CN105047622B - Heat transfer structure, manufacturing method thereof and heat dissipation method thereof - Google Patents
Heat transfer structure, manufacturing method thereof and heat dissipation method thereof Download PDFInfo
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Abstract
本发明涉及一种传热结构、其制造方法及其散热方法，用于解决熟知合金用于散热组件中，会随热源温度改变而有剧烈的体积变化，因而产生严重的裂纹使散热效果变差的缺点。本发明的传热结构，包含：一微孔板；一金属导热层，接触所述微孔板及所述热源，所述金属导热层有多个凸部对应伸入所述贯穿孔，并结合在所述贯穿孔内缘，所述金属导热层吸热后，通过所述凸部将热能传导至该微孔板。由此，将金属导热层搭配微孔板使用，因增加导热面积而改善裂纹在散热过程中所带来的影响，从而使本发明的传热结构具有良好的散热效果。
The present invention relates to a heat transfer structure, its manufacturing method and its heat dissipation method. It is used to solve the problem that well-known alloys used in heat dissipation components will undergo drastic volume changes as the temperature of the heat source changes, thus causing severe cracks and worsening the heat dissipation effect. Shortcomings. The heat transfer structure of the present invention includes: a microporous plate; a metal thermal conductive layer that contacts the microporous plate and the heat source. The metal thermal conductive layer has a plurality of protrusions corresponding to extend into the through holes, and are combined At the inner edge of the through hole, after the metal thermal conductive layer absorbs heat, it conducts heat energy to the microwell plate through the convex portion. Therefore, using a metal thermal conductive layer with a micropore plate increases the thermal conductive area and improves the impact of cracks on the heat dissipation process, so that the heat transfer structure of the present invention has a good heat dissipation effect.
Description
技术领域technical field
本发明涉及一种传热结构、其制造方法及其散热方法，特别是涉及利用结合在微孔板上的金属导热层接触热源，透过导热性好的金属导热层加强界面的导热效果，从而提升热源的散热速度。The present invention relates to a heat transfer structure, its manufacturing method and its heat dissipation method, in particular to using a metal heat conduction layer combined with a microporous plate to contact a heat source, and to strengthen the heat conduction effect of the interface through the metal heat conduction layer with good thermal conductivity, thereby Increase the heat dissipation speed of the heat source.
背景技术Background technique
发热性元件由于在使用的过程中不断地产生热，而在过热的情况下就容易造成发热性元件的性能变差，例如光学特性下降或是电特性下降。因此，需通过散热元件将发热性元件所产生的热导掉，而一般散热元件会使用如金属板及散热鳍片等具有散热功能的物件。然而，随着时代的进步，3C产品逐渐追求高性能和轻薄外观，因此其散热设计日益重要，传统散热鳍片体积过大并且太重，不利于使用，只能以薄板材散热，高性能薄型散热片符合此需求趋势。Since the heat-generating element continuously generates heat during use, overheating may easily cause performance deterioration of the heat-generating element, such as degradation of optical characteristics or electrical characteristics. Therefore, it is necessary to dissipate the heat generated by the heat-generating element through the heat-dissipating element, and generally heat-dissipating elements use objects with heat-dissipating functions such as metal plates and heat-dissipating fins. However, with the progress of the times, 3C products are gradually pursuing high performance and thin and light appearance, so their heat dissipation design is becoming more and more important. Traditional heat dissipation fins are too large and heavy, which is not conducive to use. Only thin plates can be used to dissipate heat. High-performance and thin Heat sinks fit this demand trend.
但是薄板材受限于加工程序，其平整度远不如块材，接触点因界面导入大量孔隙而减少，孔隙处(空气层的热传导系数为0.024W/mK)容易形成热淤积，造成严重热阻，热源温度随着提高，使薄板材散热效果达不到预期。薄板材的界面空气热阻比块材大，原因在于热源与散热的薄板材接触不完全，而且接触面积越大，热淤积问题越严重。过去利用散热膏填补界面孔隙，高分子材料长期受热易劣化，使用寿命仅1～3年，其热传导系数约2～5W/mK，虽高于空气，但仍不及金属导热层(如合金材料)的热传导能力。然而介于热源与散热的薄板材之间的金属导热层，因其热膨胀系数较大，易随热源温度改变而产生剧烈的体积变化，从而产生严重的裂纹影响散热效果，所以导致金属导热层没有被大量作为热源与散热的薄板材之间的导热介质。因此，本发明主要在于改善前述的问题。However, the thin plate is limited by the processing procedure, and its flatness is far inferior to that of the block material. The contact points are reduced due to the introduction of a large number of pores at the interface, and thermal deposition is easily formed at the pores (the thermal conductivity coefficient of the air layer is 0.024W/mK), resulting in serious thermal resistance. , as the temperature of the heat source increases, the heat dissipation effect of the thin plate cannot meet expectations. The interface air thermal resistance of the thin plate is larger than that of the bulk material, because the contact between the heat source and the heat-dissipating thin plate is not complete, and the larger the contact area, the more serious the problem of thermal deposition. In the past, heat dissipation paste was used to fill interface pores. Polymer materials are prone to deterioration when exposed to heat for a long time, and their service life is only 1 to 3 years. The thermal conductivity is about 2 to 5W/mK. Although it is higher than air, it is still inferior to metal heat conduction layers (such as alloy materials). thermal conductivity. However, the metal heat conduction layer between the heat source and the heat dissipation thin plate, because of its large thermal expansion coefficient, is prone to dramatic volume changes with the change of the heat source temperature, resulting in serious cracks that affect the heat dissipation effect, so the metal heat conduction layer has no It is widely used as the heat conduction medium between the heat source and the heat dissipation sheet. Therefore, the present invention mainly aims to improve the aforementioned problems.
发明内容Contents of the invention
由此，本发明提出一种传热结构，用于接触一热源，包含有：一微孔板，具有多个贯穿孔；一金属导热层，有一第一接触面及一第二接触面，所述第一接触面用于接触所述微孔板，所述第二接触面用于接触所述热源，所述金属导热层有多个凸部对应伸入所述贯穿孔，并结合在所述贯穿孔内缘。Therefore, the present invention proposes a heat transfer structure for contacting a heat source, comprising: a microporous plate with a plurality of through holes; a metal heat conduction layer with a first contact surface and a second contact surface, so The first contact surface is used to contact the microporous plate, the second contact surface is used to contact the heat source, and the metal heat conduction layer has a plurality of protrusions correspondingly protruding into the through holes, and combined with the through the inner edge of the hole.
其中，所述金属导热层选自铋、锡、铅、铜、铟、镉、铊、镍、锗、银、锑、镓、铟、钾及钠中的至少两种，且所述金属导热层的熔点介于6℃至140℃之间。Wherein, the metal heat conducting layer is selected from at least two of bismuth, tin, lead, copper, indium, cadmium, thallium, nickel, germanium, silver, antimony, gallium, indium, potassium and sodium, and the metal heat conducting layer The melting point is between 6°C and 140°C.
其中，所述贯穿孔的孔径介于10微米至90微米之间。Wherein, the diameter of the through hole is between 10 microns and 90 microns.
其中，所述贯穿孔的断面呈沙漏形状或直立三角形。Wherein, the cross-section of the through hole is an hourglass shape or an upright triangle.
其中，所述微孔板有一与所述第一接触面接触的表面，所述表面为粗糙表面或具有多沟渠的表面。Wherein, the microporous plate has a surface in contact with the first contact surface, and the surface is a rough surface or a surface with multiple grooves.
本发明同时提出一种所述传热结构的制造方法，包括以下步骤：A.使所述微孔板与所述金属导热层的第一接触面相接触；B.使所述金属导热层吸热熔融而产生所述凸部渗入所述贯穿孔内。The present invention also proposes a manufacturing method of the heat transfer structure, comprising the following steps: A. making the microporous plate contact the first contact surface of the metal heat conducting layer; B. making the metal heat conducting layer absorb heat The protrusions generated by melting penetrate into the through holes.
在步骤B中，所述金属导热层的第二接触面与所述热源相接触，并吸收所述热源所释放的热能。In step B, the second contact surface of the metal heat conducting layer is in contact with the heat source, and absorbs heat energy released by the heat source.
在步骤B中，所述金属导热层的第二接触面与所述热源相接触，所述热源为一基板，将相互接触的所述微孔板、所述金属导热层与所述基板置入一供热单元中加热，所述金属导热层吸收所述供热单元所提供的热能。In step B, the second contact surface of the metal heat conduction layer is in contact with the heat source, and the heat source is a substrate, and the microporous plate, the metal heat conduction layer and the substrate are placed in contact with each other. It is heated in a heat supply unit, and the metal heat conduction layer absorbs the heat energy provided by the heat supply unit.
其中，所述供热单元为烘箱或烤炉。Wherein, the heat supply unit is an oven or an oven.
在步骤B中，进一步以加压方式使所述微孔板与所述金属导热层相贴合。In step B, the microporous plate is further bonded to the metal heat-conducting layer by means of pressure.
在步骤A中，所述金属导热层以薄片状或粉末状接触所述微孔板。In step A, the metal heat conducting layer contacts the microporous plate in the form of flakes or powder.
本发明同时提出一种所述传热结构的散热方法，包括以下步骤：A.使所述金属导热层的第二接触面接触所述热源；B.所述金属导热层吸热后，所述凸部将热能传导至所述微孔板，通过所述微孔板进行散热。The present invention also proposes a heat dissipation method for the heat transfer structure, comprising the following steps: A. making the second contact surface of the metal heat conduction layer contact the heat source; B. after the metal heat conduction layer absorbs heat, the The convex part conducts heat energy to the microporous plate, and dissipates heat through the microporous plate.
其中，所述金属导热层的熔点高于所述热源的温度，所述金属导热层呈固态。Wherein, the melting point of the metal heat conducting layer is higher than the temperature of the heat source, and the metal heat conducting layer is solid.
其中，所述金属导热层的熔点低于所述热源的温度，所述金属导热层吸热熔融并填入该微孔板的多个贯穿孔。Wherein, the melting point of the metal heat conduction layer is lower than the temperature of the heat source, and the metal heat conduction layer absorbs heat and melts and fills the plurality of through holes of the microporous plate.
本发明的有益效果：Beneficial effects of the present invention:
1.本发明的传热结构，由于所述金属导热层搭配所述微孔板使用增加了导热面积，因此可忽略在散热过程中所述金属导热层所产生的裂纹面积对导热效果的影响；再者，所述金属导热层裂纹处的间隙能与所述微孔板上的贯穿孔连通形成热对流通道，将受热膨胀的空气带出，本发明同时以对流和热传导方式带走热量，利用热空气对流弥补热传导散热的不足，突破传统作法，而利用不完全接触的间隙作为散热通道，可称为容许介面间隙和裂纹的散热板材，能改善界面空气层等对热传导的阻断现象，使所述金属导热层不受裂纹影响其导热效果。1. In the heat transfer structure of the present invention, since the use of the metal heat conduction layer with the microporous plate increases the heat conduction area, the influence of the crack area produced by the metal heat conduction layer on the heat conduction effect during the heat dissipation process can be ignored; Furthermore, the gap at the crack of the metal heat conducting layer can communicate with the through hole on the microporous plate to form a thermal convection channel, and take out the air that is heated and expanded. The present invention simultaneously takes away heat by convection and heat conduction. Use hot air convection to make up for the lack of heat conduction and heat dissipation, break through the traditional practice, and use incomplete contact gaps as heat dissipation channels. It can be called a heat dissipation plate that allows interface gaps and cracks, and can improve the blocking of heat conduction by the interface air layer. The heat conduction effect of the metal heat conduction layer is not affected by cracks.
2.本发明的传热结构，通过所述金属导热层搭配该微孔板使用，让热膨胀系数大的所述金属导热层在热涨冷缩的过程中更具有延展的空间，能分散膨胀造成的尺寸变化，且越多的所述贯穿孔分散效果越好，从而降低所述金属导热层的裂化程度，此设计能使所述金属导热层的选择范围更多，不受限于其热膨胀系数。2. The heat transfer structure of the present invention, through the use of the metal heat conduction layer with the microporous plate, allows the metal heat conduction layer with a large thermal expansion coefficient to have more room for expansion during the process of thermal expansion and contraction, and can disperse the expansion caused by The size of the metal heat conduction layer changes, and the more the through holes, the better the dispersion effect, thereby reducing the cracking degree of the metal heat conduction layer. This design can make the metal heat conduction layer have more choices, and is not limited by its thermal expansion coefficient .
3.本发明的传热结构，在使用的过程中，若所述热源的温度高于所述金属导热层的熔点而使其呈熔融状时，所述金属导热层会因毛细作用等结合在所述微孔板的多个贯穿孔内缘，不会随意流动而溢流出所述微孔板；另外，熔融状的所述金属导热层能更贴合所述热源和所述微孔板，由于所述热源和所述微孔板表面很难完全平行，因此本发明通过将熔融状的所述金属导热层置于所述热源和所述微孔板之间，使所述热源与所述微孔板表面从点接触转为面接触，大量增加传热量，即使冷却固化后，所述金属导热层仍能维持面接触。3. In the process of using the heat transfer structure of the present invention, if the temperature of the heat source is higher than the melting point of the metal heat conduction layer to make it molten, the metal heat conduction layer will be bonded to the heat transfer structure due to capillary action, etc. The inner edges of the multiple through holes of the microporous plate will not flow freely and overflow the microporous plate; in addition, the molten metal heat conducting layer can fit the heat source and the microporous plate more closely, Since it is difficult for the heat source to be completely parallel to the surface of the microporous plate, the present invention places the molten metal heat conducting layer between the heat source and the microporous plate to make the heat source and the micropore plate The surface of the microporous plate changes from point contact to surface contact, which greatly increases heat transfer. Even after cooling and solidification, the metal heat conduction layer can still maintain surface contact.
4.本发明的传热结构，所述金属导热层与所述微孔板在贴合的过程中，所述金属导热层与所述微孔板之间所包覆的空气可由所述微孔板的多个贯穿孔溢出，以避免包覆在所述金属导热层与所述微孔板之间的气泡会形成热点，导致散热效果不佳。4. In the heat transfer structure of the present invention, during the bonding process of the metal heat conducting layer and the microporous plate, the air enclosed between the metal heat conducting layer and the microporous plate can pass through the micropores The multiple through-holes of the plate are overflowed, so as to prevent the air bubbles covered between the metal heat-conducting layer and the microporous plate from forming hot spots, resulting in poor heat dissipation effect.
附图说明Description of drawings
图1为本发明第一实施例的结构示意图。Fig. 1 is a schematic structural diagram of the first embodiment of the present invention.
图2为本发明第一实施例的局部结构示意图。Fig. 2 is a partial structural schematic diagram of the first embodiment of the present invention.
图3为本发明贯穿孔的断面呈直立三角形的局部结构示意图。Fig. 3 is a schematic diagram of a partial structure of a through hole of the present invention with a cross-section of an upright triangle.
图4为本发明微孔板的表面为具有多沟渠的表面的局部结构示意图。Fig. 4 is a schematic diagram of a partial structure of the surface of the microporous plate of the present invention having multiple grooves.
图5为本发明金属导热层呈固态的使用示意图。Fig. 5 is a schematic diagram of the use of the metal heat conducting layer in a solid state according to the present invention.
图6为本发明金属导热层呈液态的使用示意图。Fig. 6 is a schematic diagram of the use of the metal heat conducting layer in liquid state according to the present invention.
其中in
(1)微孔板(1) Microplate
(11)贯穿孔(11) Through hole
(12)表面(12) surface
(2)合金(2) alloy
(21)第一接触面(21) The first contact surface
(22)第二接触面(22) Second contact surface
(23)凸部(23)Convex part
(A)热源(A) heat source
具体实施方式Detailed ways
综合上述技术特征，本发明所述的传热结构、其制造方法及其散热方法的主要有益效果可在下述实施例中清楚呈现。Based on the above technical features, the main beneficial effects of the heat transfer structure, its manufacturing method and heat dissipation method of the present invention can be clearly presented in the following embodiments.
本发明传热结构的第一实施例请参阅图1及图2所示，包括：一微孔板1，具有可以产生毛细作用的多个贯穿孔11，所述贯穿孔11的孔径介于10微米至90微米之间，且所述贯穿孔11的断面呈沙漏形状，而所述贯穿孔11的断面也可呈直立三角形(请配合参阅图3)或其它形状，并不加以限定；一金属导热层2，有一第一接触面21及一第二接触面22，所述第一接触面21用于接触所述微孔板1的一表面12，所述表面12在本实施例中为粗糙表面，而所述表面12也可为具有多沟渠的表面(请配合参阅图4)，在本实施例中所述表面12为粗糙表面，所述第二接触面22用于接触一热源A，所述热源A可以是LED电子产品、液晶模组或是其它需散热的产品，所述金属导热层2有多个凸部23对应伸入所述贯穿孔11，而结合在所述贯穿孔11内缘。需要特别说明的是，所述贯穿孔11的断面形状的设计与所述微孔板1的表面粗糙度或沟渠的设计，都可使所述金属导热层2与所述微孔板1间的接触面积变大，大量增加传热量，从而大幅提升传热效果。Please refer to Fig. 1 and Fig. 2 for the first embodiment of the heat transfer structure of the present invention, comprising: a microporous plate 1 having a plurality of through holes 11 capable of generating capillary action, and the diameter of the through holes 11 is between 10 Micron to 90 microns, and the cross-section of the through hole 11 is an hourglass shape, and the cross-section of the through hole 11 can also be an upright triangle (please refer to Figure 3) or other shapes, without limitation; a metal The heat conduction layer 2 has a first contact surface 21 and a second contact surface 22, the first contact surface 21 is used to contact a surface 12 of the microporous plate 1, and the surface 12 is rough in this embodiment surface, and the surface 12 can also be a surface with multiple grooves (please refer to FIG. 4), in this embodiment, the surface 12 is a rough surface, and the second contact surface 22 is used to contact a heat source A, The heat source A can be an LED electronic product, a liquid crystal module or other products that require heat dissipation. The metal heat conduction layer 2 has a plurality of protrusions 23 correspondingly protruding into the through hole 11, and combined in the through hole 11 inner edge. It should be particularly noted that the design of the cross-sectional shape of the through hole 11 and the design of the surface roughness or the trench of the microporous plate 1 can make the distance between the metal heat conducting layer 2 and the microporous plate 1 The larger the contact area, the greater the amount of heat transfer, thereby greatly improving the heat transfer effect.
所述金属导热层2选自铋、锡、铅、铜、铟、镉、铊、镍、锗、银、锑、镓、铟、钾及钠中至少两种，且所述金属导热层的熔点介于6℃至140℃之间，优选介于40℃至100℃之间。所述金属导热层2可以使用罗斯易熔合金(Rose's metal)(含50％的铋、25％的铅及25％的锡，熔点98℃)、Cerrosafe(含42.5％的铋、37.7％的铅、11.3％的锡及8.5％的镉，熔点74℃)、伍德合金(Wood's metal)(含50％的铋、26.7％的铅、13.3％的锡及10％的镉，熔点70℃)、Field's metal(含32.5％的铋、16.5％的锡及51％的铟，熔点62℃)、Cerrolow 136(含49％的铋、18％的铅、12％的锡及21％的铟，熔点58℃)、Cerrolow 117(含44.7％的铋、22.6％的铅、8.3％的锡、19.1％的铟及5.3％的镉，熔点47.2℃)、双铅锡镉式铊(含40.3％的铋、22.2％的铅、10.7％的锡、17.7％的铟、8.1％的镉及1.1％的铊，熔点41.5℃)、低温无铅焊锡(含42％的锡及58％的铋，熔点138℃)、SN100C无铅焊锡(含99.245％的锡、0.7％的铜、0.05％的镍及0.005％的锗)、低成本无铅焊锡(含99.3％的锡及0.7％的铜)、一般无铅焊锡(含99％的锡、0.7％的铜及0.3％的银)、常用无铅焊锡(含96.5％的锡、3％的银及0.5％的铜)、晶格更细且低温时性能好的无铅焊锡(含96.2％的锡、2.5％的银、0.8％的铜及0.5％的锑)、镓铟液态合金(含90％的镓及10％的铟，熔点17.2℃)、镓铟液态合金(含80％的镓及20％的铟，熔点16.7℃)或钾钠合金(含56％的钾及44％的钠，熔点6.8℃)等。The metal heat conducting layer 2 is selected from at least two of bismuth, tin, lead, copper, indium, cadmium, thallium, nickel, germanium, silver, antimony, gallium, indium, potassium and sodium, and the melting point of the metal heat conducting layer is Between 6°C and 140°C, preferably between 40°C and 100°C. The metal heat conduction layer 2 can use Rose's fusible alloy (Rose's metal) (containing 50% bismuth, 25% lead and 25% tin, melting point 98 ℃), Cerrosafe (containing 42.5% bismuth, 37.7% lead , 11.3% tin and 8.5% cadmium, melting point 74°C), Wood's metal (containing 50% bismuth, 26.7% lead, 13.3% tin and 10% cadmium, melting point 70°C), Field's metal (32.5% bismuth, 16.5% tin and 51% indium, melting point 62°C), Cerrolow 136 (containing 49% bismuth, 18% lead, 12% tin and 21% indium, melting point 58°C ), Cerrolow 117 (containing 44.7% bismuth, 22.6% lead, 8.3% tin, 19.1% indium and 5.3% cadmium, melting point 47.2 ℃), double lead tin cadmium thallium (containing 40.3% bismuth, 22.2 % lead, 10.7% tin, 17.7% indium, 8.1% cadmium and 1.1% thallium, melting point 41.5°C), low-temperature lead-free solder (containing 42% tin and 58% bismuth, melting point 138°C), SN100C lead-free solder (containing 99.245% tin, 0.7% copper, 0.05% nickel and 0.005% germanium), low-cost lead-free solder (containing 99.3% tin and 0.7% copper), general lead-free solder ( Contains 99% tin, 0.7% copper and 0.3% silver), commonly used lead-free solder (containing 96.5% tin, 3% silver and 0.5% copper), finer crystal lattice and good performance at low temperature Lead solder (containing 96.2% tin, 2.5% silver, 0.8% copper and 0.5% antimony), gallium indium liquid alloy (containing 90% gallium and 10% indium, melting point 17.2 ℃), gallium indium liquid alloy (containing 80% gallium and 20% indium, melting point 16.7°C) or potassium-sodium alloy (containing 56% potassium and 44% sodium, melting point 6.8°C), etc.
本发明传热结构的第一实施例的制造方法有两种，第一种制造方法包括以下步骤：A.所述热源A为一LED电子产品的基板，使所述金属导热层2的第二接触面22接触所述基板，再使所述微孔板1与所述金属导热层2的第一接触面21相接触，其中所述金属导热层2可以薄片状或粉末状的方式接触所述微孔板1；B.通过所述LED电子产品的运作，使所述基板的温度逐渐上升，并在所述基板的温度高于所述金属导热层2的熔点时，所述金属导热层2吸热熔融而产生所述凸部23渗入所述贯穿孔内，以结合在所述微孔板1上，同时也可使包覆在所述微孔板1与所述金属导热层2之间的空气由所述微孔板1的贯穿孔11溢出，以避免包覆在所述金属导热层2与所述微孔板1之间的气泡会形成热点，导致散热效果不佳，接着再以加压夹持的方式使所述金属导热层2可以更紧密地与所述微孔板1贴合。There are two manufacturing methods for the first embodiment of the heat transfer structure of the present invention. The first manufacturing method includes the following steps: A. The heat source A is a substrate of an LED electronic product, and the second metal heat conducting layer 2 The contact surface 22 is in contact with the substrate, and then the microporous plate 1 is in contact with the first contact surface 21 of the metal heat conduction layer 2, wherein the metal heat conduction layer 2 can contact the Microporous plate 1; B. Through the operation of the LED electronic products, the temperature of the substrate is gradually increased, and when the temperature of the substrate is higher than the melting point of the metal heat conduction layer 2, the metal heat conduction layer 2 The heat-absorbing melting causes the protrusion 23 to infiltrate into the through hole, so as to be combined on the microporous plate 1, and at the same time, it can be coated between the microporous plate 1 and the metal heat conducting layer 2 The air overflows from the through hole 11 of the microporous plate 1, so as to avoid the bubbles covered between the metal heat conducting layer 2 and the microporous plate 1 from forming hot spots, resulting in poor heat dissipation, and then The way of pressing and clamping enables the metal heat conducting layer 2 to be more closely attached to the microporous plate 1 .
本发明传热结构的第一实施例的第二种制造方法，则包括以下步骤：A.所述热源A为一LED电子产品的基板，使所述金属导热层2的第二接触面22接触所述基板，再使所述微孔板1与所述金属导热层2的第一接触面21相接触，其中所述金属导热层2可以薄片状或粉末状的方式接触所述微孔板1；B.将相互接触的所述微孔板、所述金属导热层与所述基板置于一供热单元中加热，所述供热单元可为烘箱或烤炉，当所述供热单元提供的温度高于所述金属导热层2的熔点时，所述金属导热层2吸热熔融而产生所述凸部23渗入所述贯穿孔内，以结合在所述微孔板1上，同时也可使包覆在所述微孔板1与所述金属导热层2之间的空气由所述微孔板1的贯穿孔11溢出，以避免包覆在所述金属导热层2与所述微孔板1之间的气泡会形成热点，导致散热效果不佳，接着再以加压夹持的方式使所述金属导热层2可以更紧密地与所述微孔板1贴合。The second manufacturing method of the first embodiment of the heat transfer structure of the present invention includes the following steps: A. The heat source A is a substrate of an LED electronic product, and the second contact surface 22 of the metal heat conduction layer 2 is brought into contact with The substrate, and then the microporous plate 1 is in contact with the first contact surface 21 of the metal heat conducting layer 2, wherein the metal heat conducting layer 2 can contact the microporous plate 1 in a flake or powder form B. placing the contacted microporous plate, the metal heat-conducting layer and the substrate in a heating unit for heating, the heating unit can be an oven or an oven, when the heating unit provides When the temperature is higher than the melting point of the metal heat-conducting layer 2, the heat-absorbing and melting of the metal heat-conducting layer 2 produces the protrusions 23 infiltrating into the through-holes to be combined with the microporous plate 1, and at the same time The air coated between the microporous plate 1 and the metal heat conducting layer 2 can overflow from the through hole 11 of the microporous plate 1, so as to avoid being coated between the metal heat conducting layer 2 and the microporous Bubbles between the orifice plates 1 will form hot spots, resulting in poor heat dissipation effect, and then the metal heat conducting layer 2 can be more closely attached to the micro-orifice plate 1 by means of pressurization and clamping.
需要再特别说明的是，第一种制造方法先依次在所述基板上放置所述金属导热层2与所述微孔板1，然后在该LED电子产品的运作过程中，制成本发明的传热结构，并进行散热；而第二种制造方法则将相互接触的所述微孔板1、所述金属导热层2与所述基板先通过所述供热单元制成本发明的传热结构，再将结合有所述微孔板1与所述金属导热层2的基板组装至所述LED电子产品中，以在所述LED电子产品的运作过程中进行散热。It needs to be further explained that in the first manufacturing method, the metal heat conduction layer 2 and the microporous plate 1 are placed on the substrate in sequence, and then the LED electronic product of the present invention is manufactured during the operation process. heat transfer structure, and dissipate heat; and the second manufacturing method is to make the heat transfer unit of the present invention through the heat supply unit first through the contacting microporous plate 1, the metal heat conduction layer 2 and the substrate. structure, and then assemble the substrate combined with the microporous plate 1 and the metal heat conduction layer 2 into the LED electronic product to dissipate heat during the operation of the LED electronic product.
本发明传热结构的第一实施例的散热方法，包括以下步骤：A.使所述金属导热层2的第二接触面22接触所述热源A；B.所述金属导热层2吸热后，除了所述第一接触面21能导热外，所述凸部23将热能传导至所述微孔板1，通过所述微孔板1进行散热。需要特别说明的是，在使用的过程中，当所述金属导热层2的熔点高于所述热源A的温度，请参阅图5所示，所述金属导热层2呈固态，因此在受温度影响的热胀冷缩过程中的体积变化较小，因而所述金属导热层2不易有裂化的现象产生，从而维持良好的传热效果；而当所述金属导热层2的熔点低于所述热源A的温度，请参阅图6所示，所述金属导热层2吸热熔融并使其凸部23因毛细作用等而更深入所述贯穿孔11内缘，增加了所述金属导热层2与所述微孔板1的接触面积，因而可降低在散热过程中所述金属导热层2所产生的裂纹对导热效果的影响，此外所述金属导热层2在热胀冷缩的过程中，由于所述微孔板1上的贯穿孔11提供所述金属导热层2延展的空间，因此能分散膨胀造成的尺寸变化，从而降低所述金属导热层2的裂化程度，而在此设计下本发明能使所述金属导热层的选择范围更多，不受限于其热膨胀系数。而且所述微孔板1上的贯穿孔11同时提供未来裂纹区域的热空气对流空间，即使裂纹无法完全避免，也能通过该热对流空间设计，减少热淤积于裂纹区域，强化传热效果。The heat dissipation method of the first embodiment of the heat transfer structure of the present invention includes the following steps: A. making the second contact surface 22 of the metal heat conducting layer 2 contact the heat source A; B. after the metal heat conducting layer 2 absorbs heat , except that the first contact surface 21 can conduct heat, the convex portion 23 conducts heat energy to the microporous plate 1 , and dissipates heat through the microporous plate 1 . It should be noted that during use, when the melting point of the metal heat conducting layer 2 is higher than the temperature of the heat source A, as shown in FIG. The volume change in the process of thermal expansion and contraction is small, so the metal heat conduction layer 2 is not easy to crack, so as to maintain a good heat transfer effect; and when the melting point of the metal heat conduction layer 2 is lower than the The temperature of the heat source A, please refer to Fig. 6, the heat-absorbing and melting of the metal heat-conducting layer 2 makes the protrusion 23 go deeper into the inner edge of the through-hole 11 due to capillary action, etc., increasing the heat-conducting metal layer 2 The contact area with the microporous plate 1 can thus reduce the influence of the cracks produced by the metal heat conduction layer 2 on the heat conduction effect during the heat dissipation process. In addition, the metal heat conduction layer 2 is in the process of thermal expansion and contraction, Since the through-holes 11 on the microporous plate 1 provide space for the expansion of the metal heat-conducting layer 2, the dimensional changes caused by expansion can be dispersed, thereby reducing the degree of cracking of the metal heat-conducting layer 2, and this design under this design The invention enables more options for the metal heat conducting layer, without being limited by its thermal expansion coefficient. Moreover, the through holes 11 on the microporous plate 1 also provide hot air convection space in the future crack area. Even if the crack cannot be completely avoided, the thermal convection space design can reduce heat deposition in the crack area and enhance the heat transfer effect.
需要再说明的是，所述金属导热层2呈熔融状时会因毛细作用等结合在所述微孔板1的贯穿孔11内缘，不会随意流动而溢流出所述微孔板1。另外，熔融状的所述金属导热层2能更贴合所述热源A和所述微孔板1，通过将熔融状的所述金属导热层2置于所述热源A和所述微孔板1之间，使表面很难完全平行的所述热源A和所述微孔板1，从点接触转为面接触，大量增加传热量，而且即使冷却固化后，所述金属导热层2仍能维持面接触。It should be further explained that when the metal heat conducting layer 2 is molten, it will be bound to the inner edge of the through hole 11 of the microporous plate 1 due to capillary action, etc., and will not flow freely and overflow the microporous plate 1 . In addition, the molten metal heat conduction layer 2 can be more attached to the heat source A and the microporous plate 1, by placing the molten metal heat conduction layer 2 on the heat source A and the microporous plate 1, the heat source A and the microporous plate 1, which make the surface difficult to be completely parallel, change from point contact to surface contact, greatly increasing heat transfer, and even after cooling and solidification, the metal heat conducting layer 2 can still Maintain surface contact.
再配合参阅表1、表2、表3及表4，为所述微孔板搭配不同熔点的金属导热层用于接触LED灯的基板的测试数据，其中表1示出了使用60℃低熔点的金属导热层的热导率，表2示出了使用70℃低熔点的金属导热层的热导率，表3示出了使用90℃低熔点的金属导热层的热导率，表4示出了使用60℃、70℃、90℃低熔点金属导热层以1:1:1混合所形成的金属导热层的热导率，且表1至表4均分别有压延及未压延两组数据，压延可使金属导热层预成型薄片状，有利于金属导热层均匀分布；从实验所示，低熔点金属导热层因受到LED灯的基板的高温，使低熔点金属导热层可能形成三种形态，如60℃低熔点金属导热层呈液态、70℃低熔点金属导热层和前述混合三种的低熔点金属导热层呈固液态、90℃低熔点金属导热层呈固态，并如以下的表1、表2、表3及表4所示，固态的热导率为23W/m2K，固液态的热导率为21-22W/m2K，液态的热导率为21-22W/m2K。Referring to Table 1, Table 2, Table 3 and Table 4, the microporous plate is equipped with metal heat-conducting layers with different melting points for the test data of the substrate contacting the LED lamp, wherein Table 1 shows the use of 60 ° C low melting point The thermal conductivity of the metal heat-conducting layer, Table 2 shows the thermal conductivity of the metal heat-conducting layer with a low melting point of 70°C, Table 3 shows the thermal conductivity of a metal heat-conducting layer with a low melting point of 90°C, and Table 4 shows The thermal conductivity of the metal heat-conducting layer formed by mixing 60°C, 70°C, and 90°C low-melting-point metal heat-conducting layers at a ratio of 1:1:1 is shown, and Tables 1 to 4 have two sets of data of calendering and non-calendering respectively. , calendering can make the metal heat conduction layer preformed into thin sheets, which is conducive to the uniform distribution of the metal heat conduction layer; from the experiment, the low melting point metal heat conduction layer may form three forms due to the high temperature of the substrate of the LED lamp. , such as the low-melting-point metal heat-conducting layer at 60°C is in a liquid state, the low-melting-point metal heat-conducting layer at 70°C and the above-mentioned three kinds of low-melting-point metal heat-conducting layers are in a solid-liquid state, and the low-melting-point metal heat-conducting layer is in a solid state at 90°C, as shown in the following table 1 , Table 2, Table 3 and Table 4, the thermal conductivity of the solid state is 23W/m 2 K, the thermal conductivity of the solid-liquid state is 21-22W/m 2 K, and the thermal conductivity of the liquid state is 21-22W/m 2 K.
表1、所述微孔板搭配60℃低熔点的金属导热层Table 1. The microporous plate is equipped with a metal heat-conducting layer with a low melting point of 60°C
表2、所述微孔板搭配70℃低熔点的金属导热层Table 2. The microporous plate is equipped with a metal heat-conducting layer with a low melting point of 70°C
表3、所述微孔板搭配90℃低熔点的金属导热层Table 3. The microporous plate is equipped with a metal heat-conducting layer with a low melting point of 90°C
表4、所述微孔板搭配以1:1:1混合前述三种金属导热层的低熔点金属导热层Table 4. The microporous plate is matched with a low-melting-point metal heat-conducting layer mixed with the aforementioned three metal heat-conducting layers in a ratio of 1:1:1
本发明的传热结构，由于所述金属导热层搭配所述微孔板使用增加了导热面积，因此可忽略在散热过程中所述金属导热层所产生的裂纹对导热效果的影响；再者，通过所述金属导热层搭配所述微孔板使用，使热膨胀系数大的所述金属导热层在热胀冷缩的过程中更具有延展的空间，从而降低所述金属导热层的裂化程度。In the heat transfer structure of the present invention, since the use of the metal heat conduction layer with the microporous plate increases the heat conduction area, the influence of the cracks generated by the metal heat conduction layer on the heat conduction effect during the heat dissipation process can be ignored; moreover, By using the metal heat conduction layer with the microporous plate, the metal heat conduction layer with a large thermal expansion coefficient has more room for expansion during thermal expansion and contraction, thereby reducing the degree of cracking of the metal heat conduction layer.
综合上述实施例的说明，应当可以充分了解本发明的操作、使用及本发明产生的功效，但以上所述实施例仅为本发明的较佳实施例，应当不能以此限定本发明实施的范围，即依照本发明申请专利范围及发明说明内容所作简单的等效变化与修饰，皆在本发明涵盖的范围内。Based on the description of the above-mentioned embodiments, it should be possible to fully understand the operation of the present invention, use and the effects produced by the present invention, but the above-described embodiments are only preferred embodiments of the present invention, and should not limit the scope of the present invention. , that is, simple equivalent changes and modifications made according to the patent scope of the present invention and the content of the description of the invention are all within the scope of the present invention.
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| TW103115816 | 2014-05-02 |
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| CN109869642B (en) * | 2019-01-14 | 2023-09-29 | 江苏新西贝机电有限公司 | Heat radiation heat conduction type LED high temperature resistant factory lamp |
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| CN1805676A (en) * | 2005-01-15 | 2006-07-19 | 富准精密工业(深圳)有限公司 | Radiator and its making method |
| TW200911408A (en) * | 2007-09-05 | 2009-03-16 | Thermoshuttle Co Ltd | Manufacturing method of ultra-thin low melting alloy foil |
| CN103276277A (en) * | 2013-05-20 | 2013-09-04 | 长沙艾思柯新材料科技有限公司 | Preparation method and device of high-volume fraction and high-intensity aluminum silicon carbide composite material |
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| US8852359B2 (en) * | 2011-05-23 | 2014-10-07 | GM Global Technology Operations LLC | Method of bonding a metal to a substrate |
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| TW200911408A (en) * | 2007-09-05 | 2009-03-16 | Thermoshuttle Co Ltd | Manufacturing method of ultra-thin low melting alloy foil |
| CN103394668A (en) * | 2008-10-03 | 2013-11-20 | 住友电气工业株式会社 | Composite member |
| CN103276277A (en) * | 2013-05-20 | 2013-09-04 | 长沙艾思柯新材料科技有限公司 | Preparation method and device of high-volume fraction and high-intensity aluminum silicon carbide composite material |
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