TW200607425A - Method for producing PCB - Google Patents

Method for producing PCB

Info

Publication number
TW200607425A
TW200607425A TW094116353A TW94116353A TW200607425A TW 200607425 A TW200607425 A TW 200607425A TW 094116353 A TW094116353 A TW 094116353A TW 94116353 A TW94116353 A TW 94116353A TW 200607425 A TW200607425 A TW 200607425A
Authority
TW
Taiwan
Prior art keywords
layer
treatment
stripping
conducting
plating
Prior art date
Application number
TW094116353A
Other languages
English (en)
Chinese (zh)
Inventor
Masahiro Ohno
Original Assignee
Nippon Mektron Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron Kk filed Critical Nippon Mektron Kk
Publication of TW200607425A publication Critical patent/TW200607425A/zh

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
TW094116353A 2004-06-29 2005-05-19 Method for producing PCB TW200607425A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004191088A JP2006013301A (ja) 2004-06-29 2004-06-29 回路基板の製造方法

Publications (1)

Publication Number Publication Date
TW200607425A true TW200607425A (en) 2006-02-16

Family

ID=35780152

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094116353A TW200607425A (en) 2004-06-29 2005-05-19 Method for producing PCB

Country Status (3)

Country Link
JP (1) JP2006013301A (ja)
CN (1) CN1717152A (ja)
TW (1) TW200607425A (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006269638A (ja) * 2005-03-23 2006-10-05 Sumitomo Bakelite Co Ltd 回路基板の製造方法、回路基板およびプリント回路基板
TWI704852B (zh) 2018-11-28 2020-09-11 先豐通訊股份有限公司 電路板的電鍍方法及其所製成的電路板
CN110113866B (zh) * 2019-05-27 2021-06-22 深圳市三德冠精密电路科技有限公司 一种防止柔性电路板十字Mark变形的保护方法
CN110536566B (zh) * 2019-08-29 2021-04-02 江苏上达电子有限公司 一种柔性双面板的成孔方法
CN111839503B (zh) * 2020-06-29 2024-08-09 华中科技大学 一种表皮贴附式心电加速度检测系统及其制备方法

Also Published As

Publication number Publication date
JP2006013301A (ja) 2006-01-12
CN1717152A (zh) 2006-01-04

Similar Documents

Publication Publication Date Title
TW200603707A (en) Printed circuit board and method for manufacturing printed circuit board
ATE548430T1 (de) Aushärtbare harzfolie für flexible schaltkreisplatine und herstellungsverfahren dafür
TW200617065A (en) Resin composite metal foil, laminate and process for the production of printed wiring board using the laminate
TW200601920A (en) Wiring circuit board and production method thereof
TW200721927A (en) Method for making a circuit board, and circuit board
TW200704833A (en) Surface treated copper foil, process for producing surface treated copper foil, and surface treated copper foil with very thin primer resin layer
JP4291353B2 (ja) 非導電性基板表面、特にポリイミド表面に直接金属層を形成する方法
WO2007025521A3 (de) Verfahren zur herstellung eines halbleiterbauelements mit einer planaren kontaktierung und halbleiterbauelement
ATE388614T1 (de) Verfahren zur herstellung einer doppelseitigen leiterplatte
JP2012112009A (ja) 銅箔、及び銅箔の製造方法
TW200607425A (en) Method for producing PCB
CN102159035A (zh) 印刷电路板及其制作方法和制作双面印刷电路板的方法
MY153974A (en) Method of forming electrinic circuit
EP1619719A3 (en) Method of manufacturing a wiring board including electroplating
TW200738086A (en) Process for producing printed wiring board
CN108323040B (zh) 一种具有阶梯槽的pcb的制作方法及pcb
JP2011086681A (ja) プリント基板の製造方法
WO2011010889A3 (en) Flexible printed circuit board and method for manufacturing the same
KR20080087622A (ko) 무접착 양면 ｆｃｃｌ, 및 이를 이용한 ｆｐｃｂ 및 그제조 방법
JP2011003562A (ja) プリント配線板とその製造方法
TW200741871A (en) Method of forming wiring
KR101555014B1 (ko) 미세배선용 인쇄회로기판 및 이의 제조방법
JP5369950B2 (ja) 多層プリント配線板の製造方法および多層プリント配線板
JP2008258482A (ja) プリント配線基板の製造方法
JP2005240132A (ja) 電解銅箔及び電解銅箔光沢面の電解研磨方法