200528009 五、發明說明（1) 【發明所屬之技術領域】 本發明係有關於—種熱管與散熱鰭片成形方法 -種利用電鍍彳式將金屬《導熱力質: 片間：以結合熱管與散熱籍片之成形方法。、放熱韓 【先前技術】 $由於熱官具有高熱傳能力、快 :的2輕：結構簡單及多用途等特 ：傳2 里的熱且不消杯® A ^ ·" 』A 1寻遞大 。而以往埶管盥嗫埶鍵此非本適合電子產品的散熱需求 熱籍片上穿設相i;:二作串ΐ或結合時’通常係於各散 ，以減少熱二：；”各散熱鰭片 < 穿孔間的接觸密度 如錫膏等導熱介拼徬熱入耵三先進一步於熱管上沾著 結合。 貝後’始々該熱官與各散熱鰭片作串接或 惟 ，rb 管上沾著導Ϊ ΐ所使用之導熱介質多呈黏膠狀，故當熱 中，且呈黏^二質後，即不易於熱管穿入散熱鰭片之穿孔 則不僅影燮^ 口之導熱介質若因過量而溢出各穿孔外或， 導熱介質的塗，觀，更谷易沾染雜質而增加熱阻；但若 穿孔作緊贫的里過少時，又無法使加熱管與各散熱鰭片 ，實不易=進接觸。因此，以往熱管與散熱鰭片在接合上 地塗抹於執其地控制導熱介質的塗佈量，也不易將其均勻 有困擾之f 上，致使產品品質良莠不齊，在製造上亦多 有4監;卜卜 、 本創作人為改善並解決上述之缺失，乃特200528009 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a method for forming a heat pipe and a radiating fin, and a method for using a galvanized method to transfer metal How to form a book. [Existing technology] [Previous technology] $ Due to the high heat transfer ability of the heat officer, fast: 2 light: simple structure and multi-purpose, etc. Special: transfer 2 heat and do not eliminate the cup ® A ^ · " . In the past, the toilet key was not suitable for the heat dissipation requirements of electronic products. The heat transfer film was installed on the film; when the two are connected or combined, they are usually tied to each other to reduce the heat. The contact density between the perforations, such as solder paste and other heat-conducting media such as solder paste, and the heat-into-thickness, are further adhered to the heat pipe. After that, the heat officer is connected in series or with the fins, but the rb tube The conductive medium used on the guide 沾 is mostly viscous, so when it is hot and sticky, it is not easy for the heat pipe to penetrate the perforation of the heat sink fin. Excessive overflow of the perforations or coating of the heat-conducting medium will increase the thermal resistance due to impurities contamination. However, if the perforations are too tight and the inside is too small, it will not be possible to make the heating tube and the heat dissipation fins difficult. = Into contact. Therefore, in the past, the heat pipe and the heat dissipation fins were applied on the joint to control the coating amount of the heat conductive medium, and it was not easy to uniformly and troublesome f, resulting in uneven product quality and a lot of manufacturing. There are 4 supervisors; Bu Bu, the author artificially improved and resolved The lack of, is special
第5頁 200528009 五、發明說明（2) 潛心研究並配合學理之運用，終於提出一種設計合理且有 效改善上述缺失之本創作。 【發明内容】 本發明之主要目的，在於可提供一種熱管與散熱鰭片 成形方法，其係利用電鍍方式，將可作為導熱介質之金屬 經分解而使之附著於熱管表面上，以解決傳統導熱介質呈 黏膠狀又不易塗佈之缺失，進而可有效掌握品質，便於製 造與加工。 為了達成上述之目的，本發明係提供一種熱管與散熱 鰭片成形方法，其步驟包括： a )於熱管欲與散熱鰭片接合之部位，鍍上金屬之導 熱介質層； b )將散熱鰭片接合於該熱管鍍有導熱介質層之部位 上；及 c )對該導熱介質層加熱而使其熔解於熱管與散熱鰭 片之間後，再行冷卻。 【實施方式】 為了使 貴審查委員能更進一步瞭解本發明之特徵及 技術内容，請參閱以下有關本發明之詳細說明與附圖，然 而所附圖式僅提供參考與說明用，並非用來對本發明加以 限制者。 請參閱第一圖、第二圖及第三圖，係分別為本發明之 流程示意圖、熱管與散熱鰭片未接合前之示意圖及接合後 之示意圖。本發明係提供一種熱管與散熱鰭片成形方法，Page 5 200528009 V. Description of the Invention (2) After conscientious research and the application of scientific theory, finally proposed a rational design and effective improvement of the above-mentioned original creation. [Summary of the Invention] The main object of the present invention is to provide a method for forming a heat pipe and a radiating fin, which uses electroplating to decompose a metal that can be used as a heat conducting medium and attach it to the surface of the heat pipe to solve the traditional heat conduction. The medium is viscous and difficult to coat, which can effectively control the quality and facilitate manufacturing and processing. In order to achieve the above-mentioned object, the present invention provides a method for forming a heat pipe and a heat dissipation fin, which includes the steps of: a) plating a heat conducting medium layer of metal on a portion where the heat pipe is to be joined with the heat dissipation fin; b) radiating the heat dissipation fin The heat pipe is bonded to a portion of the heat pipe coated with a heat conducting medium layer; and c) the heat conducting medium layer is heated to be melted between the heat pipe and the heat dissipation fin, and then cooled. [Embodiment] In order for your review committee to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings are provided for reference and explanation only, and are not intended to be used as a reference for the present invention. Inventions are restricted. Please refer to the first diagram, the second diagram, and the third diagram, which are schematic diagrams of the process of the present invention, a schematic diagram before the heat pipe and the heat dissipation fin are not joined, and a schematic diagram after the joint. The invention provides a method for forming a heat pipe and a radiating fin,
200528009 五、發明說明（3) 其主要係利用 一均勻、且易 入，並對該金 管與散熱鰭片 a )於熱 層金屬之導熱 作為該導熱介 為低之金屬材 金屬覆蓋在另 電鍍時間的長 1 〇所形成的厚 b )將散 部位上（如第 係牙設有相對 管1之外管徑 穿孔20中。 電鍍方式將導熱介曾 精準控制之金屬塗佈層2於==上，以形成 屬塗佈層施以熔接、冷Ί再將散熱鰭片穿 得以結合；本發明步驟=加工程序’使熱 官1欲與散熱鰭片2接合 介皙爲續 口之表面部位，鑛上一 ;丨貝層1 0 (如第二圖所 質層1 0之材質，最好传Ϊ 。在此步驟中， 質，& ^ a i ^係熔點較銅等良導體 三物f砉而，7 π ;電鍍乃一種利用電流將 物體表面，以形成金屬塗佈層，故可藉由 =、電流大小等因素精準控制該導埶介質層 度，且所獲得之塗佈層亦較為勻稱。 熱鰭片2接合於該熱管1鍍有導熱介質層1〇之 三圖所示）。在此步驟中，各散埶鰭片2上 應之穿孔20，且各穿孔20之孔徑又略大於熱 使熱管1以緊配合方式插入各散熱鰭片2之 c )對該導熱介質層10加熱而使其熔解於熱管1與散 熱鱗片2之間後’再行冷卻。在此步驟中，對該導熱介質 1 〇之加熱’可採低溫溶接方式為之，以避免破壞熱管1與 散熱鰭片2。 是以，藉由上述之步驟流程，即可得到本發明熱管與 散熱韓片成形方法。 因此，藉由本發明熱管與散熱鰭片成形方法，俾可解 決傳統導熱介質呈黏膠狀又不易塗佈之缺失，而據此所製200528009 V. Description of the invention (3) It mainly uses a uniform, easy-to-access, and heat conduction of the gold tube and the heat dissipation fins a) The thermal conductivity of the metal in the hot layer as the metal material with a low thermal conductivity. The metal is covered at another plating time The thickness b formed by the length of 10) will be scattered (such as the first tooth is provided with a hole 20 with a diameter outside the tube 1). The metal coating layer 2 that has been precisely controlled by the thermal conductive medium is electroplated on == In order to form a coating layer, apply welding, cold heading, and then pass through the heat sink fins; the step of the present invention = processing procedure to make the heat officer 1 want to join the heat sink fins 2 to form a continuous surface, Previous; 丨 Shell layer 1 0 (as in the second picture, the material of the quality layer 10 is best to pass Ϊ. In this step, 质 ^ ai ^ is a melting point of three good materials such as copper and f 砉. , 7 π; Electroplating is a method of applying a current to the surface of an object to form a metal coating layer. Therefore, the layer thickness of the conductive medium can be precisely controlled by factors such as =, the magnitude of the current, and the obtained coating layer is relatively symmetrical. The thermal fins 2 are bonded to the heat pipe 1 (shown in the third figure, which is plated with a thermally conductive medium layer 10). In this step, the corresponding perforations 20 on each of the scattered fins 2 and the apertures of each of the perforations 20 are slightly larger than the heat that causes the heat pipe 1 to be inserted into each of the heat dissipation fins 2 in a tight fit. After it is melted between the heat pipe 1 and the heat-dissipating scale 2, it is cooled again. In this step, the heating of the thermally conductive medium 10 can be performed at a low temperature so as to avoid damaging the heat pipe 1 and the radiating fins 2. Therefore, the method for forming a heat pipe and a heat sink according to the present invention can be obtained through the above steps. Therefore, with the method for forming a heat pipe and a heat dissipation fin according to the present invention, it is possible to solve the problem that the traditional heat conducting medium is viscous and difficult to be coated, and the method can be manufactured accordingly.
第7頁 200528009 五、發明說明（4) 成之成品，其不僅較為美觀、便於製造與加工，且其均稱 地導熱介質層更有助於提昇熱管1與散熱鰭片2間之接觸， 以減少熱阻，並有效發揮熱管1可大量傳遞熱能的特性。 綜上所述，本發明確可達到預期之使用目的，而解決 習知之缺失，又因極具新穎性及進步性，完全符合發明專 利申請要件，爰依專利法提出申請，敬請詳查並賜准本案 專利，以保障發明人之權利。Page 7 200528009 V. Description of the invention (4) The finished product is not only more beautiful, easy to manufacture and process, but also its heat conductive medium layer is more helpful to improve the contact between the heat pipe 1 and the heat dissipation fins 2, so that The thermal resistance is reduced, and the characteristic that the heat pipe 1 can transfer a large amount of heat energy is effectively exerted. In summary, the present invention can indeed achieve the intended purpose of use, while solving the lack of knowledge, and because of its novelty and progress, it fully meets the requirements for the invention patent application, and applies according to the patent law. Grant the patent in this case to protect the rights of the inventor.
惟以上所述僅為本發明之較佳可行實施例，非因此即 拘限本發明之專利範圍，故舉凡運用本發明說明書及圖式 内容所為之等效技術、手段等變化，均同理皆包含於本發 明之範圍内，合予陳明。However, the above are only the preferred and feasible embodiments of the present invention, and the patent scope of the present invention is not limited by this. Therefore, any changes in the equivalent technology and means used in the description and the drawings of the present invention are the same. It is included in the scope of the present invention and is shared by Chen Ming.
第8頁 200528009 圖式簡單說明 【圖式簡單說明】 第一圖 係本發明之流程示意圖。 第二圖 係本發明之熱管與散熱鰭片未接合前之示意 圖。 第三圖 係本發明之熱管與散熱鰭片接合後之示意圖 〔元件代表符號〕Page 8 200528009 Brief description of the drawings [Simplified description of the drawings] The first diagram is a schematic flowchart of the present invention. The second figure is a schematic view before the heat pipe and the heat dissipation fin of the present invention are not joined. The third figure is a schematic diagram of the heat pipe and the heat dissipation fin of the present invention after being joined. [Element representative symbol]
<本發明> 熱管 1 導熱介質層 10 散熱鰭片 1 穿孔 2 0< Invention > Heat pipe 1 Heat conducting medium layer 10 Heat radiating fin 1 Perforation 2 0
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