TW200612199A - Photosensitive composition, pattern-forming method and permanent pattern - Google Patents

Photosensitive composition, pattern-forming method and permanent pattern

Info

Publication number
TW200612199A
TW200612199A TW094119575A TW94119575A TW200612199A TW 200612199 A TW200612199 A TW 200612199A TW 094119575 A TW094119575 A TW 094119575A TW 94119575 A TW94119575 A TW 94119575A TW 200612199 A TW200612199 A TW 200612199A
Authority
TW
Taiwan
Prior art keywords
pattern
photosensitive composition
forming method
following formula
carboxyl group
Prior art date
Application number
TW094119575A
Other languages
English (en)
Inventor
Masayuki Iwasaki
Original Assignee
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Photo Film Co Ltd filed Critical Fuji Photo Film Co Ltd
Publication of TW200612199A publication Critical patent/TW200612199A/zh

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/035Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyurethanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08Processes
    • C08G18/0804Manufacture of polymers containing ionic or ionogenic groups
    • C08G18/0819Manufacture of polymers containing ionic or ionogenic groups containing anionic or anionogenic groups
    • C08G18/0823Manufacture of polymers containing ionic or ionogenic groups containing anionic or anionogenic groups containing carboxylate salt groups or groups forming them
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04Polyurethanes
    • C09D175/14Polyurethanes having carbon-to-carbon unsaturated bonds
    • C09D175/16Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/285Permanent coating compositions
    • H05K3/287Photosensitive compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Materials For Photolithography (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW094119575A 2004-06-15 2005-06-14 Photosensitive composition, pattern-forming method and permanent pattern TW200612199A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004177185 2004-06-15

Publications (1)

Publication Number Publication Date
TW200612199A true TW200612199A (en) 2006-04-16

Family

ID=35509861

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094119575A TW200612199A (en) 2004-06-15 2005-06-14 Photosensitive composition, pattern-forming method and permanent pattern

Country Status (5)

Country Link
JP (1) JPWO2005124462A1 (zh)
KR (1) KR20070062965A (zh)
CN (1) CN101116035A (zh)
TW (1) TW200612199A (zh)
WO (1) WO2005124462A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5099851B2 (ja) * 2009-04-27 2012-12-19 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP2011215392A (ja) * 2010-03-31 2011-10-27 Fujifilm Corp 感光性組成物、並びに、感光性積層体、永久パターン形成方法、及びプリント基板
CN103631097B (zh) * 2013-12-11 2016-06-08 中国科学院光电技术研究所 一种光刻式的3d打印机
CN105793778B (zh) * 2013-12-26 2021-02-09 旭化成株式会社 感光性树脂组合物及感光性树脂层叠体
JP6624808B2 (ja) 2014-07-25 2019-12-25 キヤノン株式会社 光硬化性組成物、これを用いた硬化物パターンの製造方法、光学部品の製造方法、回路基板の製造方法
JP6324363B2 (ja) 2014-12-19 2018-05-16 キヤノン株式会社 インプリント用光硬化性組成物、これを用いた膜の製造方法、光学部品の製造方法、回路基板の製造方法、電子部品の製造方法
CN105068384B (zh) * 2015-08-12 2017-08-15 杭州思看科技有限公司 一种手持激光三维扫描仪的激光投影器曝光时间控制方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07120042B2 (ja) * 1987-05-21 1995-12-20 富士写真フイルム株式会社 感光性組成物
DE3841025A1 (de) * 1988-12-06 1990-06-07 Hoechst Ag Durch strahlung polymerisierbares gemisch und daraus hergestelltes aufzeichnungsmaterial
JP2001500628A (ja) * 1996-02-28 2001-01-16 ケニス シー ジョンソン マイクロリトグラフィ用マイクロレンズスキャナ及び広フィールド共焦顕微鏡
JP4057721B2 (ja) * 1998-10-28 2008-03-05 日華化学株式会社 感光性樹脂組成物及び回路基板用ソルダーフォトレジストインキ組成物
JP2002338652A (ja) * 2001-05-17 2002-11-27 Nippon Kayaku Co Ltd アルカリ水溶液可溶性ウレタン化エポキシカルボキシレート化合物及びそれを用いた感光性樹脂組成物並びにその硬化物
JP3523857B2 (ja) * 2001-12-25 2004-04-26 昭和高分子株式会社 感光性樹脂および感光性レジストインキ組成物
JP2004006440A (ja) * 2002-04-10 2004-01-08 Fuji Photo Film Co Ltd レーザ装置、露光ヘッド、及び露光装置
JP4279053B2 (ja) * 2002-06-07 2009-06-17 富士フイルム株式会社 露光ヘッド及び露光装置

Also Published As

Publication number Publication date
JPWO2005124462A1 (ja) 2008-04-17
CN101116035A (zh) 2008-01-30
WO2005124462A1 (ja) 2005-12-29
KR20070062965A (ko) 2007-06-18

Similar Documents

Publication Publication Date Title
TW200612199A (en) Photosensitive composition, pattern-forming method and permanent pattern
JP3254572B2 (ja) 光重合性熱硬化性樹脂組成物
JP6047666B2 (ja) ドライフィルムソルダーレジストの製造方法と、これに用いられるフィルム積層体
TW200627066A (en) Photosensitive resin composition, photosensitive film for permanent resist, method for forming resist pattern, printed wiring board and semiconductor device
CN103998986B (zh) 干膜、层叠结构体、印刷电路板以及层叠结构体的制造方法
WO2005103822A3 (en) Photosensitive resin composition, cured product thereof and production method of printed circuit board using the same
JP4509561B2 (ja) 熱硬化性樹脂組成物
JP2008133246A5 (zh)
CN101535896A (zh) 感光性树脂组合物及其固化物、以及感光性树脂的制备方法
JPWO2013172435A1 (ja) アルカリ現像型の熱硬化性樹脂組成物、プリント配線板
WO2008078483A1 (ja) 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
US9880467B2 (en) Photo-curable and thermo-curable resin composition and dry film solder resist
MY148552A (en) Photosensitive resin composition, photosensitive element comprising the same, method of forming resist pattern, and process for producing printed wiring board
JP3924431B2 (ja) ソルダーレジストインキ組成物
MY152732A (en) Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for manufacturing printed wiring board
CN108350203B (zh) 黑色树脂组合物、附带黑色树脂固化膜的聚酰亚胺及其制造方法
US20090101394A1 (en) Photosensitive resin composition and flexible printed wiring circut board having insulative cover layer formed of photosensitive resin composition
JP4257786B2 (ja) 活性エネルギー線硬化型アルカリ可溶性イミド樹脂、活性エネルギー線硬化型アルカリ可溶性イミド樹脂組成物、ソルダーレジスト用組成物、プリント配線板および感光性ドライフィルム
MY152075A (en) Photosensitive resin composition, photosensitive element, resist pattern manufacturing method, and printed circuit board manufacturing method
KR101142735B1 (ko) 수지 조성물, 드라이 필름, 및 그로부터 얻어지는 가공품
WO2005019231A8 (ja) ホスファゼン化合物、及び感光性樹脂組成物並びにその利用
JP2015121775A (ja) 光硬化性・熱硬化性樹脂組成物およびプリント配線板
KR101624021B1 (ko) 포지티브형 감광성 수지 조성물, 드라이 필름, 경화물 및 인쇄 배선판
JP5615512B2 (ja) 感光性樹脂組成物およびそれを用いたフレキシブル回路基板、ならびにその回路基板の製法
TWI711356B (zh) 乾膜及可撓性印刷配線板