CN101406951A - Method for manufacturing alloy foil sheet with low-melting point - Google Patents
Method for manufacturing alloy foil sheet with low-melting point Download PDFInfo
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- CN101406951A CN101406951A CNA2007101627424A CN200710162742A CN101406951A CN 101406951 A CN101406951 A CN 101406951A CN A2007101627424 A CNA2007101627424 A CN A2007101627424A CN 200710162742 A CN200710162742 A CN 200710162742A CN 101406951 A CN101406951 A CN 101406951A
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Abstract
The invention discloses a method for manufacturing a fusible alloy ultrathin foil, wherein the manufacturing process is performed through a die set. The die set is provided with an upper die core and a lower die core, wherein the upper die core is provided with a flat lower surface, and the lower die core is provided with a flat upper surface which faces to the lower surface of the upper die core. The manufacturing method comprises the following steps: placing a fusible alloy material above the upper surface of the lower die core; heating up the die set to fuse the fusible alloy material; moving the upper die core or the lower die core to reduce the space between the lower surface of the upper die core and the upper surface of the lower die core, thereby laminating the fusible alloy material between the upper die core and the lower die core; and finally, cooling the die set for forming a fusible alloy foil by using the fused fusible alloy material .
Description
Technical field
The invention relates to a kind of thinning method of sheet metal, particularly about a kind of thinning method of alloy foil sheet with low-melting point.
Background technology
Along with the progress of electronics technology, the information processing chip is towards transistor densification, transmitting high speedization, integration multifunction and volume miniaturization development.It is more and more high that the lifting of above-mentioned functions derives heat generation density, and the heat of its accumulation will make the operating temperature of electronic component increase, and cause thermic load more and more high.The increase of thermic load will seriously influence the service life and the reliability of electronic components such as chip.If the problem of electronic radiation can't suitably solve, the release and the industry development of chip and electronic product will be hindered.Therefore, how promoting the high-performance thermal management materials, has been instant problem of electronic industry.
Be accompanied by the radiating requirements of chip and electronic component, stimulated the variation and the technological innovation of electronic radiation products such as heat dissipation element, material.The electronic radiation product mainly contains heat abstractor (as: heat pipe, radiator and fan .. etc.) and thermal interfacial material (Thermal Interface Materials, TIM) two kinds.
Please refer to Fig. 1, it is known cooling system schematic diagram.As shown in the figure, this cooling system 10 comprises an electronic component 12 and a radiator 11 at least.Wherein, electronic component 12 is arranged on the circuit substrate 13, and radiator 11 is arranged at electronic component 12 tops.Thermal interfacial material 14 is arranged between electronic component 12 and the radiator 11.In detail, the two sides of thermal interfacial material 14 are contacted with the lower surface of radiator 11 and the upper surface of electronic component 12 respectively.
Thermal interfacial material 14 is a kind of heat-conducting mediums that are used between chip packaging, electronic component and the radiator, it is to utilize self can flow or the characteristic of pre-heat fusing is filled up the micropore of interface between aforementioned components, by reducing that chip heat is passed to substrate or to the thermal impedance of heat abstractor, to improve the chip cooling performance.
The performance pointer of thermal interfacial material mainly contains pyroconductivity (Q) and thermal impedance (R), and pyroconductivity is meant heat in the heat conducting ability of material internal, and thermal impedance is meant the heat conducting benefit of crossing over the different materials interface.In general, the pyroconductivity of thermal interfacial material (Q) is higher, interface thickness desire is little, and then the thermal impedance of thermal interfacial material (R) is lower.
The employed thermal interfacial material of consumption electronic products is mainly based on thermal grease (thermal grease) and phase change heat radiation paster (phase change thermal pad).But the heat dissipation of above-mentioned two kinds of thermal interfacial materials still is limited at present, and pyroconductivity (Q) reaches 7W/mk at most, and thermal impedance (R) is about 0.25～0.4cm2K/W.In addition, thermal interfacial materials such as thermal grease are under thermal cycle (temperature cycling) condition, and heat dissipation has the situation of obvious decline.Therefore, constantly strengthen in chip usefulness, under the trend that thermic load also increases thereupon, the reliability of above-mentioned thermal interfacial material is not obviously applied the application of Mirae Corp..
For in response to more harsh in the future thermal management requirements, a kind ofly be called alloy foil sheet with low-melting point (Lowmelting alloy, thermal interfacial material LMA) is developed.Alloy foil sheet with low-melting point has the characteristic that low melting point, high thermal conductance, hot melt phase change are filled up the interface micropore, it mainly is by the part of the indium of necessity (In) and bismuth (Bi), tin (Sn) and zinc elements such as (Zn) or all combines that component can be Sn-In, In-Bi-Sn or In-Bi-Sn-Zn.In addition, aforementioned main component alloy more can comprise at least a non-murder by poisoning environmental element, for example elements such as silver, copper, titanium, germanium, aluminium, cerium, lanthanum or silicon.Alloy foil sheet with low-melting point 24 can have 55 ℃ to the 85 ℃ variation of melting point that do not wait according to the difference of above-mentioned component.
In the experimental data of present stage, the transformation temperature of alloy foil sheet with low-melting point is about 60 ℃, pyroconductivity (Q) but more than the Da Keda 20W/mk, thermal impedance (R) is less than 0.1cm2K/W.Therefore, alloy foil sheet with low-melting point has high heat dissipation.
From the above, when thermal impedance in the cooling system (R) is lower, radiating effect better, so alloy foil sheet with low-melting point thickness more hour, then can have better radiating effect.Please refer to Fig. 2, it is the thinning preparation method of known alloy foil sheet with low-melting point.As shown in the figure, thinning mode is under given conditions alloy foil sheet with low-melting point 24 to be carried out repeatedly running roller by a rolling device 22 to roll and prolong (Rolling) action.
Traditional running roller rolls that to prolong processing procedure mainly be to be used for copper (Cu), aluminium (Al), gold (Cu) etc. is had the metal sheet of the splendid ductility and the strength of materials, the mode of carrying out thinning.Running roller rolls in the process of prolonging, and employed original material must be a thickness even metal plate, and thickness is about 1～2mm.
In general, the metal sheet of thickness 2mm under the situation of running roller reduction ratio 20%, must roll through 13 roads and prolong operation, can be thinned to the feed thin foil strips of 0.1mm.Yet under same environmental condition, the metal sheet of thickness 2mm desires to be thinned to the feed thin foil strips of 0.04mm, need prolong operation up to rolling of 17 roads.
Therefore, utilize running roller to roll to prolong processing procedure and come the thinning metal sheet, can be described as quite consuming time taking a lot of work.And, the precision that rolling device also must be very, even otherwise the ductility of metal material and the strength of materials are all good, also quite be easy to generate the situation of rolling wearout failure in the process of prolonging.
Find that in experimentation (Lowmelting alloy LMA), has following problem and produces if utilize running roller to roll to prolong processing procedure to come the thinning alloy foil sheet with low-melting point.
One, the strength of materials of alloy foil sheet with low-melting point is not good, and running roller roll prolong processing procedure must be through fierce processing repeatedly, this will make the material structure of alloy foil sheet change, and cause work hardening, make follow-up rolling prolong operation benefit shape difficulty.
Two, utilize running roller to roll to prolong processing procedure institute's thinning and alloy foil sheet with low-melting point, if at room temperature through after 2～3 months deposit, the phenomenon of embrittlement that is so-called " timeliness embrittlement " can take place.
As shown in Figure 3A, change, and contain the metal phase of a large amount of wide-angle (or acute angle) through its material microstructure of alloy foil sheet with low-melting point of fierce processing repeatedly.Therefore, after after a while, under the effect of processing residual stress, the be full of cracks of alloy foil sheet with low-melting point will be produced by these sharp comer places, and causes embrittlement and break, shown in Fig. 3 B.
Therefore, known running roller rolls and prolongs processing procedure and at most only the thickness of alloy foil sheet with low-melting point 24 can be thinned to 0.05mm, and is easy to occur alloy foil sheet 24 structure embrittlement, even the inefficacy situation of breaking.
In addition, prolong the processing procedure except running roller rolls, a rapid solidification manufacturing process is also arranged, and (RapidSolidification Process RSP) can be used to make alloy foil sheet.This manufacturing process is that the alloy solution with high-temperature digestion is arranged at one and has in the solution tank of finedraw.By pressue device molten alloy solution is extruded by finedraw, and formed one " water waterfall ", then cool off rapidly and be attached to one at a high speed on the copper wheel of rotation and tool cooling device, and then form a continuous alloy foil sheet.
But (Low melting alloy, the general alloy material of material melting point LMA) is much lower, makes can't have enough temperature difference in manufacturing process, that is cooldown rate for alloy foil sheet with low-melting point.Therefore, the alloy foil sheet with low-melting point that uses this rapid shaping processing procedure made to come out have discontinuous, easily problem such as crisp, tool hole and uneven thickness takes place.
Therefore, the thickness of thinning alloy foil sheet with low-melting point how effectively, and possess its due material structure and characteristic, by current techniques essential.
Summary of the invention
The technical problem to be solved in the present invention provides a kind of manufacture method of alloy foil sheet with low-melting point, can make produced alloy foil sheet with low-melting point, can reach thickness as thin as a wafer, and can the recurring structure embrittlement or the problem of breaking.
Another technical problem that the present invention will solve provides a kind of manufacture method of alloy foil sheet with low-melting point, use the alloy foil sheet with low-melting point as thin as a wafer that manufacturing of the present invention is come out, can effectively reduce thermal impedance in the cooling system (R), and promote the radiating effect of cooling system.
Another technical problem that the present invention will solve provides a kind of manufacture method of alloy foil sheet with low-melting point, use the alloy foil sheet with low-melting point as thin as a wafer that manufacturing of the present invention is come out, in the time that the alloy foil sheet with low-melting point melted by heating can effectively being avoided, leak to the outer situation of cooling system.
The invention provides a kind of manufacture method of alloy foil sheet with low-melting point, manufacture process is to carry out by a set of molds.This set of molds has a upper cores and die once, upper cores has a smooth lower surface, following die has a smooth upper surface and towards the lower surface of upper cores, and this manufacture method comprises the following steps: to place a low melting point alloy in the upper surface top of die down; The heating mould group makes the low melting point alloy fusion; By moving of upper cores or following die, the lower surface of reduction upper cores and the spacing of the upper surface of following die are pressed between upper cores and the following die low melting point alloy; At last, the cooling die group makes the low melting point alloy of fusion form alloy foil sheet with low-melting point.
The invention provides a kind of manufacture method of alloy foil sheet with low-melting point, it is carried out with a set of molds of die once by having a upper cores.Upper cores has a smooth lower surface, and following die has a smooth upper surface and towards the lower surface of upper cores, and the low melting point alloy that this manufacture method comprises the following steps: to be provided with a fusion is on the upper surface of die down; The lower surface of reduction upper cores and the spacing of the upper surface of following die are pressed between upper cores and the following die low melting point alloy.At last, the cooling die group makes the low melting point alloy of fusion form alloy foil sheet with low-melting point.
The invention provides a kind of manufacture method of alloy foil sheet with low-melting point, it is carried out with a set of molds of die once by having a upper cores.Upper cores has a smooth lower surface, following die has a smooth upper surface and towards the lower surface of upper cores, this manufacture method comprises the following steps: that set of molds is placed in one to be had in the groove of low melting point alloy of fusion, so that be full of low melting point alloy between upper cores and the following die; The lower surface of reduction upper cores and the spacing of the upper surface of following die are pressed between upper cores and the following die low melting point alloy; Set of molds is moved to outside the groove, and the cooling die group, make the low melting point alloy of fusion form alloy foil sheet with low-melting point.
Description of drawings
Fig. 1 is the schematic diagram of known cooling system;
Fig. 2 is the thinning method schematic diagram of known alloy foil sheet with low-melting point;
Fig. 3 A and Fig. 3 B are for to roll the material analysis figure that prolongs the made alloy foil sheet with low-melting point of processing procedure by traditional running roller;
Fig. 4 A is the thinning method schematic diagram of alloy foil sheet with low-melting point of the present invention; And
Fig. 4 B is the thinning method schematic diagram of alloy foil sheet with low-melting point of the present invention.
Description of reference numerals:
10: cooling system 11: radiator
12: electronic component 13: circuit substrate
14: thermal interfacial material 24,34: alloy foil sheet with low-melting point (material)
22: rolling device 30: set of molds
31: upper cores 31a: lower surface
32: following die 32a: upper surface
33: slab construction 35: pad
The specific embodiment
Please refer to Fig. 4 A and Fig. 4 B, it is the manufacture method schematic diagram of alloy foil sheet with low-melting point of the present invention.
Shown in Fig. 4 A, the manufacture process of alloy foil sheet with low-melting point 34 is to carry out by a set of molds 30.This set of molds 30 has a upper cores 31 and die 32 once at least, and upper cores 31 has a smooth lower surface 31a, and following die 32 has a smooth upper surface 32a, and it is towards the lower surface 31a of upper cores 31.
Manufacture method comprises the following steps: at least
Place the upper surface 32a top of low melting point alloy 34 in following die 32, the low melting point alloy 34 in this step is an initial material, can be solid-state or liquid, and shape can be bulk, en plaque, granular, a spherical or shape.
Then, heating mould group 30 makes low melting point alloy 34 fusions.Wherein, in preferred embodiment, the temperature range of heating adds between 10～20 ℃ between the fusing point and the above-mentioned fusing point of low melting point alloy 34 approximately again.
After low melting point alloy 34 melted by heating, by the action that upper cores 31 moves down or moves on the die 32 down, the spacing of reducing lower surface 31a with the upper surface 32a of following die 32 of upper cores 31.Therefore, low melting point alloy 34 is pressed on the gap of 32 of upper cores 31 and following dies, shown in Fig. 4 B.Reduce owing to the space up and down of low melting point alloy 34 is extruded, thus low melting point alloy 34 satisfy to around diffusion, part arranged even flow out outside the gap.
The lower surface of above-mentioned reduction upper cores 31 is so-called matched moulds process with the step of the spacing of the upper surface of following die 32, and the quiet pressure of holding of the matched moulds of this process is about 2～10kg/cm2, and closure pressing speed is 5～20cm/min.
After the matched moulds process, cooling die group 30 and low melting point alloy 34 make low melting point alloy 34 be solidified into required alloy foil sheet with low-melting point 34.Wherein,, the space up and down of above-mentioned low melting point alloy 34 reduces, so the alloy foil sheet with low-melting point 34 after solidifying just has thinner thickness owing to being stressed.At last, remove upper cores 31 and following die 32, to take out required alloy foil sheet with low-melting point 34.
Above-mentioned alloy foil sheet with low-melting point 34 has the characteristic that low melting point, high thermal conductance, hot melt phase change are filled up the interface micropore, it mainly is by the part of the indium of necessity (In) and bismuth (Bi), tin (Sn) and zinc elements such as (Zn) or all combines that component can be Sn-In, In-Bi-Sn or In-Bi-Sn-Zn.In addition, aforementioned main component alloy more can comprise at least a non-murder by poisoning environmental element, for example elements such as silver, copper, titanium, germanium, aluminium, cerium, lanthanum or silicon.Alloy foil sheet with low-melting point 34 can have 55 ℃ to the 85 ℃ variation of melting point that do not wait according to the difference of above-mentioned component.
In addition, it should be noted that can be by upper cores 31 lower surface 31a and the size of the spacing of the upper surface 32a of following die 32 adjust the thickness of required alloy foil sheet with low-melting point 34.In preferred embodiment, above-mentioned spacing can be reduced to below the 0.04mm, and the thickness of alloy foil sheet with low-melting point 34 can be as thin as below the 0.04mm, and alloy foil sheet with low-melting point 34 is still possessed good architectural characteristic, the situation that does not also have generation to break.
In the present embodiment, placing low melting point alloy 34 before the step of the upper surface 32a of following die 32, when if low melting point alloy 34 is a low-melting alloy plate, can utilize 22 pairs of low-melting alloy plates of rolling device of known technology to roll in advance and prolong action, with the thickness of preliminary reduction low-melting alloy plate.In one embodiment, be prerequisite not to be corrupted to the alloy foil sheet structure, can be tentatively with the thickness roll-in of low-melting alloy plate to 0.1mm.Above-mentioned preliminary roll-in thinning is moved, and can quicken the time of follow-up heating and melting low-melting alloy plate.
In addition, because the low melting point alloy 34 of fusion may have the stickiness of being stained with, to be stained with glutinous material made so the upper cores 31 of set of molds 30 and following die 32 can be anti-alloy foil sheet hot melt, is stained with surface glutinous supreme, time die 31,32 to prevent low melting point alloy 34.Perhaps, after also optionally an anti-alloy foil sheet hot melt respectively is set is stained with glutinous slab construction 33, carry out follow-up manufacturing process again prior to the upper surface 32a of the lower surface 31a of upper cores 31 and following die 32.
In another embodiment, for fixedly alloy foil sheet 34 forming thicknesses and the uniformity that keeps thickness effectively, before the step of the spacing of the upper surface 32a of lower surface 31a and the following die 32 of reduction upper cores 31, at least one pad 35 can be set on the upper surface 32a of following die 32, to limit above-mentioned spacing.That is to say that the setting of pad 35 can prevent the reduction that above-mentioned spacing is excessive, and the size of spacing is controlled to be the thickness of pad 35.Certainly, pad 35 is arranged on the lower surface 31a of upper cores 31 and also can obtains identical effect.
In the above-described embodiments, place earlier low melting point alloy 34, and heating mould group 30 in the upper surface 32a of die 32 down, make low melting point alloy 34 fusions after, carry out follow-up manufacturing step again.
Yet in another embodiment, can be about to low melting point alloy 34 earlier melts, and directly is set to down the upper surface 32a of die 32 then, perhaps between the upper surface 32a of the lower surface 31a of upper cores 31 and following die 32.Set of molds 30 continues to be heated simultaneously, and the temperature of set of molds 30 makes low melting point alloy 34 keep liquid above the fusing point of low melting point alloy 34.
Then, similar to above-mentioned steps, by moving of upper cores 31 or following die 32, the lower surface 31a of reduction upper cores 31 and the spacing of the upper surface 32a of following die 32 are pressed between upper cores 31 and the following die 32 low melting point alloy 34.At last, behind cooling die group 30 and the low melting point alloy 34, make low melting point alloy 34 be solidified into required alloy foil sheet with low-melting point 34.
The foregoing description is all low melting point alloy is placed in earlier between upper cores and the following die, carries out matched moulds pressing supervisor again.In another embodiment, also can directly set of molds be placed in one and have in the groove of low melting point alloy of fusion, make between upper cores and the following die to be full of low melting point alloy.Then, the lower surface of reduction upper cores and the spacing of the upper surface of following die are pressed between upper cores and the following die low melting point alloy.
At last, set of molds is moved to outside the groove, and the cooling die group, make the low melting point alloy of the fusion between upper cores and the following die form alloy foil sheet with low-melting point.
In sum, the manufacture method of alloy foil sheet with low-melting point of the present invention has following advantage:
One, the manufacture method of alloy foil sheet with low-melting point of the present invention is a kind of " liquid pressing mold thinning processing procedure (Liquid Die-pressing) ", for directly doing disposable thinning processing by the low melting point alloy of liquid state, can produce ultra-thin alloy foil sheet with low-melting point, and must be through manufacturing operation repeatedly.
Two, roll with running roller and prolong manufacturing process and compare, the manufacture method of alloy foil sheet with low-melting point of the present invention can significantly shorten the activity duration, can reach thinner thickness (less than 0.04mm), be difficult for breaking and problem that can effective embrittlement.
Three, (Rapid Solidification Process RSP) compares, and manufacture method operation of the present invention is more simple, and can overcome shortcomings such as discontinuous, in uneven thickness, the easy embrittlement of alloy foil sheet with low-melting point, tool hole with the rapid solidification manufacturing process.
Four, manufacture method of the present invention is simply effective, as long as accurately control quiet pressure, closure pressing speed, die spacing and the chilling temperature gradient etc. of holding of matched moulds, can produce thickness apace and be not more than 0.04mm, and the even and complete alloy foil sheet with low-melting point of thickness.
Five, manufacture method of the present invention can effectively produce alloy foil sheet with low-melting point as thin as a wafer, with thermal impedance (R) in effective reduction cooling system, and the radiating effect of lifting cooling system.
Six, in cooling system, when electronic component in effect and adstante febre, if alloy foil sheet with low-melting point is thinner, then the liquation of paillon foil melted by heating more is difficult for excess flow.Therefore, by manufacture method of the present invention, the effective thickness of thinning alloy foil sheet with low-melting point when avoiding the alloy foil sheet with low-melting point melted by heating, leaks to the outer situation of cooling system.
Though the present invention illustrates as above with preferred embodiments, so it is not only to terminate in the foregoing description that in order to limit the present invention's spirit with the invention entity.To being familiar with this operator, when understanding and utilize other element or mode to produce identical effect easily.Therefore, the modification of being done in not breaking away from spirit of the present invention and scope all should be included in claims.
Claims (13)
1. the manufacture method of an alloy foil sheet with low-melting point, this manufacture method is to carry out with a set of molds of die once by having a upper cores, this upper cores has a smooth lower surface, this time die has a smooth upper surface and towards the lower surface of this upper cores, this manufacture method comprises the following steps:
Place a low melting point alloy on the upper surface of this time die;
Heat this set of molds, make this low melting point alloy fusion;
Reduce the spacing of the upper surface of the lower surface of this upper cores and this time die, this low melting point alloy is pressed between this upper cores and this time die; And
Cool off this set of molds, make this low melting point alloy of fusion form this alloy foil sheet with low-melting point.
2. manufacture method as claimed in claim 1 is characterized in that, reduces in the step of spacing of upper surface of the lower surface of this upper cores and this time die, and this spacing can be reduced to below the 0.04mm, and the thickness of this alloy foil sheet with low-melting point can be as thin as below the 0.04mm.
3. manufacture method as claimed in claim 1, it is characterized in that, place this low melting point alloy before the step of this time die upper surface, when this low melting point alloy is a low-melting alloy plate, this manufacture method more comprises to roll earlier prolongs this low-melting alloy plate, with the step of the thickness of this low-melting alloy plate of preliminary reduction.
4. manufacture method as claimed in claim 1, it is characterized in that, before reducing the step of spacing of upper surface of the lower surface of this upper cores and this time die, this manufacture method more comprises the step of at least one pad in the upper surface of this time die is set, to limit above-mentioned spacing.
5. manufacture method as claimed in claim 1 is characterized in that, the composition of this alloy foil sheet with low-melting point is by the part of the indium of necessity and bismuth, tin and zinc element or all combine.
6. the manufacture method of an alloy foil sheet with low-melting point, this manufacture method is to carry out with a set of molds of die once by having a upper cores, this upper cores has a smooth lower surface, this time die has a smooth upper surface and towards the lower surface of this upper cores, this manufacture method comprises the following steps:
The low melting point alloy that one fusion is set is on the upper surface of this time die;
Reduce the spacing of the upper surface of the lower surface of this upper cores and this time die, this low melting point alloy is pressed between this upper cores and this time die; And
Cool off this set of molds, make this low melting point alloy of fusion form this alloy foil sheet with low-melting point.
7. manufacture method as claimed in claim 6 is characterized in that, reduces in the step of spacing of upper surface of the lower surface of this upper cores and this time die, and this spacing can be reduced to below the 0.04mm, and the thickness of this alloy foil sheet with low-melting point can be as thin as below the 0.04mm.
8. manufacture method as claimed in claim 6, it is characterized in that, before reducing the step of spacing of upper surface of the lower surface of this upper cores and this time die, this manufacture method more comprises this set of molds of heating, makes the temperature of this set of molds surpass the step of the fusing point of this low melting point alloy.
9. manufacture method as claimed in claim 6, it is characterized in that, before reducing the step of spacing of upper surface of the lower surface of this upper cores and this time die, this manufacture method more comprises the step of at least one pad in the upper surface of this time die is set, to limit above-mentioned spacing.
10. manufacture method as claimed in claim 6 is characterized in that, the composition of this alloy foil sheet with low-melting point is by the part of the indium of necessity and bismuth, tin and zinc element or all combine.
11. the manufacture method of an alloy foil sheet with low-melting point, this manufacture method is to carry out with a set of molds of die once by having a upper cores, this upper cores has a smooth lower surface, this time die has a smooth upper surface and towards the lower surface of this upper cores, this manufacture method comprises the following steps:
This set of molds is placed in one has in the groove of low melting point alloy of fusion, make between this upper cores and this time die to be full of this low melting point alloy;
Reduce the spacing of the upper surface of the lower surface of this upper cores and this time die, this low melting point alloy is pressed between this upper cores and this time die; And
Cool off this set of molds, make this low melting point alloy of fusion form this alloy foil sheet with low-melting point.
12. manufacture method as claimed in claim 11 is characterized in that, cool off the step of this set of molds before, this manufacture method more comprises this set of molds is shifted out step in the groove of this low melting point alloy with fusion.
13. manufacture method as claimed in claim 11 is characterized in that, reduces in the step of spacing of upper surface of the lower surface of this upper cores and this time die, this spacing can be reduced to below the 0.04mm, and the thickness of this alloy foil sheet with low-melting point can be as thin as below the 0.04mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101627424A CN101406951A (en) | 2007-10-08 | 2007-10-08 | Method for manufacturing alloy foil sheet with low-melting point |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101627424A CN101406951A (en) | 2007-10-08 | 2007-10-08 | Method for manufacturing alloy foil sheet with low-melting point |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101406951A true CN101406951A (en) | 2009-04-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007101627424A Pending CN101406951A (en) | 2007-10-08 | 2007-10-08 | Method for manufacturing alloy foil sheet with low-melting point |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101406951A (en) |
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2007
- 2007-10-08 CN CNA2007101627424A patent/CN101406951A/en active Pending
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