TW200529342A - Bonding arm swinging type bonding apparatus - Google Patents

Bonding arm swinging type bonding apparatus Download PDF

Info

Publication number
TW200529342A
TW200529342A TW093139084A TW93139084A TW200529342A TW 200529342 A TW200529342 A TW 200529342A TW 093139084 A TW093139084 A TW 093139084A TW 93139084 A TW93139084 A TW 93139084A TW 200529342 A TW200529342 A TW 200529342A
Authority
TW
Taiwan
Prior art keywords
rotation
joint
arm
center
rotating shaft
Prior art date
Application number
TW093139084A
Other languages
English (en)
Chinese (zh)
Other versions
TWI330874B (enExample
Inventor
Osamu Kakutani
Yutaka Kondo
Yoshihiko Seino
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW200529342A publication Critical patent/TW200529342A/zh
Application granted granted Critical
Publication of TWI330874B publication Critical patent/TWI330874B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—ELECTRIC POWER NETWORKS; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J13/00—Circuit arrangements for providing remote monitoring or remote control of equipment in a power distribution network
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—ELECTRIC POWER NETWORKS; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S228/00—Metal fusion bonding
    • Y10S228/904—Wire bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Wire Bonding (AREA)
  • Butt Welding And Welding Of Specific Article (AREA)
  • Manipulator (AREA)
TW093139084A 2004-02-20 2004-12-16 Bonding arm swinging type bonding apparatus TW200529342A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004044576A JP4141394B2 (ja) 2004-02-20 2004-02-20 ボンディングアーム揺動型ボンディング装置

Publications (2)

Publication Number Publication Date
TW200529342A true TW200529342A (en) 2005-09-01
TWI330874B TWI330874B (enExample) 2010-09-21

Family

ID=34858065

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093139084A TW200529342A (en) 2004-02-20 2004-12-16 Bonding arm swinging type bonding apparatus

Country Status (4)

Country Link
US (1) US7389805B2 (enExample)
JP (1) JP4141394B2 (enExample)
KR (1) KR100626186B1 (enExample)
TW (1) TW200529342A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4616779B2 (ja) * 2006-03-06 2011-01-19 株式会社新川 ホーンホルダ揺動型ボンディング装置
JP4343985B2 (ja) * 2008-01-24 2009-10-14 株式会社新川 ボンディング装置及びボンディング装置のボンディングステージ高さ調整方法
CA3224206A1 (en) 2008-02-15 2009-08-20 Ceres, Inc. Drought and heat tolerance in plants
CN114798399B (zh) * 2022-03-14 2023-06-06 上海工程技术大学 一种超声换能器固定装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2755667B2 (ja) * 1989-03-27 1998-05-20 株式会社東芝 モータ駆動回路及びワイヤボンディング装置
US5114244A (en) * 1991-09-04 1992-05-19 Dunham James L Compliant bearing surface with enclosed fluid support
JP2638375B2 (ja) * 1992-02-20 1997-08-06 株式会社日立製作所 連続溶融金属メッキ装置及び連続溶融金属メッキ装置用軸受
JP4010186B2 (ja) 2002-05-30 2007-11-21 日本電気株式会社 ボンディング装置

Also Published As

Publication number Publication date
JP4141394B2 (ja) 2008-08-27
US7389805B2 (en) 2008-06-24
KR20050083022A (ko) 2005-08-24
JP2005236104A (ja) 2005-09-02
TWI330874B (enExample) 2010-09-21
KR100626186B1 (ko) 2006-09-20
US20050184127A1 (en) 2005-08-25

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees