TW200516779A - An image pickup device and manufacturing method thereof - Google Patents

An image pickup device and manufacturing method thereof

Info

Publication number
TW200516779A
TW200516779A TW092131372A TW92131372A TW200516779A TW 200516779 A TW200516779 A TW 200516779A TW 092131372 A TW092131372 A TW 092131372A TW 92131372 A TW92131372 A TW 92131372A TW 200516779 A TW200516779 A TW 200516779A
Authority
TW
Taiwan
Prior art keywords
pickup device
image pickup
substrate
stitching
thin
Prior art date
Application number
TW092131372A
Other languages
English (en)
Other versions
TWI231606B (en
Inventor
Shih-Hsien Tseng
Original Assignee
Shih-Hsien Tseng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shih-Hsien Tseng filed Critical Shih-Hsien Tseng
Priority to TW092131372A priority Critical patent/TWI231606B/zh
Priority to US10/712,315 priority patent/US20050099532A1/en
Priority to KR1020040090548A priority patent/KR20050045838A/ko
Priority to JP2004325299A priority patent/JP2005142575A/ja
Application granted granted Critical
Publication of TWI231606B publication Critical patent/TWI231606B/zh
Publication of TW200516779A publication Critical patent/TW200516779A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
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    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
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    • H01L27/144—Devices controlled by radiation
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    • H01L27/144—Devices controlled by radiation
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    • H01L31/02—Details
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    • H04—ELECTRIC COMMUNICATION TECHNIQUE
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    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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    • H01L2224/732—Location after the connecting process
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    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
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    • H01L2924/151—Die mounting substrate
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    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
TW092131372A 2003-11-10 2003-11-10 Image pickup device and a manufacturing method thereof TWI231606B (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW092131372A TWI231606B (en) 2003-11-10 2003-11-10 Image pickup device and a manufacturing method thereof
US10/712,315 US20050099532A1 (en) 2003-11-10 2003-11-12 Image pickup device and a manufacturing method thereof
KR1020040090548A KR20050045838A (ko) 2003-11-10 2004-11-08 고체영상픽업소자, 영상픽업모듈, 고체영상픽업소자 및영상픽업모듈의 제조방법
JP2004325299A JP2005142575A (ja) 2003-11-10 2004-11-09 撮像素子とその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW092131372A TWI231606B (en) 2003-11-10 2003-11-10 Image pickup device and a manufacturing method thereof

Publications (2)

Publication Number Publication Date
TWI231606B TWI231606B (en) 2005-04-21
TW200516779A true TW200516779A (en) 2005-05-16

Family

ID=34546484

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092131372A TWI231606B (en) 2003-11-10 2003-11-10 Image pickup device and a manufacturing method thereof

Country Status (4)

Country Link
US (1) US20050099532A1 (zh)
JP (1) JP2005142575A (zh)
KR (1) KR20050045838A (zh)
TW (1) TWI231606B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106537212A (zh) * 2014-07-23 2017-03-22 赫普塔冈微光有限公司 包括垂直对准特征的光发射器和光检测器模块
WO2018126786A1 (zh) * 2017-01-04 2018-07-12 曾世宪 像素单元、像素阵列、多媒体装置及其制造方法

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TWI237358B (en) * 2003-06-27 2005-08-01 Hon Hai Prec Ind Co Ltd Packaging structure of imaging sensor
US7088005B2 (en) * 2003-12-31 2006-08-08 Intel Corporation Wafer stacking with anisotropic conductive adhesive
JP4902953B2 (ja) * 2004-09-30 2012-03-21 ラピスセミコンダクタ株式会社 半導体装置の製造方法
FR2881011B1 (fr) * 2005-01-19 2007-06-29 Dxo Labs Sa Procede de realisation d'un appareil de capture et/ou restitution d'images et appareil obtenu par ce procede
JP5025157B2 (ja) 2005-09-29 2012-09-12 大日本スクリーン製造株式会社 画像記録装置および画像記録方法
TWI303105B (en) * 2006-01-11 2008-11-11 Advanced Semiconductor Eng Wafer level package for image sensor components and its fabricating method
JP4951989B2 (ja) 2006-02-09 2012-06-13 富士通セミコンダクター株式会社 半導体装置
KR100825807B1 (ko) * 2007-02-26 2008-04-29 삼성전자주식회사 이미지 소자 및 그 제조방법
JP4340697B2 (ja) * 2007-04-04 2009-10-07 シャープ株式会社 固体撮像装置およびそれを備えた電子機器
JP4310348B2 (ja) * 2007-04-04 2009-08-05 シャープ株式会社 固体撮像装置およびそれを備えた電子機器
JP2009008758A (ja) * 2007-06-26 2009-01-15 Fujinon Corp 撮像デバイス、およびカメラモジュールならびに携帯端末機器
JP5493316B2 (ja) * 2008-01-17 2014-05-14 ソニー株式会社 固体撮像装置およびその製造方法
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