200911408 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種金屬薄片的薄化方法，特別是關於 一種低熔點合金箔片的薄化方法。 【先前技術】 隨著電子科技的進步，資訊處理晶片朝向電晶體高密 度化、傳輸高速化、整合多功能化以及體積小型化發展。 上述功能的提升衍生出發熱密度愈來愈高，其累積的熱量 將使電子元件的工作溫度增加，而造成熱負荷愈來愈高。 熱負荷的增加將會嚴重的影響晶片等電子元件的使用壽命 及可靠度。若電子散熱的問題無法適當解決，將阻礙晶片 與電子產品的推出及產業發展。因此，如何提升高性能熱 管理材料，已是電子產業一個刻不容緩的課題。 伴隨著晶片及電子元件的散熱需求’刺激了散熱元 件、材料等電子散熱產品的多樣化與技術創新。電子散熱 產品主要有散熱裝置(如：熱管、散熱器及風扇·.等）與熱 界面材料(Thermal Interface Materials, TIM)兩種類別。 請參照圖一，其係為習知散熱系統示意圖。如圖所示， 此散熱系統10至少包括一電子元件12及一散熱器u。其 中’電子元件12設置於一電路基板13上，散熱器丨丨設置 於電子元件12上方。熱界面材料14設置於電子元件12 與散熱器11之間。詳細地說，熱界面材料14之兩側面分 別接觸於散熱器11的下表面以及電子元件12的上表面。 5 200911408 。熱界面材料14 t一種使用於晶片構裝、電子元件與 =器之間的導熱介質’其係利用自身可流動或預熱炫融的 特性填補前述元件面的微·，耻減少晶片埶量傳 遞至基板或至散絲置的熱阻抗，以提高晶績熱 界面材料馳能指標主要有熱傳導率⑻與熱阻抗 ▲)’熱料率係指熱量在材_部熱料的能力，熱阻 抗係指跨越不W料介__導之效益。—般來說”，’執 界面材料的熱料糊愈高、界面接合厚度欲小，則教界、 面材料之熱阻抗(R)愈低。 ’' 消費性電子產品所使㈣熱界面材料主要以散轨膏 (thermal _Se)和相變化散熱貼片（細e ch奪 thermal pad)為主。但是目前上述兩種熱界面材料之散献 效能仍為有限，熱傳導率⑻最多達到·熱阻抗(r、; 約為0.25〜G.4crt/W。另外，散齡.等熱界面材料在航 循環(temperature eyeling)條件下，雜魏有明顯衰退 的情形巧此’在晶収能不斷增強，熱負荷也隨之增加 的趨勢下’上述熱界面材料之可#_然不縣來產業之 為了因應日後更加嚴苛的熱管理需求，—種稱為低熔 點。金括月(Low melting alloy，LMA)的熱界面材料被開發 出來。低熔點合錢片具有點、高熱導、熱溶相變化 填補介面微孔騎特性，其主要係由必要的銦⑽以及麵 (Βι)、錫(Sn)、和鋅（Zn)等元素之部份或全部組合而成， 組成元素料Sn_In、In也Sn幻罐|Zn。此外，前述 主要組成合金更可包括至少—種非毒害環境元素，例如 200911408 銀、銅、鈦、鍺、紹、鋪、棚忐功埜一主 „ 卹鑭或矽專兀素。低熔點合金 熔點變化 括片24可依上述組成元素的不同而有坑至坑不等之 在現階段的實驗數射，低魅合金W的變態溫度 約為6(TC，熱傳導率(Q)可達可達2〇w/mk以上，熱阻抗⑻ 小於0. WK/W。因此，低溶‘點合金箱片具有極高的散熱效 能。 承上所述’散熱系財熱阻抗⑻愈低時，散熱效果愈好， 所以低雜合錢片厚度愈小時，則可具有更佳的散熱效 果。凊參照® — ’其係為習知低熔點合金郎的薄化製作 方法。如騎示，薄化方式_由—觀裝置22在特定條 件下對娜齡金Μ 24進行城地雛概_峋)動 作。 傳統的輥輪軋延製程主要仙來將銅(Cu)、铭(Α1)、 金(Cu)..等具有極姐展性及材料驗的金屬板片，進行 薄化的方式。輥輪軋延的過財，所使_初始材料必須 是厚度均⑽金屬板片，且厚度約為i〜2mm。 一般來說，厚度2mm的金屬板片，在輥輪壓下率2〇% 的狀況下，必須要經過13觀延健，方能薄化至〇Jmm 的薄$片。細’在同樣的環雜件下，厚度2臟的金 屬板片欲薄化至〇.〇4mm的薄箱片，則需要高達道的軋 延作業。 一因此，利用輥輪軋延製程來薄化金屬板片，可以說是 相當耗時費工。而且’輥壓裝置也必須非常的精密，否則 即使金屬·_展減淋^度健，也滅容易產生 7 200911408 軋延過程中破損失敗的情形。 在實驗過程中發現，若利用輥輪軋延製程來薄化低熔 點合金Ιϋ片(Low melting alloy，LMA)，會有下列的問題產 生。 一、 低溶點合金箔片的材料強度並不佳，而報輪軋延 製程必須經過反覆地激烈加工，這將使合金箔片的材料結 構產生變化，而導致加工硬化，使後續軋延作業益形困難。 二、 利用輥輪軋延製程所薄化而得的低熔點合金箔 片’在室溫下若經過2〜3個月的存放後，會發生脆化的現 象’亦即所謂的「時效脆化」。 如圖二A所示’經過反覆地激烈加工之低炫點合金落 片其材料微結構產生變化，而含有大量的大角度(或銳角） 的金屬相。因此，經過一段時間後，在加工殘留應力的作 用下’低熔點合金箔片的龜裂就會由這些尖銳角處產生， 而造成脆化及破裂，如圖三B所示。 因此’習知輥輪軋延製程最多僅能將低溶點合金箔片 24的厚度薄化至〇 〇5mm，且很容易出現合金箔片24結構 脆化’甚至破裂的失效情形。 另外’除了輥輪軋延製程之外，亦有一個快速凝固製 程(Rapid Solidification Process，RSP)可用來製作合金箔 片。此製程係將高溫熔解的合金溶液設置於一具有細縫的 溶液槽中。藉由加壓裝置將熔融合金溶液由細縫擠出，而 形成一「水瀑」’接著急速冷卻且貼附在一高速旋轉且具冷 卻裝置的銅輪上，進而形成一連續的合金箔片。 8 200911408 但是’低熔點合金箔片（Low melting alloy, LMA)的材 料熔點較一般合金材料低許多，使得在製作過程中無法具 有足夠的溫差’亦即冷卻速率。因此’使用此快速成型製 程所製作出來的低熔點合金箔片會有不連續、易脆、具孔 洞及厚度不均··等問題發生。 因此，如何有效薄化低炼點合金箔片的厚度，且保有 其應有的材料結構及特性，係為當前技術所必需。 【發明内容】 本發明之一目的係在於藉由本發明之製造方法，使製 4出來的低熔點合金箔片，可達到極薄的厚度，且不會發 生結構脆化或破裂的問題。 ^本發明之另一目的係在於應用本發明所製造出來的極 薄低溶點合金箔片，可以有效降低散熱系統中熱阻抗（R)， 並提升散熱系統的散熱效果。 ^本發明之另一目的係在於應用本發明所製造出來的極 薄低溶點合金則，可以有效避钱溶點合金^受熱溶 融時，洩漏至散熱系統外的情形。 … 本發明提供一種低熔點合金箔片之製造方法，製造過 程係藉由-模具組綠行。此模具組具有—上模仁與一下 模仁，上模仁具有—平坦的下表面，下模仁具有一平坦的 上表面且面向上模仁之下表面，此製造方法包括下列步 ，。放置—低舰合金材料於下模仁之上表面上方。加熱 換具組，使低魅合金材料獅。藉由上模仁或下模仁之 200911408 移動，縮減上模仁之下表面與下模仁之上表面之間距，使 低炫點合金㈣觀合於上谢:與下模仁之間。最後，冷 卻模具組，使紐之低合金材_成健點合金箱 本發明提供-種低熔齡金則之製造方法立係藉 由具有-上模仁與-下模仁的—模具組來執行。上^仁^ 有-平坦的下表面，下模仁具有—平坦的上表面且面向1 模仁之下表面，此製造方法包括下列步驟。 設置一熔融之低熔點合金材料於下模仁之上表面上。 縮減上模仁之下表面與下模仁之上表面之間距，使低溶點 合金材料健合於上齡與下账之fa1。最後，冷卻模具 組，使熔融之低熔點合金材料形成低熔點合金箔片。、/、 本發明提供一種低熔點合金箔片之製造方法，其係藉 由具有一上模仁與一下模仁的一模具組來執行。上模仁具 有一平坦的下表面，下模仁具有一平坦的上表面且面向上 模仁之下表面，此製造方法包括下列步驟。 將模具組置放於一具有熔融之低熔點合金材料之槽 内’以使上模仁與下模仁之間充滿低熔點合金材料。縮減 上模仁之下表面與下模仁之上表面之間距，使低，熔點合金 材料被壓合於上模仁與下模仁之間。將模具組移至槽外， 並冷卻模具組，使熔融之低炫點合金材料形成低熔點合金 箔片。 關於本發明之優點與精神，以及更詳細的實施方式可 以藉由以下的實施方式以及所附圖式得到進一步的暸解。 200911408 【實施方式】 請參照圖四八與_ B ’其係為本發明健點合 片之製造方法示意圖。 如圖四A所示，低溶點合金箔片34的製造過程係藉由 一模具組30來執行。此模具組30至少具有一上模仁31 與-下模仁32，上模仁31具有一平坦的下表面3k、，下模 4 32 /、有平坦的上表面32a，且其面向上模仁μ 表面31a。 製造方法至少包括下列轉。放置健點合金材料％ =下模仁32之上表面32a上方’此步驟中之低炼點合金材 料34係為-起始材料，可以是固態或液態，而形狀可 塊狀、板片狀、粒狀、球狀或滴狀。 接著’加熱模具組30 ’使低熔點合金材料34溶融。 ^ ’在健實施财，加熱之溫親_介於低炼點合 金材料34之_紙舰點再加1()〜2(rc之間。 =齡金材料34受熱熔轉，藉由上模仁&下移 :下二322ί!Γ作，來縮減上模仁31之下表面仙 ，於上_下㈣間之間二= :熔點合金材料34之上下空間被擠壓而縮減，故 Γ ㈣％伽_，有物至流出間隙 門拓上Ϊ縮減上模仁31之下表面與下模仁32之上表面之 叫t:气所謂的合模過程，此過程之合模靜賊力 為2〜1〇kg/cm ’合模速度為5〜20Cffi/min。 11 200911408 經過合模雜後，冷卻模胁3Q與麟點合金材料 34，使低熔點合金材料34固化成所需之低熔點合金箔片 34。其中，由於上述低熔點合金材料34之上下空間被壓擠 而縮減，所以固化後之低熔點合金箔片34便具有更薄的厚 度。最後，移開上模仁31與下模仁32，以取出所需之低 熔點合金箔片34。 _ 上述之低熔點合金箔片34具有低熔點、高熱導、熱熔 相變化填補介面微孔_特性，其主要係由必要的姻⑽ 以及级(Bi)、錫(Sn)、和辞（Zn)等元素之部份或全部組合 而成’組成元素可為Sn-In'In-Bi-Sn或In-Bi_Sn_Zn。此外， 前述主要組成合金更可包括至少一種非毒害環境元素， 例如銀、銅、鈦、鍺、鋁、鈽、鑭或矽等元素。低熔點 合金箔片34可依上述組成元素的不同而有55。〇至85。〇不 等之熔點變化。 另外，值得注意的是，可藉由上模仁31之下表面31a 與下模仁32之上表面32a之間距的大小來調整所需之低熔 點合金箔片34的厚度。在較佳實施例中，上述間距可縮減 至0.04mm以下，使低熔點合金箔片34的厚度可薄至 0. 04mm以下，且低熔點合金箔片34仍保有良好的結構特 性，也沒有產生破裂的情形。 本實施例中，在放置低炼點合金材料34於下模仁32 之上表面32a之步驟前’若低熔點合金材料34為一低熔點 合金板片時’可先行利用習知技術之輥壓裝置22對低溶點 合金板片進行軋延動作，以初步降低低熔點合金板片之厚 度。在一實施例中，以不破壞到合金箔片結構為前提，可 12 200911408 初步將低熔點合金板片之厚度輥壓至0. lmm。上述之初步 親壓薄化動作，可加速後續的加熱融化低熔點合金板片的 時間。 另外，由於熔融之低熔點合金材料34可能具有沾黏 性’所以模具組3〇的上模仁31與下模仁32可為抗合金箔 片熱熔沾黏之材質所製成，以防止低熔點合金材料34沾黏 至上、下模仁31、32的表面。或者，亦可選擇性地先於上 模仁31之下表面31a與下模仁32之上表面32a各設置— 抗合金箱片熱熔沾黏之平板結構33後，再進行後續製程。 在另一實施例中’為了有效地固定合金箔片34成形厚 度以及保持厚度的均勻性，在縮減上模仁3丨之下表面3“ 與下模仁32之上表面32a之間距的步驟前，可設置至少一 塾片35於下模仁32之上表面32a上’以限制上述間距。 也就是說，整片35的設置可防止上述間距過度的縮減，而 將間距的大小控制為墊片35的厚度。#然，墊片35設置 於上模仁31之下表面31a上亦可得到相同的功效。 在上述實施例中’係先放置低熔點合金材料於下模 仁32之上表面32a，並加熱模具組3〇，使低溶點合金材料 34炫融後，再進行後續的製程步驟。 然而，在另-實施财，可先行將低熔齡金材料34 融化’然後直接設置到下模仁32之上表面32a，或者上模 仁31之下表面3la與下模仁32之上表面伽之間。同時 模具組3G _被加熱，且難組3()之溫度舰低溶點合 金材料34之熔點，使低熔點合金材料保持液態。 13 200911408 接著，與上述步驟相似，藉由上模仁31或下模仁32 之移動、缩減上模仁31之下表面31a與下模仁％之上表 面32a之間距，使低熔點合金材料％被壓合於上模仁31 與下模仁32之間。最後’冷卻模具組3Q與低熔點合金材 料34後’使健點合金材料34固化成所需之 箔片34。 上述之實施例皆為將低溶點合金材料先置放於上模仁 與下模仁之間，再進行合模壓合..等程序。在另一實施例 中’亦可直接賴具組置祕-具娜融之低熔點合金材 料之槽内，使上模仁與下模仁之滿舰點合金材料。 接著，縮減上模仁之下表面與下模仁之上表面之間距，使 低熔點合金材料健合於上模仁與下模仁之間。 最後’將模具組移至槽外，並冷卻模具組，使上模仁 與下模仁之間之絲之低_合金㈣形成低熔點合金箱 片。 综上所述，本發明之低炫點合金箱片之製造方法且有 下列優點： 本發明之低溶點合金箔片之製造方法可謂一種「液 態壓模薄化製程(Liquid Die-pressing)」，係為直接由液 態的低馳合金材料作—次性的薄化加工，即可製造出超 薄的低熔點合金Μ ’而不須經過多次的製程作業。 -與輥輪軋延製程相較，本發明之低溶點合金箱片 之製造方法可大幅驗作業時間、可制更_厚度(小於 0.04mm)、不易破裂及不會有時效脆化的問題。 200911408 二、與快速凝固製程(Rapid Solidification Process，RSP) 相較’本發明之製造方法操作更為簡單，且可克服低溶點 合金猪片不連續、厚度不均勻、鎌化、具孔洞..等缺點。 四、本發明之製造方法簡單有效，只要精確地控制合 模靜持壓力、合模速度、模仁間距及冷卻溫度梯度..等， 即可快速地生產出厚度不大於〇. 〇4mm，且厚度均勻而完整 的低熔點合金箔片。 斤五、本發明之製造方法可有效製造出極薄的低熔點合 金箔片，以有效降低散熱系統中熱阻抗（R)，並提升散熱 系統的散熱效果。 /、、在散熱系統中，當電子元件在作用而發熱時，若 低熔點5金y自片愈薄，則箔片受熱溶融之炼液愈不易過度 流動。因此，藉由本發明之製造方法，可有效薄化 合金制之厚度’以避免低溶點合金片受熱熔融時，汽 漏至散熱系統外的情形。 本發明雖以較佳實例闡明如上，然其並非用以限定本 發明精神與發明實體僅止於上述實施_。對熟悉此項技 術者當可輕易了解並利用其它元件或方式來產生相同的 功效。是以’在不脫離本發明之精神與範圍内所作之修改， 均應包含在下述之申請專利範圍内。 【圖式簡單說明】 藉由以下詳細之描述結合所附圖示，將可輕易的了解 上述内容及此項發明之諸多優點，其中： 15 200911408 圖-係為習知散熱系統之示意圓； 圖二係為·低_合金⑽之薄化方法示意圖，· 圖三A及圖三B係、為藉由傳統的輕 成的低熔，齡鑛R娜分湘； ^ 圖四A係為本發明低熔點合金箱片之薄化方法示音 圖；以及 心 圖WB係為本發明低溶點合金箱片之薄化方法示意 圖。 【主要元件符號說明】 10 :散熱系統 11:散熱器 12 .電子元件 13 :電路基板 14 .熱界面材料 24、34 :低熔點合金箔片（材料) 22:輥壓裝置 30:模具組 31 ·上模仁 31a :下表面 32 :下模仁 32a :上表面 33 :平板結構 35 :墊片200911408 IX. Description of the Invention: [Technical Field] The present invention relates to a method for thinning a metal foil, and more particularly to a method for thinning a low melting point alloy foil. [Prior Art] With the advancement of electronic technology, information processing wafers have been developed toward high density of transistors, high speed of transmission, integration and multifunction, and miniaturization. The improvement of the above functions is derived from the increasing heat density, and the accumulated heat will increase the operating temperature of the electronic components, resulting in a higher heat load. The increase in thermal load will seriously affect the service life and reliability of electronic components such as wafers. If the problem of heat dissipation cannot be properly solved, it will hinder the launch of wafers and electronic products and industrial development. Therefore, how to improve high-performance thermal management materials is an urgent task for the electronics industry. Along with the heat dissipation requirements of wafers and electronic components, it has stimulated the diversification and technological innovation of electronic heat dissipation products such as heat dissipation components and materials. Electronic heat dissipation products mainly include heat sinks (such as heat pipes, radiators and fans, etc.) and Thermal Interface Materials (TIM). Please refer to FIG. 1 , which is a schematic diagram of a conventional heat dissipation system. As shown, the heat dissipation system 10 includes at least an electronic component 12 and a heat sink u. The 'electronic component 12' is disposed on a circuit substrate 13, and the heat sink is disposed above the electronic component 12. The thermal interface material 14 is disposed between the electronic component 12 and the heat sink 11. In detail, the two sides of the thermal interface material 14 are in contact with the lower surface of the heat sink 11 and the upper surface of the electronic component 12, respectively. 5 200911408. The thermal interface material 14 t is a heat-conducting medium used between the wafer structure and the electronic component and the device. The utility model can fill the surface of the component surface by utilizing the characteristics of self-flowable or preheating and smelting. The thermal impedance to the substrate or to the filaments to improve the thermal performance of the crystal thermal interface material is mainly thermal conductivity (8) and thermal impedance ▲) 'The hot material rate refers to the ability of heat in the material _ part of the hot material, thermal impedance refers to Crossing the benefits of __ guidance. Generally speaking, the higher the thermal paste of the interface material and the smaller the thickness of the interface bonding, the lower the thermal impedance (R) of the teaching and surface materials. '' Consumer electronic products make (4) thermal interface materials Mainly based on thermal _Se and phase change heat sink (fine ech thermal pad). However, the current two kinds of thermal interface materials are still limited in effectiveness, thermal conductivity (8) up to · thermal impedance (r,; about 0.25~G.4crt/W. In addition, the temperature of the thermal interface material in the temperature eyeling condition, the Wei Wei has a significant decline, so the 'in the crystal can continue to increase, The heat load also increases with the trend of 'the above-mentioned thermal interface materials can be #_然不县市的工业 in order to cope with the more stringent thermal management needs in the future, the kind is called low melting point. The thermal interface material of LMA) was developed. The low-melting-pointed tablets have the characteristics of point, high thermal conductivity and hot-dissolved phase filling to fill the interface microporous riding, which is mainly composed of necessary indium (10) and surface (Βι), tin (Sn). And a combination of some or all of the elements such as zinc (Zn), The elemental materials Sn_In, In and Sn can also be Zn. In addition, the aforementioned main constituent alloys may further include at least one non-toxic environmental element, such as 200911408 silver, copper, titanium, bismuth, sho, sho, sho „ 镧 镧 or 矽 兀 。 。 。 。 。 。 。 。 。 。 。 。 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低(TC, thermal conductivity (Q) can reach up to 2〇w/mk, thermal impedance (8) is less than 0. WK/W. Therefore, the low solubility 'point alloy box has extremely high heat dissipation performance. The lower the heat dissipation coefficient (8), the better the heat dissipation effect, so the lower the thickness of the low hybrid film, the better the heat dissipation effect. 凊Reference ® — 'The thin film is a thin low-melting alloy The production method is as follows: the riding method, the thinning method _ by the viewing device 22 under certain conditions for the Nao jin Μ 24 to carry out the action of the city _ 峋 。. The traditional roller rolling process is mainly to bring copper ( Cu), Ming (Α1), Gold (Cu), etc., metal sheets with extreme sister and material inspection, thin The way of rolling the roll, the raw material must be a thickness of (10) sheet metal, and the thickness is about i~2mm. Generally, the metal sheet with a thickness of 2mm is pressed under the roller. At a rate of 2%, it is necessary to go through a 13-degree extension to thin the film to 〇Jmm. Fine 'Under the same ring, the metal plate with a thickness of 2 is thinned to 〇 〇4mm thin box piece requires up to the rolling process. Therefore, it is quite time-consuming and labor-intensive to use the roll rolling process to thin the sheet metal. Moreover, the 'rolling device must also be very The precision, otherwise even if the metal · _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ During the course of the experiment, it was found that if the roll-rolling process was used to thin the low melting alloy (LMA), the following problems were caused. First, the material strength of the low melting point alloy foil is not good, and the rolling process of the rolling mill must be repeatedly processed repeatedly, which will change the material structure of the alloy foil, resulting in work hardening and subsequent rolling operation. It is difficult to shape. Second, the low melting point alloy foil obtained by thinning the roll rolling process will be embrittled after 2 to 3 months of storage at room temperature, which is called "age embrittlement". "." As shown in Fig. 2A, the low-spot alloy drop that has been repeatedly processed intensively changes its material microstructure, and contains a large number of large-angle (or acute) metal phases. Therefore, after a period of time, under the action of processing residual stress, the crack of the low melting point alloy foil is generated by these sharp corners, causing embrittlement and cracking, as shown in Fig. 3B. Therefore, the conventional roller rolling process can at most only thin the thickness of the low-melting point alloy foil 24 to 〇 5 mm, and the failure of the structure of the alloy foil 24 to be embrittled or even broken is likely to occur. In addition to the roll rolling process, there is also a Rapid Solidification Process (RSP) that can be used to make alloy foils. This process sets the high temperature molten alloy solution in a solution tank with a slit. The molten alloy solution is extruded from the slit by a pressurizing device to form a "water waterfall", which is then rapidly cooled and attached to a high-speed rotating copper wheel with a cooling device to form a continuous alloy foil. . 8 200911408 However, the material of the Low Melting Alloy (LMA) has a much lower melting point than the general alloy material, so that there is no sufficient temperature difference during the manufacturing process, that is, the cooling rate. Therefore, the low melting point alloy foil produced by using this rapid prototyping process may have problems such as discontinuity, brittleness, voids, and uneven thickness. Therefore, how to effectively thin the thickness of the low-point alloy foil and retain its proper material structure and characteristics is necessary for the current technology. SUMMARY OF THE INVENTION An object of the present invention is to provide a low-melting-point alloy foil which can be produced to a very thin thickness without causing structural embrittlement or cracking by the production method of the present invention. Another object of the present invention is to apply the extremely thin low-melting point alloy foil manufactured by the present invention, which can effectively reduce the thermal impedance (R) in the heat dissipation system and improve the heat dissipation effect of the heat dissipation system. Another object of the present invention is to provide an extremely thin, low-melting point alloy produced by the present invention, which can effectively avoid the situation where the melting point alloy is leaked to the outside of the heat dissipation system when it is heated and melted. The present invention provides a method for producing a low melting point alloy foil which is manufactured by a green line of a mold group. The mold set has an upper mold core and a lower mold core, the upper mold core has a flat lower surface, and the lower mold core has a flat upper surface and faces the lower surface of the upper mold core. The manufacturing method includes the following steps. Placement - Low-ship alloy material above the upper surface of the lower mold. Heating the gear set to make the low charm alloy material lion. By moving the upper mold core or the lower mold core 200911408, the distance between the lower surface of the upper mold core and the upper surface of the lower mold core is reduced, so that the low-focus alloy (four) is observed between the upper and the lower mold. Finally, the mold group is cooled to make the low alloy material of the New Zealand _ into the alloy box. The invention provides a method for manufacturing the low-melting age gold by the mold group having the upper mold core and the lower mold core. carried out. The upper mold has a flat lower surface, and the lower mold has a flat upper surface and faces the lower surface of the mold core. The manufacturing method includes the following steps. A molten low melting alloy material is disposed on the upper surface of the lower mold. The distance between the lower surface of the upper mold core and the upper surface of the lower mold core is reduced, so that the low melting point alloy material is bonded to the upper age and the fa1 of the lower account. Finally, the mold set is cooled to form a molten low melting point alloy material into a low melting point alloy foil. The present invention provides a method of producing a low melting point alloy foil which is carried out by a mold set having an upper mold core and a lower mold core. The upper mold has a flat lower surface, and the lower mold has a flat upper surface facing the lower surface of the upper mold. The manufacturing method includes the following steps. The mold set is placed in a groove having a molten low melting point alloy material to fill the upper mold core with the lower mold core with a low melting point alloy material. The distance between the lower surface of the upper mold core and the upper surface of the lower mold core is reduced, so that the low melting point alloy material is pressed between the upper mold core and the lower mold core. The mold set is moved outside the tank, and the mold set is cooled to form a molten low-point alloy material to form a low-melting alloy foil. The advantages and spirit of the present invention, as well as the more detailed embodiments, may be further understood by the following embodiments and the accompanying drawings. [Embodiment] Please refer to Fig. 48 and _B' as a schematic diagram of the manufacturing method of the health point combination sheet of the present invention. As shown in Fig. 4A, the manufacturing process of the low melting point alloy foil 34 is performed by a mold set 30. The mold set 30 has at least one upper mold core 31 and a lower mold core 32. The upper mold core 31 has a flat lower surface 3k, a lower mold 4 32 /, has a flat upper surface 32a, and faces the upper mold core. μ surface 31a. The manufacturing method includes at least the following transitions. Place the hard-point alloy material % = above the upper surface 32a of the lower mold core 32. The low-point alloy material 34 in this step is a starting material, which may be solid or liquid, and the shape may be block, plate, Granular, spherical or drips. Next, the "heat mold group 30" is melted to melt the low melting point alloy material 34. ^ 'In the implementation of health, heating the temperature pro _ between the low-alloy point alloy material 34 _ paper ship point plus 1 () ~ 2 (rc between. = age gold material 34 by heat fusion, by the upper mold Ren & move down: the next two 322 ί! Γ, to reduce the surface of the upper mold 31 under the celestial, between the upper _ lower (four) between two =: the upper space of the melting point alloy material 34 is squeezed and reduced, so Γ (4)% gamma _, from the object to the outflow gap door extension, the lower surface of the mold core 31 and the upper surface of the lower mold core 32 is called t: gas so-called clamping process, the clamping force of this process is 2~1〇kg/cm 'Clamping speed is 5~20Cffi/min. 11 200911408 After the mold is mixed, the mold 3Q and the alloy material 34 are cooled to cure the low melting point alloy material 34 to the desired low melting point. The alloy foil 34, wherein the lower melting point alloy foil 34 after curing has a thinner thickness because the upper space above the low melting point alloy material 34 is crushed, and finally, the upper mold core 31 and the lower portion are removed. The mold core 32 is used to take out the desired low melting point alloy foil 34. The above low melting point alloy foil 34 has a low melting point, a high thermal conductivity, and a hot melt phase change. Complementary microporous _ characteristics, which are mainly composed of some or all of the necessary elements (10) and grades (Bi), tin (Sn), and lex (Zn). The constituent elements can be Sn-In' In-Bi-Sn or In-Bi_Sn_Zn. In addition, the foregoing main constituent alloy may further include at least one non-toxic environmental element such as silver, copper, titanium, tantalum, aluminum, lanthanum, cerium or lanthanum. 34 may vary from 55 to 85 depending on the above constituent elements. Further, it is worth noting that the lower surface 31a of the upper mold core 31 and the upper surface 32a of the lower mold core 32 may be used. The thickness of the low-melting alloy foil 34 can be as thin as 0.04 mm or less. The thickness of the low-melting alloy foil 34 can be reduced to 0.04 mm or less. And the low-melting-point alloy foil 34 still retains good structural characteristics and does not cause cracking. In this embodiment, before the step of placing the low-alloy alloy material 34 on the upper surface 32a of the lower mold core 32, When the melting point alloy material 34 is a low melting point alloy sheet, it can be used first. The rolling device 22 of the prior art performs a rolling action on the low melting point alloy sheet to initially reduce the thickness of the low melting alloy sheet. In an embodiment, the premise of not destroying the alloy foil structure can be 12 200911408 Initially, the thickness of the low-melting alloy sheet is rolled to 0. lmm. The preliminary pressure-thinning action described above can accelerate the subsequent heating and melting of the low-melting alloy sheet. In addition, due to the melting of the low-melting alloy material 34 may The upper mold core 31 and the lower mold core 32 of the mold group 3 can be made of a material resistant to hot melt adhesion of the alloy foil to prevent the low melting point alloy material 34 from sticking to the upper and lower mold cores. 31, 32 surface. Alternatively, the lower surface 31a of the upper mold core 31 and the upper surface 32a of the lower mold core 32 may be selectively disposed to form a flat plate structure 33 which is resistant to the hot-melt adhesion of the alloy case sheet, and then the subsequent process is performed. In another embodiment, in order to effectively fix the forming thickness of the alloy foil 34 and maintain the uniformity of the thickness, before the step of reducing the distance between the upper surface 3 of the upper mold core 3 and the upper surface 32a of the lower mold core 32 At least one cymbal sheet 35 may be disposed on the upper surface 32a of the lower mold core 32 to limit the above spacing. That is, the entire sheet 35 is disposed to prevent the above-mentioned excessive spacing from being reduced, and the spacing is controlled to be a spacer. The thickness of 35. However, the gasket 35 is disposed on the lower surface 31a of the upper mold core 31 to obtain the same effect. In the above embodiment, the low-melting alloy material is placed on the upper surface 32a of the lower mold core 32. And heating the mold set 3〇, after the low-melting point alloy material 34 is dazzled, and then performing the subsequent process steps. However, in another implementation, the low-melting-age gold material 34 can be melted first and then directly set to the next The upper surface 32a of the mold core 32, or the upper surface 3la of the upper mold core 31 and the upper surface of the lower mold core 32. At the same time, the mold group 3G_ is heated, and the hard group 3() temperature ship low melting point alloy The melting point of material 34 keeps the low melting alloy material in a liquid state 13 200911408 Next, similar to the above steps, by moving the upper mold core 31 or the lower mold core 32, reducing the distance between the lower surface 31a of the upper mold core 31 and the upper surface 32a of the lower mold core, the low melting point alloy material is obtained. % is pressed between the upper mold core 31 and the lower mold core 32. Finally, 'cooling the mold set 3Q and the low melting point alloy material 34' causes the point alloy material 34 to solidify into the desired foil 34. The above embodiment All of the low-melting point alloy materials are placed between the upper mold core and the lower mold core, and then the mold clamping is performed.. In another embodiment, 'there is also a direct set of secrets. In the groove of the low melting point alloy material, the upper mold core and the lower mold core are filled with the alloy material. Then, the distance between the lower surface of the upper mold core and the upper surface of the lower mold core is reduced, so that the low melting point alloy material is bonded to the upper mold. Between the kernel and the lower mold. Finally, the mold group is moved outside the tank, and the mold group is cooled, so that the low alloy _ alloy (four) between the upper mold core and the lower mold core forms a low melting point alloy box piece. The manufacturing method of the low-spot alloy box piece of the invention has the following advantages: The method for manufacturing a low-melting point alloy foil can be described as a "Liquid Die-pressing" method, which can be manufactured by directly thinning a liquid low-alloy alloy material. Ultra-thin low-melting alloy Μ 'Do not have to go through multiple process operations. - Compared with the roll rolling process, the manufacturing method of the low melting point alloy box piece of the present invention can greatly verify the working time, can produce a larger thickness (less than 0.04 mm), is not easily broken, and does not become cumbersome. . 200911408 Second, compared with the Rapid Solidification Process (RSP), the manufacturing method of the present invention is simpler to operate, and can overcome the discontinuity of the low-melting point alloy pig pieces, uneven thickness, smelting, and pores. And so on. Fourth, the manufacturing method of the invention is simple and effective, as long as the mold clamping pressure, the mold clamping speed, the mold core spacing and the cooling temperature gradient are accurately controlled, etc., the thickness can be quickly produced to be no more than 〇. 〇 4 mm, and A uniform and low-melting alloy foil with a uniform thickness. The manufacturing method of the present invention can effectively produce a very thin low-melting alloy foil to effectively reduce the thermal impedance (R) in the heat dissipation system and improve the heat dissipation effect of the heat dissipation system. /, In the heat dissipation system, when the electronic component acts and generates heat, if the low melting point 5 gold y is thinner from the sheet, the refining liquid in which the foil is heated and melted is less likely to excessively flow. Therefore, by the manufacturing method of the present invention, the thickness of the alloy can be effectively thinned to avoid leakage of the low-melting-point alloy sheet out of the heat-dissipating system when it is melted by heat. The present invention has been described above by way of preferred examples, but it is not intended to limit the spirit of the invention and the inventive entity merely exemplifies the above-described embodiments. Those skilled in the art can easily understand and utilize other components or means to produce the same effect. Modifications made within the spirit and scope of the invention are intended to be included within the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS The above and other advantages of the invention will be readily apparent from the following detailed description in conjunction with the accompanying drawings, in which: 15 200911408 Figure - is a schematic circle of a conventional heat dissipation system; The second system is a low-alloy (10) thinning method schematic diagram, · Figure 3A and Figure 3B, which is a low-melting, low-melting, age-old mine, R Naxiang; ^ Figure 4A is the invention A sounding diagram of a thinning method for a low melting point alloy box; and a heart pattern WB is a schematic diagram of a thinning method for a low melting point alloy box of the present invention. [Description of main component symbols] 10: heat dissipation system 11: heat sink 12. electronic component 13: circuit substrate 14. thermal interface material 24, 34: low melting point alloy foil (material) 22: rolling device 30: mold set 31 Upper mold core 31a: lower surface 32: lower mold core 32a: upper surface 33: flat structure 35: gasket