TW200520880A - Laser beam machining method - Google Patents

Laser beam machining method Download PDF

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Publication number
TW200520880A
TW200520880A TW093122988A TW93122988A TW200520880A TW 200520880 A TW200520880 A TW 200520880A TW 093122988 A TW093122988 A TW 093122988A TW 93122988 A TW93122988 A TW 93122988A TW 200520880 A TW200520880 A TW 200520880A
Authority
TW
Taiwan
Prior art keywords
laser
workpiece
laser light
chuck table
laser beam
Prior art date
Application number
TW093122988A
Other languages
English (en)
Chinese (zh)
Other versions
TWI318903B (ja
Inventor
Kazuma Sekiya
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of TW200520880A publication Critical patent/TW200520880A/zh
Application granted granted Critical
Publication of TWI318903B publication Critical patent/TWI318903B/zh

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Landscapes

  • Laser Beam Processing (AREA)
  • Dicing (AREA)
TW093122988A 2003-08-27 2004-07-30 Laser beam machining method TW200520880A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003302667A JP2005066675A (ja) 2003-08-27 2003-08-27 レーザー加工方法

Publications (2)

Publication Number Publication Date
TW200520880A true TW200520880A (en) 2005-07-01
TWI318903B TWI318903B (ja) 2010-01-01

Family

ID=34406884

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093122988A TW200520880A (en) 2003-08-27 2004-07-30 Laser beam machining method

Country Status (2)

Country Link
JP (1) JP2005066675A (ja)
TW (1) TW200520880A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI402128B (zh) * 2007-07-13 2013-07-21 Disco Corp Laser processing method

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5011939B2 (ja) * 2006-10-13 2012-08-29 パルステック工業株式会社 レーザ微細加工装置
JP2011009663A (ja) * 2009-06-29 2011-01-13 Kyocera Corp 太陽電池素子の製造方法および太陽電池素子の製造装置
TWI457191B (zh) * 2011-02-04 2014-10-21 Mitsuboshi Diamond Ind Co Ltd 雷射切割方法及雷射加工裝置
TWI461251B (zh) * 2011-12-26 2014-11-21 Mitsuboshi Diamond Ind Co Ltd Method for cutting brittle material substrates

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI402128B (zh) * 2007-07-13 2013-07-21 Disco Corp Laser processing method

Also Published As

Publication number Publication date
TWI318903B (ja) 2010-01-01
JP2005066675A (ja) 2005-03-17

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