TW200604356A - Method of manufacturing surface-treated copper foil for PCB having fine-circuit pattern and surface-treated copper foil thereof - Google Patents

Method of manufacturing surface-treated copper foil for PCB having fine-circuit pattern and surface-treated copper foil thereof

Info

Publication number
TW200604356A
TW200604356A TW093128534A TW93128534A TW200604356A TW 200604356 A TW200604356 A TW 200604356A TW 093128534 A TW093128534 A TW 093128534A TW 93128534 A TW93128534 A TW 93128534A TW 200604356 A TW200604356 A TW 200604356A
Authority
TW
Taiwan
Prior art keywords
copper foil
treated copper
forming
substrate
strength
Prior art date
Application number
TW093128534A
Other languages
Chinese (zh)
Other versions
TWI267560B (en
Inventor
Jong-Ho Ryu
Seung-Ryang Jeong
Sang-Beom Kim
Original Assignee
Iljin Copper Foil Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iljin Copper Foil Co Ltd filed Critical Iljin Copper Foil Co Ltd
Publication of TW200604356A publication Critical patent/TW200604356A/en
Application granted granted Critical
Publication of TWI267560B publication Critical patent/TWI267560B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

The objective of the invention is to provide a method for manufacturing copper foil having excellent strength of adhesion to a substrate and heat resistance strength. The method for manufacturing the surface treated copper foil for a microfabrication circuit substrate suitable for production of the substrate having a microfabrication circuit pattern comprises steps of; arranging the copper foil as a cathode in an electroplating bath including Co, Ni, ammonium salt, and citric acid and precipitating and forming a roughening treatment layer of a Co-Ni alloy on the copper foil surface in such a manner that its surface roughness attains ≤ 0.5 μm; forming a pure Zn or Zn alloy coating layer on the roughening treatment layer; forming an electrolytic chromate layer on the coating layer; and forming a silane coupling agent treatment layer on the electrolytic chromate layer. The manufactured surface treated copper foil is excellent overall in the requirement characteristics as the copper foil, such as the strength of adhesion to the substrate, heat resistant strength of adhesion, chemical resistance, and etching, and is particularly suitable as the copper foil for the microfabrication circuit substrate.
TW093128534A 2004-07-16 2004-09-21 Method of manufacturing surface-treated copper foil for PCB having fine-circuit pattern and surface-treated copper foil thereof TWI267560B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020040055382A KR100654737B1 (en) 2004-07-16 2004-07-16 Method of manufacturing Surface-treated Copper Foil for PCB having fine-circuit pattern and Surface-treated Copper Foil thereof

Publications (2)

Publication Number Publication Date
TW200604356A true TW200604356A (en) 2006-02-01
TWI267560B TWI267560B (en) 2006-12-01

Family

ID=35895336

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093128534A TWI267560B (en) 2004-07-16 2004-09-21 Method of manufacturing surface-treated copper foil for PCB having fine-circuit pattern and surface-treated copper foil thereof

Country Status (3)

Country Link
JP (1) JP2006028635A (en)
KR (1) KR100654737B1 (en)
TW (1) TWI267560B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI391531B (en) * 2008-07-18 2013-04-01 Iljin Copper Foil Co Ltd Copper foil for printed circuit board, method of preparing the same, and flexible copper clad laminate using polyamic acid precursor and copper foil
TWI806296B (en) * 2020-12-23 2023-06-21 日商Ｊｘ金屬股份有限公司 Surface treated copper foil, copper clad laminate and printed wiring board

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4904933B2 (en) * 2005-09-27 2012-03-28 日立電線株式会社 Nickel plating solution and manufacturing method thereof, nickel plating method and copper foil for printed wiring board
KR100942547B1 (en) * 2006-08-11 2010-02-16 일진소재산업주식회사 The resin composition for copper clad laminate, copper clad comprising the same and method for manufacturing the same
KR100857311B1 (en) * 2007-06-18 2008-09-05 엘에스엠트론 주식회사 Copper foil and surface treatment thereof
KR100974373B1 (en) * 2008-02-28 2010-08-05 엘에스엠트론 주식회사 Surface treatment method of copper foil for printed circuit, copper foil and electroplater thereof
KR100983682B1 (en) 2008-03-31 2010-09-24 엘에스엠트론 주식회사 Surface treatment method of copper foil for printed circuit, copper foil and electroplater thereof
KR20140034698A (en) * 2012-09-12 2014-03-20 주식회사 두산 Surface treatment method of a copper foil and the copper foil surface-treated by the method
KR101427388B1 (en) 2013-06-21 2014-08-08 이을규 Reinforcing Substrate for Supporting Printed Circuit Board and Method for Processing for the Same
CN104962965B (en) * 2015-05-29 2017-08-15 灵宝金源朝辉铜业有限公司 The environment-friendly type ashing handling process of rolled copper foil
KR102481411B1 (en) 2016-01-25 2022-12-23 에스케이넥실리스 주식회사 Electrolytic copper foil and method for producing the same, and copper clad laminate and printed circuit board having the same
JP6248231B1 (en) * 2016-02-10 2017-12-13 古河電気工業株式会社 Surface-treated copper foil and copper-clad laminate produced using the same
CN115044947B (en) * 2022-06-17 2023-09-29 山东金宝电子有限公司 Surface treatment method for improving adhesion of copper foil and resin

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3171117B2 (en) * 1996-08-14 2001-05-28 上村工業株式会社 Alloy plating bath of nickel, cobalt or nickel-cobalt alloy and phosphorus and plating method
JP3223829B2 (en) * 1997-01-29 2001-10-29 新光電気工業株式会社 Electric nickel plating bath or electric nickel alloy plating bath and plating method using the same
JPH1110794A (en) * 1997-06-27 1999-01-19 Nippon Denkai Kk Copper foil for copper-clad laminate and copperclad laminate employing the same
JP3739929B2 (en) 1998-03-09 2006-01-25 古河サーキットフォイル株式会社 Copper foil for printed wiring board and method for producing the same
JP3330925B2 (en) * 2000-04-05 2002-10-07 株式会社日鉱マテリアルズ Copper foil for laser drilling
JP3709142B2 (en) * 2001-01-19 2005-10-19 福田金属箔粉工業株式会社 Copper foil for printed wiring board and method for producing the same
JP4379854B2 (en) * 2001-10-30 2009-12-09 日鉱金属株式会社 Surface treated copper foil
TW200424359A (en) * 2003-02-04 2004-11-16 Furukawa Circuit Foil Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil
TW200500199A (en) * 2003-02-12 2005-01-01 Furukawa Circuit Foil Copper foil for fine patterned printed circuits and method of production of same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI391531B (en) * 2008-07-18 2013-04-01 Iljin Copper Foil Co Ltd Copper foil for printed circuit board, method of preparing the same, and flexible copper clad laminate using polyamic acid precursor and copper foil
TWI806296B (en) * 2020-12-23 2023-06-21 日商Ｊｘ金屬股份有限公司 Surface treated copper foil, copper clad laminate and printed wiring board

Also Published As

Publication number Publication date
JP2006028635A (en) 2006-02-02
TWI267560B (en) 2006-12-01
KR100654737B1 (en) 2006-12-08
KR20060006389A (en) 2006-01-19

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