TW200528681A - Method for producing heat conductive body and heat dissipating fins - Google Patents

Abstract

A method for producing a heat conductive body and heat dissipating fins comprises applying a low temperature treatment on the parts where the heat conductive body and the heat dissipating fins are joined together in order to produce a shrinkage on the outside dimensions thereof; applying a heating treatment on the heat dissipating fins to expand the heat dissipating fins; installing through holes on the heat dissipating fins on locations corresponding to the heat conductive body; and inserting the heat conductive body into the heat dissipating fins and forming an assembly at normal temperature. The above-mentioned steps enable a tight combination between the heat conductive body and the heat dissipating fins in order to increase the contact effect and tightness between the heat conductive body and the heat dissipating fins, while reducing the heat conductive resistance and effectively displaying the property of transferring thermal energy through the heat conductive body at a high rate.

Description

200528681 V. Description of the invention (1) [This invention belongs to the invention using a conductor and heat dissipation [press the previous technology, will tend to, especially rapid heat transfer, properties, so electronic products in the past will often be tied to each hole. The sequential contact density heat dissipation fins on the surface of the heat pipe are used as a guide, and the pipe is attached to the center and is sticky, which not only affects the perforation of the heat conducting medium, but it is not easy to apply to the heat conductor. In order to transfer heat, the heat conductor needs to be inserted into the heat fins; therefore, it can be connected to the precise control tube to reduce the contamination of the conductive string or the coating of the above-mentioned heat medium gel-like product, and it is used in the computer's heat pipe or conductivity. A lot of heat and weight. The heat pipe and the opening are relatively small, in order to increase the low heat conduction resistance of the heat medium (such as ···. After the use of the conductor, it is not easy to conduct heat conduction medium, beautiful, and even when the capacity is too small, touch. Therefore, the production of heat conduction medium causes product products

The technical field on page 5 relates to a method for physically changing the temperature of a heat conductor and a radiating fin on a metal material, especially a method for forming a fin tightly combined. In order to dissipate heat in the heat-related field, copper pillars have been called high-heat-conducting light-weight, simple structure, and multi-use does not consume power, so very = thermal fins are connected in series or combined with perforations, and then the heat pipe is kept for a long time. The perforation resistance of the f-tube and each heat-dissipating fin is before the heat-pipe is penetrated, and then the solder pipe is first made; then the heat-pipe and each are made; Excessive contamination will overflow each of the 7 holes and easily become contaminated with impurities, which will increase the heat pipe and each fan. In the past, the "heat" was transferred to the coating amount of 2, and it was not easy to match the quality, at 11; I also made more 200528681. V. Description of the invention (2) There are some problems. In addition, the tightness of the outer diameter of the tube is very tight. It is very easy to experience. SUMMARY OF THE INVENTION The method for forming a sheet according to the present invention is to make the thermal mass viscous and damaged. In order to achieve the formation of a heat fin, a) generate a shape of the heat conduction b) open a correspondence to the heat radiation c) heat the 0 If there is heat dissipation, the density and heat transfer (about 0.5 mm The main purpose of the present inventors is to change the use of the heat pipe, and to effectively improve it. The main purpose of the inventor is to use the conductor and heat dissipation and not easy to lose coating. ; The perforation aperture of the heat-conducting conductor through the loose fin is designed to be slightly smaller than that of the heat-radiating fin pressed into the heat pipe to improve the conductivity. However, due to the wall thickness of the heat pipe), After the heat sink fin was pressed into the heat pipe, it was deformed or the surface was scratched and damaged. Feeling the above problem points and the inconveniences and problems of many years of research and development, it is a study with the spirit of excellence, and finally put forward a description The invention of the problem point is that it can provide a thermal conductor and the physical change of fins produced by the temperature of the heat dissipation fins on the metal material, so as to solve the traditional thermal conduction medium, and it is easy to cause the thermal conductor to deform or scrape. Quality, which is convenient for manufacturing and processing. The invention provides a method for implementing a thermal conductor and a method including: a part where the fins are combined, and The low-temperature treatment is used to make the heat treatment swell, and perforate the heat-dissipating fins; and in the perforation of the hot fins, the junction is restored at normal temperature.

Page 6 200528681 V. Description of the invention (3) The second reality is a) the shape of the heat conduction and b) the heat fusion. The third reality a) the thermal conductivity makes it swell b) the heat is closed 0 [Embodiment In order to make the technical content, the drawings are only produced. Please refer to the schematic diagram of the first implementation of the Ming. The invention is to provide a combination of low-temperature perforation to expand the appearance of the gold. The steps of the combined recovery solution include: The part where the body desires to combine with the heat-dissipating fins is subjected to low-temperature treatment to shrink. The radiating fins have perforations and are maintained at normal temperature; the steps of the conductor penetrating the fins of the radiating fins and restoring the solution at normal temperature include: maintaining the body at normal temperature, and the radiating fins are subjected to heating treatment to expand, and Establish a perforation corresponding to the thermal conductor; and the conductor penetrates into the perforation of the heat dissipation fins, and reply at normal temperature. The review committee can further understand the features of the present invention and please refer to the following detailed description and drawings of the present invention, and It is provided for reference and explanation, and is not intended to limit the present invention. The first diagram A, the second, the third diagram, and the fourth diagram are the schematic diagrams of the process of the present example, and the schematic diagram of the thermal conductor and the fins before being combined. And the sectional view of the composed radiator. The manufacturing method for forming a heat conductor and a heat dissipation fin is mainly a physical change caused by a material to shrink the temperature of the heat conductor and heat the heat dissipation fin, order the heat dissipation fin, and then The conductor penetrates the perforation of the heat dissipation fins at room temperature; the steps of this embodiment include:

Page 7 200528681 V. Description of the invention (4) ~ ---- ----, a) At the part where the heat conductor 1 is to be combined with the heat sink fin 2, apply low, weight to make the shape of the heat conductor i Shrinkage occurs (as shown in the second image). In the dish I = medium ,, ', as the material of the heat conductor 1, it is best to use a heat pipe or steel grate, material / place it in a cold / east device or a low temperature liquid (such as liquid nitrogen) Short ★ In order to cause cooling shrinkage of the external dimensions, the shrinkage of the heat conductor 1 can be precisely controlled by the cooling time county and the temperature of the liquid in the cold part, and the shrinkage phenomenon is hard and uniform. ^) The heating fins 2 are subjected to a heating treatment to cause expansion (2: 20 :: two: f scattered t turns 2 are provided with perforations corresponding to the thermal conductor 1 In this step, the aperture of each perforation 20 is slightly larger than Or equal to the diameter of the tube outside Le Daoza, so that the guide 1 H & 4 is in the thermal conductor of Yuan Si, and the second table of the guide Si: Stone: the perforation 20 of each fin 2 There is no compression loss on the surface of the U body 1. In addition, this step is performed before the step of “Gafeng Lion” and “Toughness” ^ Simultaneously with step 3) or in step a) C) the heat conductor 1 The perforated household that penetrates the heat dissipation fin 2 returns to combine. In this step, the temperature of the thermal conductor i rises under the influence of normal temperature =, and increases the external dimension of the heat conductor i, and then perforates the surrounding ring 2 20 is cooled due to cooling, and the heat dissipation fin: use the thermal conductor to increase the size and perforation = = 哽 The heat conductor 1 and the heat dissipation fin 2 are closely combined at room temperature. It is performed after step a) and step b). In addition, please refer to the first diagram B in this step, which is a diagram of the second embodiment of the present invention. : Process Schematic 200 528 681

V. Description of the invention (5) The outer shape of the heat-dissipating fin 2 has a perforation 20 and is maintained at normal temperature. In this step, the thermal conductor 1 is subjected to a cooling effect for a longer time or a lower temperature than the first embodiment, so that the outer shape of the thermal conductor 1 is reduced, and the amount of under shrinkage is larger; and the heat dissipation fin 2 is B) having a perforation 20 and maintained at normal temperature; b) the thermal conductor 1 is penetrated into the perforation 20 of the heat dissipation fin 2, and the combination is restored at normal temperature. Please refer to the first figure C, which is a sound flow chart of the third embodiment of the present invention. The steps of this embodiment include: ~ a) applying heat treatment to the heat dissipation fin 2 to expand it, and A perforation 20 corresponding to the thermal conductor 1 is opened on the sheet 2. In this step, the heat-dissipating fin 2 is subjected to a higher temperature than the first embodiment, so that the expansion amount generated by the perforation 20 is greater; and the heat conductor 1 is maintained at normal temperature = state b) The thermal conductor 1 penetrates into the perforation 20 of the heat dissipation fin 2 and recovers and joins at w. The thermal conductivity two-step gauge process ’can be used to obtain this invention. Therefore, by solving the traditional thermal conduction medium to produce squeeze deformation or it is not only more beautiful. The fins are in close contact and the conductor transfers a large amount of heat

The method for forming a heat conductor and a heat dissipation fin according to the present invention can be viscous and difficult to coat, and can also avoid the loss of scratches and breakage of the heat conductor. The finished product based on this is convenient for manufacturing and processing. Increasing the heat conductor and heat dissipation to reduce the heat conduction resistance and effectively exert the characteristics of heat energy.

200528681 V. Description of the invention (6) --------- —__ In summary, the present invention has a clear and purposeful use, and it solves the lack of knowledge because of its novelty and progress. It fully complies with the requirements of the invention patent application. The application is made in accordance with the Patent Law. Please check and grant the patent in this case to protect the rights of the inventor. However, the above are only the preferred and feasible embodiments of the present invention, and are not intended to limit the scope of patents of the present invention. Therefore, any changes in the equivalent technology, means, etc. used in the description and the contents of the drawings of the present invention are the same. It is included in the scope covered by the present invention and is shared by Chen Ming.

Page 10 200528681 Brief description of the drawings [Simplified description of the drawings] The first diagram A is a schematic flowchart of the first embodiment of the present invention. First picture B First picture C Second picture Picture. The third figure The fourth figure is a sectional view. [Element Representative Symbol] < Invention > The heat conductor, heat dissipation fin, and perforation are schematic flowcharts of the second embodiment of the present invention. It is a schematic flowchart of the third embodiment of the present invention. It is a schematic diagram before the heat conductor and the radiating fins of the present invention are not combined. It is a schematic diagram after the heat pipe and the radiating fins of the present invention are combined. The heat dissipation composed of the heat pipe of the present invention and most of the heat dissipation fins 1 2 20

Claims (1)

200528681 6. Scope of patent application 1. A method for forming a heat conductor and a heat sink fin, the steps include: a) applying a low temperature treatment to a portion of the heat conductor to be combined with the heat sink fin to shrink its shape; b) heat dissipation The fin is subjected to a heating treatment to generate expansion, and a perforation corresponding to the heat conductor is opened on the heat dissipation fin; and c) the heat conductor is penetrated into the perforation of the heat dissipation fin, and the combination is restored at normal temperature. 2. The method for forming a heat conductor and a heat dissipation fin as described in item 1 of the scope of patent application, wherein steps a) and b) are performed simultaneously. 3. The method for forming a heat conductor and a heat dissipation fin as described in item 1 of the scope of patent application, wherein step a) is after step b). 4. The method for forming a thermal conductor and a heat dissipation fin as described in item 1 of the scope of patent application, wherein steps a) and b) are preceded by step c). 5. According to the method for forming a heat conductor and a heat dissipation fin described in item 1 of the scope of patent application, in step a), the heat conduction system is a heat pipe. 6. According to the method for forming a thermal conductor and a heat dissipation fin according to item 1 of the scope of the patent application, in step a), the thermal conduction system is a copper pillar. 7. According to the method for forming a thermal conductor and a radiating fin described in item 1 of the scope of the patent application, in step b), the perforation aperture of the radiating fin is greater than or equal to the diameter of the tube outside the thermal conductor, so that the thermal conductor Easy to penetrate through the perforations of the heat sink fins. 8. A method for forming a thermal conductor and a radiating fin, comprising the steps of: a) applying a low-temperature treatment to a portion where the thermal conductor is to be combined with the radiating fin to shrink the shape; Maintain at Page 12 200528681 6. Scope of patent application Normal temperature; and b) The thermal conductor is penetrated into the perforation of the heat dissipation fin, and the combination is returned at normal temperature. 9. Rushen method, which is 10 · Rushen method, 11 types of a) the treatment to produce it b) will be combined. 12. The method of applying the shape, 13. The method of applying the shape, which claims the patent scope step a) The patent scope step a) The thermal conductor and the heat dissipation conductor maintain expansion, and the thermal conductor passes through the patent scope step a) The thermal conductor described in step 8) of the patent scope of the patent is formed with a heat dissipation fin, wherein the thermal conduction system is a heat pipe. The thermal conductor described in item 8 is formed with a heat dissipation fin, wherein the thermal conductivity system is a copper pillar. The thermal fin forming method includes the steps of: at room temperature, and heating the fins to open a perforation corresponding to the heat conductor; and into the perforations of the radiating fins, return to the item described in item 11 at room temperature. The heat conductor is formed with a heat dissipation fin, wherein the heat conduction system is a heat pipe. The thermal conductor according to item 11 is formed with a heat dissipation fin, wherein the thermal conductivity system is a copper pillar. Participate Page 13