TW200516779A - An image pickup device and manufacturing method thereof - Google Patents
An image pickup device and manufacturing method thereofInfo
- Publication number
- TW200516779A TW200516779A TW092131372A TW92131372A TW200516779A TW 200516779 A TW200516779 A TW 200516779A TW 092131372 A TW092131372 A TW 092131372A TW 92131372 A TW92131372 A TW 92131372A TW 200516779 A TW200516779 A TW 200516779A
- Authority
- TW
- Taiwan
- Prior art keywords
- pickup device
- image pickup
- substrate
- stitching
- thin
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 3
- 230000003287 optical effect Effects 0.000 abstract 2
- 239000004020 conductor Substances 0.000 abstract 1
- 238000003384 imaging method Methods 0.000 abstract 1
- 230000010354 integration Effects 0.000 abstract 1
- 230000002093 peripheral effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14621—Colour filter arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14632—Wafer-level processed structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14687—Wafer level processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02327—Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01077—Iridium [Ir]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/049—Nitrides composed of metals from groups of the periodic table
- H01L2924/0494—4th Group
- H01L2924/04941—TiN
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW092131372A TWI231606B (en) | 2003-11-10 | 2003-11-10 | Image pickup device and a manufacturing method thereof |
US10/712,315 US20050099532A1 (en) | 2003-11-10 | 2003-11-12 | Image pickup device and a manufacturing method thereof |
KR1020040090548A KR20050045838A (ko) | 2003-11-10 | 2004-11-08 | 고체영상픽업소자, 영상픽업모듈, 고체영상픽업소자 및영상픽업모듈의 제조방법 |
JP2004325299A JP2005142575A (ja) | 2003-11-10 | 2004-11-09 | 撮像素子とその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW092131372A TWI231606B (en) | 2003-11-10 | 2003-11-10 | Image pickup device and a manufacturing method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI231606B TWI231606B (en) | 2005-04-21 |
TW200516779A true TW200516779A (en) | 2005-05-16 |
Family
ID=34546484
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW092131372A TWI231606B (en) | 2003-11-10 | 2003-11-10 | Image pickup device and a manufacturing method thereof |
Country Status (4)
Country | Link |
---|---|
US (1) | US20050099532A1 (zh) |
JP (1) | JP2005142575A (zh) |
KR (1) | KR20050045838A (zh) |
TW (1) | TWI231606B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106537212A (zh) * | 2014-07-23 | 2017-03-22 | 赫普塔冈微光有限公司 | 包括垂直对准特征的光发射器和光检测器模块 |
WO2018126786A1 (zh) * | 2017-01-04 | 2018-07-12 | 曾世宪 | 像素单元、像素阵列、多媒体装置及其制造方法 |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI237358B (en) * | 2003-06-27 | 2005-08-01 | Hon Hai Prec Ind Co Ltd | Packaging structure of imaging sensor |
US7088005B2 (en) * | 2003-12-31 | 2006-08-08 | Intel Corporation | Wafer stacking with anisotropic conductive adhesive |
JP4902953B2 (ja) * | 2004-09-30 | 2012-03-21 | ラピスセミコンダクタ株式会社 | 半導体装置の製造方法 |
FR2881011B1 (fr) * | 2005-01-19 | 2007-06-29 | Dxo Labs Sa | Procede de realisation d'un appareil de capture et/ou restitution d'images et appareil obtenu par ce procede |
JP5025157B2 (ja) | 2005-09-29 | 2012-09-12 | 大日本スクリーン製造株式会社 | 画像記録装置および画像記録方法 |
TWI303105B (en) * | 2006-01-11 | 2008-11-11 | Advanced Semiconductor Eng | Wafer level package for image sensor components and its fabricating method |
JP4951989B2 (ja) | 2006-02-09 | 2012-06-13 | 富士通セミコンダクター株式会社 | 半導体装置 |
KR100825807B1 (ko) * | 2007-02-26 | 2008-04-29 | 삼성전자주식회사 | 이미지 소자 및 그 제조방법 |
JP4340697B2 (ja) * | 2007-04-04 | 2009-10-07 | シャープ株式会社 | 固体撮像装置およびそれを備えた電子機器 |
JP4310348B2 (ja) * | 2007-04-04 | 2009-08-05 | シャープ株式会社 | 固体撮像装置およびそれを備えた電子機器 |
JP2009008758A (ja) * | 2007-06-26 | 2009-01-15 | Fujinon Corp | 撮像デバイス、およびカメラモジュールならびに携帯端末機器 |
JP5493316B2 (ja) * | 2008-01-17 | 2014-05-14 | ソニー株式会社 | 固体撮像装置およびその製造方法 |
US7915717B2 (en) * | 2008-08-18 | 2011-03-29 | Eastman Kodak Company | Plastic image sensor packaging for image sensors |
JP4799594B2 (ja) * | 2008-08-19 | 2011-10-26 | 株式会社東芝 | 固体撮像装置およびその製造方法 |
JPWO2010058503A1 (ja) * | 2008-11-21 | 2012-04-19 | パナソニック株式会社 | 半導体装置およびその製造方法 |
US9001257B1 (en) * | 2008-12-23 | 2015-04-07 | DigitalOptics Corporation MEMS | Wafer scale optics |
US8232617B2 (en) * | 2009-06-04 | 2012-07-31 | Wisconsin Alumni Research Foundation | Flexible lateral pin diodes and three-dimensional arrays and imaging devices made therefrom |
JP2012009547A (ja) * | 2010-06-23 | 2012-01-12 | Sony Corp | 固体撮像装置、電子機器 |
KR20130057090A (ko) * | 2011-11-23 | 2013-05-31 | 엘지이노텍 주식회사 | 카메라 모듈 |
WO2013179765A1 (ja) * | 2012-05-30 | 2013-12-05 | オリンパス株式会社 | 撮像装置の製造方法および半導体装置の製造方法 |
US9786529B2 (en) * | 2013-03-11 | 2017-10-10 | Applied Materials, Inc. | Pyrometry filter for thermal process chamber |
US20140312450A1 (en) * | 2013-04-23 | 2014-10-23 | Sensors Unlimited, Inc. | Small Size, Weight, and Packaging of Image Sensors |
US20140326856A1 (en) * | 2013-05-06 | 2014-11-06 | Omnivision Technologies, Inc. | Integrated circuit stack with low profile contacts |
US9136298B2 (en) | 2013-09-03 | 2015-09-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Mechanisms for forming image-sensor device with deep-trench isolation structure |
US20160150136A1 (en) * | 2014-11-24 | 2016-05-26 | Himax Technologies Limited | Image sensing device with cover plate having optical pattern thereon |
WO2016181433A1 (ja) * | 2015-05-08 | 2016-11-17 | オリンパス株式会社 | 固体撮像装置 |
WO2017114353A1 (zh) * | 2015-12-29 | 2017-07-06 | 苏州晶方半导体科技股份有限公司 | 影像传感芯片封装结构及其封装方法 |
US11024757B2 (en) * | 2016-01-15 | 2021-06-01 | Sony Corporation | Semiconductor device and imaging apparatus |
DE102017210379A1 (de) * | 2017-06-21 | 2018-12-27 | Robert Bosch Gmbh | Bildsensormodul |
WO2020003796A1 (ja) * | 2018-06-29 | 2020-01-02 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置、電子機器、および固体撮像装置の製造方法 |
KR20220093553A (ko) * | 2020-12-28 | 2022-07-05 | 엘지이노텍 주식회사 | 카메라 모듈 및 이를 포함하는 광학기기 |
-
2003
- 2003-11-10 TW TW092131372A patent/TWI231606B/zh not_active IP Right Cessation
- 2003-11-12 US US10/712,315 patent/US20050099532A1/en not_active Abandoned
-
2004
- 2004-11-08 KR KR1020040090548A patent/KR20050045838A/ko not_active Application Discontinuation
- 2004-11-09 JP JP2004325299A patent/JP2005142575A/ja active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106537212A (zh) * | 2014-07-23 | 2017-03-22 | 赫普塔冈微光有限公司 | 包括垂直对准特征的光发射器和光检测器模块 |
US10566363B2 (en) | 2014-07-23 | 2020-02-18 | Heptagon Micro Optics Pte. Ltd. | Light emitter and light detector modules including vertical alignment features |
TWI696809B (zh) * | 2014-07-23 | 2020-06-21 | 新加坡商海特根微光學公司 | 用來產生光圖案之照明投影器模組及製造照明投影器模組之方法 |
TWI735232B (zh) * | 2014-07-23 | 2021-08-01 | 新加坡商海特根微光學公司 | 光發射器或光偵測器模組及製造一光發射器或光偵測器模組之方法 |
WO2018126786A1 (zh) * | 2017-01-04 | 2018-07-12 | 曾世宪 | 像素单元、像素阵列、多媒体装置及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20050099532A1 (en) | 2005-05-12 |
KR20050045838A (ko) | 2005-05-17 |
TWI231606B (en) | 2005-04-21 |
JP2005142575A (ja) | 2005-06-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200516779A (en) | An image pickup device and manufacturing method thereof | |
US7019374B2 (en) | Small-sized image pick up module | |
US7679167B2 (en) | Electronic assembly for image sensor device and fabrication method thereof | |
CN109274876B (zh) | 感光组件及其封装方法、镜头模组、电子设备 | |
US20110285890A1 (en) | Camera module | |
US7268335B2 (en) | Image sensing devices, image sensor modules, and associated methods | |
US20090134483A1 (en) | Electronic assembly for image sensor device | |
CN104716149B (zh) | 固态摄像器件、其制造方法以及电子装置 | |
EP1536478A3 (en) | Solid state imaging device and producing method thereof | |
US8916911B2 (en) | Semiconductor devices having backside illuminated image sensors | |
US9024406B2 (en) | Imaging systems with circuit element in carrier wafer | |
KR100543854B1 (ko) | 카메라 모듈 | |
JP2007318761A (ja) | カメラモジュール及びカメラモジュールアセンブリ | |
US8487388B2 (en) | Solid-state image pickup apparatus, method for manufacturing same, and electronic device | |
KR20160008385A (ko) | 위상차 검출 픽셀 및 이를 갖는 이미지 센서 | |
EP2838252B1 (en) | Image sensing module and method of manufacturing the same | |
CN103081105B (zh) | 图像拾取装置、图像拾取模块和照相机 | |
CN109729240B (zh) | 摄像模组及其扩展布线封装感光组件和电子设备 | |
JP2006032561A (ja) | 半導体イメージセンサ・モジュール | |
US20090001493A1 (en) | Electronic imaging device | |
JP4451182B2 (ja) | 固体撮像装置 | |
CN111263028B (zh) | 摄像组件及其封装方法、镜头模组、电子设备 | |
KR101184906B1 (ko) | 듀얼 카메라 모듈, 이를 포함하는 휴대용 단말기 및 그 제조방법 | |
US20050205898A1 (en) | Electronic imaging device | |
TWI311372B (en) | Image sensor module |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |