TW200607425A - Method for producing PCB - Google Patents

Method for producing PCB

Info

Publication number
TW200607425A
TW200607425A TW094116353A TW94116353A TW200607425A TW 200607425 A TW200607425 A TW 200607425A TW 094116353 A TW094116353 A TW 094116353A TW 94116353 A TW94116353 A TW 94116353A TW 200607425 A TW200607425 A TW 200607425A
Authority
TW
Taiwan
Prior art keywords
layer
treatment
stripping
conducting
plating
Prior art date
Application number
TW094116353A
Other languages
English (en)
Chinese (zh)
Inventor
Masahiro Ohno
Original Assignee
Nippon Mektron Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron Kk filed Critical Nippon Mektron Kk
Publication of TW200607425A publication Critical patent/TW200607425A/zh

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
TW094116353A 2004-06-29 2005-05-19 Method for producing PCB TW200607425A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004191088A JP2006013301A (ja) 2004-06-29 2004-06-29 回路基板の製造方法

Publications (1)

Publication Number Publication Date
TW200607425A true TW200607425A (en) 2006-02-16

Family

ID=35780152

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094116353A TW200607425A (en) 2004-06-29 2005-05-19 Method for producing PCB

Country Status (3)

Country Link
JP (1) JP2006013301A (ja)
CN (1) CN1717152A (ja)
TW (1) TW200607425A (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006269638A (ja) * 2005-03-23 2006-10-05 Sumitomo Bakelite Co Ltd 回路基板の製造方法、回路基板およびプリント回路基板
TWI704852B (zh) * 2018-11-28 2020-09-11 先豐通訊股份有限公司 電路板的電鍍方法及其所製成的電路板
CN110113866B (zh) * 2019-05-27 2021-06-22 深圳市三德冠精密电路科技有限公司 一种防止柔性电路板十字Mark变形的保护方法
CN110536566B (zh) * 2019-08-29 2021-04-02 江苏上达电子有限公司 一种柔性双面板的成孔方法
CN111839503A (zh) * 2020-06-29 2020-10-30 华中科技大学 一种表皮贴附式心电加速度检测系统及其制备方法

Also Published As

Publication number Publication date
JP2006013301A (ja) 2006-01-12
CN1717152A (zh) 2006-01-04

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