TW200605710A - Method for making a display panel, and a display panel - Google Patents

Method for making a display panel, and a display panel

Info

Publication number
TW200605710A
TW200605710A TW094119459A TW94119459A TW200605710A TW 200605710 A TW200605710 A TW 200605710A TW 094119459 A TW094119459 A TW 094119459A TW 94119459 A TW94119459 A TW 94119459A TW 200605710 A TW200605710 A TW 200605710A
Authority
TW
Taiwan
Prior art keywords
substrate
low melting
sealing substrate
melting point
glass
Prior art date
Application number
TW094119459A
Other languages
English (en)
Inventor
Tetsuji Omura
Ryuji Nishikawa
Original Assignee
Sanyo Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co filed Critical Sanyo Electric Co
Publication of TW200605710A publication Critical patent/TW200605710A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
TW094119459A 2004-06-11 2005-06-13 Method for making a display panel, and a display panel TW200605710A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004174162 2004-06-11

Publications (1)

Publication Number Publication Date
TW200605710A true TW200605710A (en) 2006-02-01

Family

ID=35503546

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094119459A TW200605710A (en) 2004-06-11 2005-06-13 Method for making a display panel, and a display panel

Country Status (6)

Country Link
US (1) US7572162B2 (zh)
JP (1) JPWO2005122645A1 (zh)
KR (1) KR100798244B1 (zh)
CN (1) CN100525559C (zh)
TW (1) TW200605710A (zh)
WO (1) WO2005122645A1 (zh)

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KR101233144B1 (ko) * 2006-06-12 2013-02-14 엘지디스플레이 주식회사 유기전계 발광소자 및 그 제조 방법
KR100838077B1 (ko) 2007-01-12 2008-06-16 삼성에스디아이 주식회사 평판 표시장치의 제조방법
PT104282A (pt) * 2008-12-05 2010-06-07 Univ Do Porto Processo de selagem com vidro de células solares dsc
DE102008063636A1 (de) * 2008-12-18 2010-06-24 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines organischen optoelektronischen Bauelements und organisches optoelektronisches Bauelement
EP2622666B1 (en) * 2010-09-27 2020-08-05 Beijing Xiaomi Mobile Software Co., Ltd. Oled with flexible cover layer
CN102237496A (zh) * 2011-06-30 2011-11-09 彩虹（佛山）平板显示有限公司 一种有机电致发光二极管显示器件的封装方法
CN102255056A (zh) * 2011-07-12 2011-11-23 上海大学 一种增强玻璃料密封oled器件密封性能的方法
CN102298875B (zh) * 2011-09-01 2015-08-05 友达光电（苏州）有限公司 一种显示装置
JP5815365B2 (ja) * 2011-10-20 2015-11-17 京セラ株式会社 弾性波装置、電子部品および弾性波装置の製造方法
CN102530844B (zh) * 2012-02-03 2015-02-18 厦门大学 一种微器件的真空封装方法
JP5514263B2 (ja) * 2012-06-12 2014-06-04 新日本ステンレス工業株式会社 表示パネルの製造方法
DE102012109258B4 (de) * 2012-09-28 2020-02-06 Osram Oled Gmbh Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelementes
CN103311445B (zh) * 2012-12-24 2016-03-16 上海天马微电子有限公司 有机发光二极管封装结构及其形成方法
CN103280540A (zh) * 2013-05-09 2013-09-04 深圳市华星光电技术有限公司 显示装置及其制造方法
US9368748B2 (en) 2013-05-09 2016-06-14 Shenzhen China Star Optoelectronics Technology Co., Ltd. Display device and manufacturing method thereof
KR101427689B1 (ko) * 2013-05-22 2014-08-07 주식회사 엘티에스 곡면기판의 프릿 실링장치 및 방법
CN104362167A (zh) * 2014-10-27 2015-02-18 京东方科技集团股份有限公司 有机电致发光显示面板、基板及其制作方法、显示装置
CN104716275A (zh) 2015-03-20 2015-06-17 京东方科技集团股份有限公司 电子器件的封装方法和封装系统
US10401689B2 (en) 2016-01-08 2019-09-03 Apple Inc. Electronic device displays with laser-welded edges
US11251224B2 (en) * 2018-10-31 2022-02-15 Samsung Display Co., Ltd. Display device and method of fabricating the same
CN110729311B (zh) * 2019-10-31 2023-09-05 京东方科技集团股份有限公司 一种阵列基板、显示面板和显示装置
KR20210113503A (ko) 2020-03-06 2021-09-16 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
KR20220000440A (ko) * 2020-06-25 2022-01-04 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법

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Also Published As

Publication number Publication date
JPWO2005122645A1 (ja) 2008-04-10
US7572162B2 (en) 2009-08-11
CN100525559C (zh) 2009-08-05
KR20060135732A (ko) 2006-12-29
US20070164672A1 (en) 2007-07-19
WO2005122645A1 (ja) 2005-12-22
CN1951154A (zh) 2007-04-18
KR100798244B1 (ko) 2008-01-24

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