TW200613090A - Chemical mechanical polishing pad - Google Patents

Chemical mechanical polishing pad

Info

Publication number
TW200613090A
TW200613090A TW094116895A TW94116895A TW200613090A TW 200613090 A TW200613090 A TW 200613090A TW 094116895 A TW094116895 A TW 094116895A TW 94116895 A TW94116895 A TW 94116895A TW 200613090 A TW200613090 A TW 200613090A
Authority
TW
Taiwan
Prior art keywords
polishing
polishing pad
chemical mechanical
mechanical polishing
depth
Prior art date
Application number
TW094116895A
Other languages
English (en)
Chinese (zh)
Inventor
Kouji Kawahara
Kou Hasegawa
Fujio Sakurai
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200613090A publication Critical patent/TW200613090A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW094116895A 2004-05-24 2005-05-24 Chemical mechanical polishing pad TW200613090A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004153335A JP2005340271A (ja) 2004-05-24 2004-05-24 化学機械研磨用パッド

Publications (1)

Publication Number Publication Date
TW200613090A true TW200613090A (en) 2006-05-01

Family

ID=34936757

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094116895A TW200613090A (en) 2004-05-24 2005-05-24 Chemical mechanical polishing pad

Country Status (6)

Country Link
US (1) US7097550B2 (enExample)
EP (1) EP1600260A1 (enExample)
JP (1) JP2005340271A (enExample)
KR (1) KR20060048061A (enExample)
CN (1) CN1701919A (enExample)
TW (1) TW200613090A (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110092988A1 (en) * 2002-10-29 2011-04-21 Microfabrica Inc. Microdevices for Tissue Approximation and Retention, Methods for Using, and Methods for Making
TWI455795B (zh) * 2007-10-18 2014-10-11 Iv Technologies Co Ltd 研磨墊及研磨方法
US8052507B2 (en) * 2007-11-20 2011-11-08 Praxair Technology, Inc. Damping polyurethane CMP pads with microfillers
US8398462B2 (en) 2008-02-21 2013-03-19 Chien-Min Sung CMP pads and method of creating voids in-situ therein
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
TWI409137B (zh) * 2008-06-19 2013-09-21 Bestac Advanced Material Co Ltd 研磨墊及其微型結構形成方法
TWM352127U (en) * 2008-08-29 2009-03-01 Bestac Advanced Material Co Ltd Polishing pad
TWM352126U (en) * 2008-10-23 2009-03-01 Bestac Advanced Material Co Ltd Polishing pad
TWI510328B (zh) * 2010-05-03 2015-12-01 Iv Technologies Co Ltd 基底層、包括此基底層的研磨墊及研磨方法
US20120009847A1 (en) * 2010-07-06 2012-01-12 Applied Materials, Inc. Closed-loop control of cmp slurry flow
JP2012056021A (ja) * 2010-09-09 2012-03-22 Jsr Corp 化学機械研磨パッドおよびそれを用いた化学機械研磨方法
US9211628B2 (en) * 2011-01-26 2015-12-15 Nexplanar Corporation Polishing pad with concentric or approximately concentric polygon groove pattern
CN103666276A (zh) * 2012-09-25 2014-03-26 安集微电子（上海）有限公司 一种化学机械抛光液
CN104745092A (zh) * 2013-12-26 2015-07-01 安集微电子（上海）有限公司 一种应用于sti领域的化学机械抛光液及其使用方法
US9649741B2 (en) * 2014-07-07 2017-05-16 Jh Rhodes Company, Inc. Polishing material for polishing hard surfaces, media including the material, and methods of forming and using same
US9748090B2 (en) * 2015-01-22 2017-08-29 Toshiba Memory Corporation Semiconductor manufacturing apparatus and manufacturing method of semiconductor device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5650039A (en) 1994-03-02 1997-07-22 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved slurry distribution
JPH08216029A (ja) 1995-02-07 1996-08-27 Daiki:Kk 精密研磨シート
US5921855A (en) 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
WO2000059680A1 (en) * 1999-03-30 2000-10-12 Nikon Corporation Polishing body, polisher, polishing method, and method for producing semiconductor device
US6869343B2 (en) 2001-12-19 2005-03-22 Toho Engineering Kabushiki Kaisha Turning tool for grooving polishing pad, apparatus and method of producing polishing pad using the tool, and polishing pad produced by using the tool
US6736709B1 (en) * 2000-05-27 2004-05-18 Rodel Holdings, Inc. Grooved polishing pads for chemical mechanical planarization
JP3925041B2 (ja) * 2000-05-31 2007-06-06 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド
US6641471B1 (en) * 2000-09-19 2003-11-04 Rodel Holdings, Inc Polishing pad having an advantageous micro-texture and methods relating thereto
TWI228768B (en) 2002-08-08 2005-03-01 Jsr Corp Processing method of polishing pad for semiconductor wafer and polishing pad for semiconductor wafer
JP4039214B2 (ja) 2002-11-05 2008-01-30 Ｊｓｒ株式会社 研磨パッド
US20040224622A1 (en) 2003-04-15 2004-11-11 Jsr Corporation Polishing pad and production method thereof
JP4292025B2 (ja) 2003-05-23 2009-07-08 Ｊｓｒ株式会社 研磨パッド
DE602005006326T2 (de) 2004-02-05 2009-07-09 Jsr Corp. Chemisch-mechanisches Polierkissen und Polierverfahren

Also Published As

Publication number Publication date
CN1701919A (zh) 2005-11-30
US7097550B2 (en) 2006-08-29
EP1600260A1 (en) 2005-11-30
US20050260942A1 (en) 2005-11-24
KR20060048061A (ko) 2006-05-18
JP2005340271A (ja) 2005-12-08

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