Chief Land Electronic Co., Ltd. Method for sleeve retaining a solder material onto a terminal unit
US9190794B2 (en) * 2012-12-21 2015-11-17 Chief Land Electronic Co., Ltd. Method of retaining a solder material to a solder terminal and the solder assembly formed thereby
CN106104924B (zh) * 2013-12-19 2019-11-08 瑞典爱立信有限公司 连接销、转换器组件及用于制造连接销的方法
US9419354B2 (en) 2014-02-26 2016-08-16 Samtec, Inc. Electrical contacts, fusible members, and methods of attaching electrical contacts to substrates
DE102015114129A1 (de) * 2015-08-26 2017-03-02 Pac Tech - Packaging Technologies Gmbh Vorrichtung zur Entfernung eines Prüfkontakts einer Prüfkontaktanordnung
CN107565234B (zh) * 2017-07-24 2019-08-30 番禺得意精密电子工业有限公司 电连接器
US10505305B2 (en) * 2017-10-24 2019-12-10 Fu Ding Precision Component (Shen Zhen) Co., Ltd. Securement of solder unit upon contact
CN113422225A (zh) * 2021-06-25 2021-09-21 中航光电科技股份有限公司 预置焊料端子、连接器及预置焊料固定方法

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Also Published As

Publication number Publication date
WO2006032035A1 (en) 2006-03-23
JP2008513966A (ja) 2008-05-01
CN101019475A (zh) 2007-08-15
JP4576431B2 (ja) 2010-11-10
CN100596260C (zh) 2010-03-24
US7695329B2 (en) 2010-04-13
TWI326235B (en) 2010-06-21
US20080108255A1 (en) 2008-05-08

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