WO2012033287A3 - Cmp pad conditioner and method for manufacturing the same - Google Patents

Cmp pad conditioner and method for manufacturing the same Download PDF

Info

Publication number
WO2012033287A3
WO2012033287A3 PCT/KR2011/005871 KR2011005871W WO2012033287A3 WO 2012033287 A3 WO2012033287 A3 WO 2012033287A3 KR 2011005871 W KR2011005871 W KR 2011005871W WO 2012033287 A3 WO2012033287 A3 WO 2012033287A3
Authority
WO
WIPO (PCT)
Prior art keywords
protrusions
pad conditioner
manufacturing
same
cmp pad
Prior art date
Application number
PCT/KR2011/005871
Other languages
French (fr)
Other versions
WO2012033287A9 (en
WO2012033287A2 (en
Inventor
Byung Ki Kim
Jun Ho Song
Youn Woong Jung
Jeong Kim
Mun Seak Park
Kee Jeong Cheong
Shin Kyung Kim
Original Assignee
Shinhan Diamond Ind. Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinhan Diamond Ind. Co., Ltd. filed Critical Shinhan Diamond Ind. Co., Ltd.
Priority to US13/822,275 priority Critical patent/US20130225052A1/en
Publication of WO2012033287A2 publication Critical patent/WO2012033287A2/en
Publication of WO2012033287A3 publication Critical patent/WO2012033287A3/en
Publication of WO2012033287A9 publication Critical patent/WO2012033287A9/en
Priority to US14/876,605 priority patent/US20160121454A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Abstract

Provided is a chemical mechanical polishing (CMP) pad conditioner including: a substrate including a plurality of protrusions formed on at least one surface thereof and made of ceramic or hard metal alloy, the plurality of protrusions being formed through laser processing so as not to have angled edges on an upper end and an inclined side thereof; and a diamond thin film deposited so as to cover the plurality of protrusions, wherein the diamond thin film includes a rough polishing surface on which micro protrusions having a size of several ㎛ are formed.
PCT/KR2011/005871 2010-09-10 2011-08-11 Cmp pad conditioner and method for manufacturing the same WO2012033287A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US13/822,275 US20130225052A1 (en) 2010-09-10 2011-08-11 "cmp pad conditioner and method for manufacturing the same"
US14/876,605 US20160121454A1 (en) 2010-09-10 2015-10-06 Cmp pad conditioner and method for manufacturing the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0088752 2010-09-10
KR20100088752A KR101161015B1 (en) 2010-09-10 2010-09-10 Cmp pad conditioner and its manufacturing method

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US13/822,275 A-371-Of-International US20130225052A1 (en) 2010-09-10 2011-08-11 "cmp pad conditioner and method for manufacturing the same"
US14/876,605 Division US20160121454A1 (en) 2010-09-10 2015-10-06 Cmp pad conditioner and method for manufacturing the same

Publications (3)

Publication Number Publication Date
WO2012033287A2 WO2012033287A2 (en) 2012-03-15
WO2012033287A3 true WO2012033287A3 (en) 2012-05-03
WO2012033287A9 WO2012033287A9 (en) 2012-06-28

Family

ID=45811034

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/005871 WO2012033287A2 (en) 2010-09-10 2011-08-11 Cmp pad conditioner and method for manufacturing the same

Country Status (3)

Country Link
US (2) US20130225052A1 (en)
KR (1) KR101161015B1 (en)
WO (1) WO2012033287A2 (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9409280B2 (en) * 1997-04-04 2016-08-09 Chien-Min Sung Brazed diamond tools and methods for making the same
US9238207B2 (en) * 1997-04-04 2016-01-19 Chien-Min Sung Brazed diamond tools and methods for making the same
US9199357B2 (en) 1997-04-04 2015-12-01 Chien-Min Sung Brazed diamond tools and methods for making the same
US9868100B2 (en) 1997-04-04 2018-01-16 Chien-Min Sung Brazed diamond tools and methods for making the same
US9221154B2 (en) 1997-04-04 2015-12-29 Chien-Min Sung Diamond tools and methods for making the same
US9463552B2 (en) 1997-04-04 2016-10-11 Chien-Min Sung Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods
US8393934B2 (en) 2006-11-16 2013-03-12 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US9724802B2 (en) 2005-05-16 2017-08-08 Chien-Min Sung CMP pad dressers having leveled tips and associated methods
US8678878B2 (en) 2009-09-29 2014-03-25 Chien-Min Sung System for evaluating and/or improving performance of a CMP pad dresser
US9138862B2 (en) 2011-05-23 2015-09-22 Chien-Min Sung CMP pad dresser having leveled tips and associated methods
TWI487019B (en) 2011-05-23 2015-06-01 Cmp pad dresser having leveled tips and associated methods
SG11201407232YA (en) * 2012-05-04 2014-12-30 Entegris Inc Cmp conditioner pads with superabrasive grit enhancement
TWI546156B (en) * 2013-04-08 2016-08-21 Polishing pad dresser structure and its making method
CN106336813A (en) * 2016-08-24 2017-01-18 安徽正田能源科技有限公司 Silicon wafer scratch polishing agent and preparation method thereof
KR102581481B1 (en) 2016-10-18 2023-09-21 삼성전자주식회사 Method of chemical mechanical polishing, method of manufacturing semiconductor device and apparatus of manufacturing semiconductor
KR102608124B1 (en) * 2017-08-04 2023-11-29 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Microreplicated polished surface with improved coplanarity
JP7273796B2 (en) * 2017-08-25 2023-05-15 スリーエム イノベイティブ プロパティズ カンパニー surface protrusion polishing pad
WO2019133724A1 (en) 2017-12-28 2019-07-04 Sinmat, Inc. Cmp polishing pad conditioner
US11331767B2 (en) * 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
KR102466715B1 (en) 2020-10-13 2022-11-14 김영환 Cmp pad conditioner and manufacturing method thereof
CN116652825B (en) * 2023-07-24 2023-11-10 北京寰宇晶科科技有限公司 Diamond CMP polishing pad trimmer and preparation method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030036341A1 (en) * 1999-10-12 2003-02-20 Hunatech Co., Ltd. Conditioner for polishing pad and method for manufacturing the same
JP2006026769A (en) * 2004-07-14 2006-02-02 Noritake Super Abrasive:Kk Cmp pad conditioner
JP2006341332A (en) * 2005-06-08 2006-12-21 Allied Material Corp Pad conditioner
US20090090066A1 (en) * 2007-10-09 2009-04-09 Chia-Pei Chen Grinding tool and manufacturing method thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9703571D0 (en) * 1997-02-20 1997-04-09 De Beers Ind Diamond Diamond-containing body
JP3656475B2 (en) 1999-09-01 2005-06-08 三菱マテリアル株式会社 CMP conditioner
US6821189B1 (en) * 2000-10-13 2004-11-23 3M Innovative Properties Company Abrasive article comprising a structured diamond-like carbon coating and method of using same to mechanically treat a substrate
US20050025973A1 (en) * 2003-07-25 2005-02-03 Slutz David E. CVD diamond-coated composite substrate containing a carbide-forming material and ceramic phases and method for making same
KR101211138B1 (en) * 2011-03-07 2012-12-11 이화다이아몬드공업 주식회사 Conditioner for soft pad and method for producing the same
SG11201407232YA (en) * 2012-05-04 2014-12-30 Entegris Inc Cmp conditioner pads with superabrasive grit enhancement

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030036341A1 (en) * 1999-10-12 2003-02-20 Hunatech Co., Ltd. Conditioner for polishing pad and method for manufacturing the same
JP2006026769A (en) * 2004-07-14 2006-02-02 Noritake Super Abrasive:Kk Cmp pad conditioner
JP2006341332A (en) * 2005-06-08 2006-12-21 Allied Material Corp Pad conditioner
US20090090066A1 (en) * 2007-10-09 2009-04-09 Chia-Pei Chen Grinding tool and manufacturing method thereof

Also Published As

Publication number Publication date
US20130225052A1 (en) 2013-08-29
WO2012033287A9 (en) 2012-06-28
WO2012033287A2 (en) 2012-03-15
US20160121454A1 (en) 2016-05-05
KR20120026709A (en) 2012-03-20
KR101161015B1 (en) 2012-07-02

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