TW200608069A - Photoelectric transducer array, its accumulation apparatus and mounting structure, and optical information processing device - Google Patents

Photoelectric transducer array, its accumulation apparatus and mounting structure, and optical information processing device

Info

Publication number
TW200608069A
TW200608069A TW094116496A TW94116496A TW200608069A TW 200608069 A TW200608069 A TW 200608069A TW 094116496 A TW094116496 A TW 094116496A TW 94116496 A TW94116496 A TW 94116496A TW 200608069 A TW200608069 A TW 200608069A
Authority
TW
Taiwan
Prior art keywords
photoelectric transducer
transducer array
array
information processing
photoelectric
Prior art date
Application number
TW094116496A
Other languages
English (en)
Chinese (zh)
Other versions
TWI316617B (https=
Inventor
Hiizu Ohtorii
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of TW200608069A publication Critical patent/TW200608069A/zh
Application granted granted Critical
Publication of TWI316617B publication Critical patent/TWI316617B/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
    • H10F55/20—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers
    • H10F55/25—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive devices and the electric light source are all semiconductor devices
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4206—Optical features
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Led Devices (AREA)
  • Light Receiving Elements (AREA)
TW094116496A 2004-05-28 2005-05-20 Photoelectric transducer array, its accumulation apparatus and mounting structure, and optical information processing device TW200608069A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004158496A JP2005340545A (ja) 2004-05-28 2004-05-28 光電変換素子アレイ、その集積装置及びこれらの実装構造、並びに光情報処理装置

Publications (2)

Publication Number Publication Date
TW200608069A true TW200608069A (en) 2006-03-01
TWI316617B TWI316617B (https=) 2009-11-01

Family

ID=35451165

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094116496A TW200608069A (en) 2004-05-28 2005-05-20 Photoelectric transducer array, its accumulation apparatus and mounting structure, and optical information processing device

Country Status (5)

Country Link
US (1) US7622700B2 (https=)
JP (1) JP2005340545A (https=)
CN (1) CN1998092B (https=)
TW (1) TW200608069A (https=)
WO (1) WO2005117146A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4416050B2 (ja) 2006-09-21 2010-02-17 日立化成工業株式会社 光導波路基板およびそれを用いた光電気混載回路実装基板
US20090065053A1 (en) * 2007-08-24 2009-03-12 Julian Gulbinski Photovoltaic device
JP2010191365A (ja) * 2009-02-20 2010-09-02 Hitachi Ltd 光インターコネクション実装回路
KR101256000B1 (ko) * 2011-04-13 2013-04-18 엘지이노텍 주식회사 광 모듈용 인터포저 및 이를 이용한 광모듈, 인터포저의 제조방법
US9354410B2 (en) 2012-01-31 2016-05-31 Hewlett Packard Enterprise Development Lp Monolithically integrated, self-aligning, optical-fiber ferrule
CN103376516B (zh) * 2012-04-27 2016-07-06 鸿富锦精密工业（深圳）有限公司 光纤传输模组
TWI561881B (en) * 2012-04-27 2016-12-11 Hon Hai Prec Ind Co Ltd Fiber optical transceiver
TW201610495A (zh) * 2014-09-09 2016-03-16 鴻海精密工業股份有限公司 光耦合模組、光電轉換裝置以及光通訊裝置
CN109115250A (zh) * 2018-08-08 2019-01-01 珠海格力电器股份有限公司 感光器件的阵列结构和光电编码器

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4471387A (en) * 1981-01-14 1984-09-11 Morton Nadler Image scanning method and device
JPS6450557A (en) * 1987-08-21 1989-02-27 Fujitsu Ltd Infrared-ray detector array
JPS6450557U (https=) 1987-09-25 1989-03-29
JPH06991A (ja) * 1992-06-22 1994-01-11 Fuji Xerox Co Ltd レーザビームプリンタ
JP3306130B2 (ja) * 1992-11-17 2002-07-24 三洋電機株式会社 発光ダイオードアレイ装置
JP3143053B2 (ja) * 1995-10-31 2001-03-07 キヤノン株式会社 リニアイメージセンサ
JP2000022215A (ja) * 1998-07-07 2000-01-21 Oki Electric Ind Co Ltd Ｌｅｄアレイ
JP3920540B2 (ja) 2000-07-04 2007-05-30 三洋電機株式会社 空気調和装置
JP2002189137A (ja) * 2000-12-20 2002-07-05 Nippon Telegr & Teleph Corp <Ntt> 光配線基板
JP4574006B2 (ja) * 2000-12-26 2010-11-04 キヤノン株式会社 画像形成装置
JP2002280655A (ja) * 2001-01-10 2002-09-27 Ricoh Opt Ind Co Ltd 光出力装置および光出力装置用レンズ素子
JP2003222746A (ja) * 2002-01-29 2003-08-08 Mitsubishi Electric Corp 光電気結合装置
JP4038586B2 (ja) 2002-04-26 2008-01-30 高砂香料工業株式会社 粉末ゴマおよびその製造方法
JP4711322B2 (ja) * 2002-11-29 2011-06-29 ルネサスエレクトロニクス株式会社 Ｃｃｄイメージセンサ
JP2004212847A (ja) * 2003-01-08 2004-07-29 Fujitsu Ltd 光結合器

Also Published As

Publication number Publication date
CN1998092A (zh) 2007-07-11
US7622700B2 (en) 2009-11-24
JP2005340545A (ja) 2005-12-08
US20070215790A1 (en) 2007-09-20
WO2005117146A1 (ja) 2005-12-08
CN1998092B (zh) 2010-06-16
TWI316617B (https=) 2009-11-01

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees