1311372 九、發明說明 ::：：：：::: .....：. ：..:: 【發明所屬之技術領域】 本發明係有關於-種影像感測模組，特別是有關於一種 具有基板模組之影像感測模組。 【先前技術】 隨著科技的it步以及消費者的期望，促使消費性電子產 品持續不斷地朝向輕薄短小的方向發展，導致電子產品内的 各個電子元件或零組件模組也必須配合著將其尺寸製作的 更J以符合實際上的需求。影像感測模組是一種常見的電 子零組件模組’通常係使用在數位相機、數位攝影機或具有 照相功能之手機等消費性電子產品上。 -般具有照相功能之手機的影像感測模組僅包含鏡片 模組、具有線路之基板以及光感測晶片等三個主要元件，現 ^為了增加影像感測模組之功能（例如自動對焦），設計者 —:外增加許多電子元件（例如被動元件、數位訊號處理器 =體元件等)在影像感測模組内，由於影像感測 模組僅设置有早一绩致其把遭& 士 ‘ 線路基板，導致在有限空間内設置如此 之電子元件的作業變得非常困難。 【發明内容】 因此’非f需要—種改進的影像感測模組， 元件的配置問題，以達到提升製程良率的目的。、 本發月之彳面係在於提供—種影像感測模組，藉由安 1311372 裝複數個線路基板於原先之單一線路基板之下，使部分電子 元件可以設置於此些線路基板上’如此就可以解決電子元件 配置的問題。 本發明的另一方面就是在提供一種影像感測模組，藉由 將複數個基板模組化為基板模組，來取代原先之單一線路基 板’以提供更多的容置空間給電子元件，如此就可以提高製 造的良率和降低生產的時間與成本。 根據本發明之一最佳實施例，此影像感測模組至少包含 基板模組，其中基板模組至少包含第一線路基板以及第二線 路基板’第一線路基板係設置於第二線路基板之上方且在第 一線路基板之下表面以及第二線路基板之上表面之間設置 間隙物，第一線路基板係電性連接至第二線路基板；複數個 電子兀件，設置於基板模組上且電性連接至基板模組；光感 測晶片，設置於第一線路基板之上表面且電性連接至第一線 路基板；以及鏡片模組，設置於第一線路基板之上表面，其 中鏡片模組係包圍光感測晶片。 根據本發明之另一最佳實施例，此影像感測模組至少包 含基板模組，其中基板模組至少包含第一線路基板以及第二 線路基板，第一線路基板之下表面具有侧壁以界定凹槽，側 J係〇又置於第二線路基板之上表面，第一線路基板係電性連 接至第一線路基板；複數個電子元件，設置於第二線路基板 之上表面且電性連接至第二線路基板，其中此些電子元件係 位於凹槽以及第二線路基板之間；光感測晶片，設置於第一 線路基板之上表面且電性連接至第一線路基板；以及鏡片模 1311372 - 組，設置於第一線路基板之上表面，其中鏡片模組係包圍光 . 感測晶片。 依照本發明之一較佳實施例，上述之間隙物可例如 ' 是锡球。 依照本發明之一較佳實施例，上述之光感測晶片可 例如是光感二極體、感光耦合元件（CCD )或光感電晶體 互補式金氧半導體（CMOS)感光元件。 鲁依照本發明之一較佳實施例，上述之電子元件可例 如是被動元件、數位訊號處理器（DSP )元件或可電除且可 程式唯讀記憶體（EEPROM )元件。 應用上述影像感測模組，由於是藉由安裝複數個線路基 板，以形成具有較多容置空間之基板模組，使得電子元件能 谷易地設置於基板模組上，就可以解決電子元件配置的間 題。所以本發明與其它習知之模組結構相比，本發明所用的 結構不僅可解決電子元件配置的問題，更可大幅提高製程的 良率和降低生產的時間。 【實施方式】 .、請參閱第1圖’係繪示根據本發明之一實施例之影像感 ，測模組100的剖面示意圖。該影像感測模組1〇〇至少包含基 板模組110、光感測晶片130、複數個電子元件15〇以及鏡 片模組丨70。其中基板模組11〇係至少包含第一線路基板112 以及第二線路基板114,第一線路基板112係設置於第二線 路基板U4之上方且在第一線路基板112之下表面112&以 1311372 及第二線路基板114之上表面114a之間設置間隙物ιΐ6。 由於此間隙物ι16的安裝，使得第一線路基板112與第二線 路基板114之間形成容置空間117，以用來容納此些電子元 件150。在本實施例巾，第一線路純112肖第二線路基板 114係為印刷電路板，且第二線路基板114的尺寸係大於第 一線路基板112。此外，第-線路基板112係藉由複數條 連接線118電性連接至第二線路基板114，並藉由膠材ιΐ9 包覆此些連接、線i i 8 ’以保護連接 '線i i 8免於受到外界 環境的破壞。值得-提較，為了阻擋光線進人到鏡片模组 17〇中，此膠材119係可選用不透明膠。光感測晶片13〇, 例如光感二極體、感光麵合元件或光感電晶體互補式金氧半 導體感光元件，係設置於第 '線路基板112之上表面"沘， 其中光感測晶4 no係電性連接至第—線路基板ιΐ2。此些 電子元件15〇’例如被動元件152、數位訊號處理器元件… 以及可電除且可程式唯續*#- 枉式笮讀忑憶體儿件156，係設置於基板模 組110上且電性連接至基板模组110。鏡片模組17〇設置於 第了線路基板112之上表面112b，其中鏡片模組17〇係包 圍光感測晶片13 0，以俾讀水#、a r曰μ 、 以保。蔓先感測晶片130不受外界顆粒的 污染和透光的干擾。在本實施例中，影像感測模組⑽更包 含有可撓性線路基19G，其係設置於第二線路基板ιΐ4 r:t，lL14b，且藉由導電膠192電性連接至第二線路基 反，、可撓性線路基板190係具有終端部分194 1設於連接件（切示）内，以與其他電子 件模組（未緣不）t性連接。本發明的特徵之—係在於將 13113721311372 IX. INSTRUCTIONS::::::::: .....:.::::: TECHNICAL FIELD OF THE INVENTION The present invention relates to an image sensing module, and more particularly An image sensing module having a substrate module. [Prior Art] With the step of technology and the expectations of consumers, consumer electronic products are continuously moving toward light, thin and short, which leads to the integration of various electronic components or component modules in electronic products. The size is made more J to meet the actual needs. The image sensing module is a common electronic component module that is typically used in consumer electronics such as digital cameras, digital cameras or camera phones. The image sensing module of the camera-like mobile phone only includes three main components, such as a lens module, a substrate with a line, and a light sensing chip. Now, in order to increase the function of the image sensing module (for example, auto focus) , designer -: add a lot of electronic components (such as passive components, digital signal processor = body components, etc.) in the image sensing module, because the image sensing module is only set to have a good performance to cause it to be & It is very difficult to install such electronic components in a limited space. SUMMARY OF THE INVENTION Therefore, non-f needs an improved image sensing module, component configuration problems, in order to achieve the goal of improving process yield. The face of this month is to provide an image sensing module, which is equipped with a plurality of circuit substrates under the original single circuit substrate by using A11131, so that some electronic components can be disposed on the circuit substrates. It is possible to solve the problem of electronic component configuration. Another aspect of the present invention is to provide an image sensing module that replaces a single single circuit substrate 'to provide more housing space for electronic components by modularizing a plurality of substrates into a substrate module. This can increase the yield of manufacturing and reduce the time and cost of production. According to a preferred embodiment of the present invention, the image sensing module includes at least a substrate module, wherein the substrate module includes at least a first circuit substrate and a second circuit substrate. The first circuit substrate is disposed on the second circuit substrate. An upper spacer is disposed between the lower surface of the first circuit substrate and the upper surface of the second circuit substrate, the first circuit substrate is electrically connected to the second circuit substrate; and the plurality of electronic components are disposed on the substrate module And electrically connected to the substrate module; the light sensing chip is disposed on the upper surface of the first circuit substrate and electrically connected to the first circuit substrate; and the lens module is disposed on the upper surface of the first circuit substrate, wherein the lens The module surrounds the light sensing wafer. According to another preferred embodiment of the present invention, the image sensing module includes at least a substrate module, wherein the substrate module includes at least a first circuit substrate and a second circuit substrate, and a lower surface of the first circuit substrate has a sidewall Defining the groove, the side J system is placed on the upper surface of the second circuit substrate, the first circuit substrate is electrically connected to the first circuit substrate; the plurality of electronic components are disposed on the upper surface of the second circuit substrate and electrically Connecting to the second circuit substrate, wherein the electronic components are located between the recess and the second circuit substrate; the light sensing chip is disposed on the upper surface of the first circuit substrate and electrically connected to the first circuit substrate; The module 1311372 - is disposed on the upper surface of the first circuit substrate, wherein the lens module surrounds the light. The wafer is sensed. In accordance with a preferred embodiment of the present invention, the spacer may be, for example, a solder ball. In accordance with a preferred embodiment of the present invention, the photo-sensing wafer can be, for example, a photo-sensitive diode, a photosensitive coupling element (CCD), or a photo-sensing transistor complementary metal-oxygen semiconductor (CMOS) photosensitive element. In accordance with a preferred embodiment of the present invention, the electronic component can be, for example, a passive component, a digital signal processor (DSP) component, or an electrically erasable and programmable read only memory (EEPROM) component. The above image sensing module can solve the electronic component by installing a plurality of circuit substrates to form a substrate module having a large accommodating space, so that the electronic components can be easily disposed on the substrate module. Configuration questions. Therefore, compared with other conventional module structures, the structure of the present invention not only solves the problem of electronic component configuration, but also greatly improves the yield of the process and reduces the production time. [Embodiment] FIG. 1 is a cross-sectional view showing an image sensing and testing module 100 according to an embodiment of the present invention. The image sensing module 1A includes at least a substrate module 110, a light sensing chip 130, a plurality of electronic components 15A, and a mirror module 70. The substrate module 11 includes at least a first circuit substrate 112 and a second circuit substrate 114. The first circuit substrate 112 is disposed above the second circuit substrate U4 and on the lower surface of the first circuit substrate 112, 112 & 131137 A spacer ι 6 is disposed between the upper surface 114a of the second circuit substrate 114. Due to the mounting of the spacers ι16, an accommodating space 117 is formed between the first circuit substrate 112 and the second circuit substrate 114 for accommodating the electronic components 150. In the embodiment of the present invention, the first line pure 112 XI second circuit substrate 114 is a printed circuit board, and the second circuit substrate 114 is larger in size than the first circuit substrate 112. In addition, the first circuit substrate 112 is electrically connected to the second circuit substrate 114 by a plurality of connecting lines 118, and the connecting lines ii 8 ' are covered by the adhesive ι 9 to protect the connection 'line ii 8 from Damaged by the external environment. It is worthwhile to compare, in order to block the light into the lens module 17〇, this glue 119 is optional opaque adhesive. The light sensing chip 13A, for example, a photodiode, a photosensitive surface unit, or a photoreceptor complementary MOS sensor, is disposed on the upper surface of the 'circuit substrate 112', wherein the light sensing crystal 4 no is electrically connected to the first circuit board ιΐ2. The electronic components 15 〇 'such as the passive component 152 , the digital signal processor component ... and the electrically erasable and programmable continuous *#- 笮 笮 reading component 156 are disposed on the substrate module 110 and Electrically connected to the substrate module 110. The lens module 17 is disposed on the upper surface 112b of the circuit substrate 112. The lens module 17 surrounds the light sensing wafer 130 to read water #, a r曰μ. The vine sensing wafer 130 is free from interference from external particles and light transmission. In this embodiment, the image sensing module (10) further includes a flexible circuit base 19G disposed on the second circuit substrate ι4 r:t, lL14b, and electrically connected to the second line by the conductive adhesive 192. The flexible circuit board 190 has a terminal portion 194 1 disposed in a connector (not shown) to be t-connected to other electronic component modules. The feature of the present invention is that it will be 1311372
此些電子元件15〇設置於基板模組110上時，係可由設計者 選擇設置於第一線路基板112或第二線路基板丨14，亦即本 發明之基板模組11〇係提供足夠的設置空間給電子元件15〇 來進行安裝。所以本發明之影像感測模組1〇〇之電子元件 150的設置空間遠大於習知之影像感測模組，因此可有效改 善習知結構中之配置的問題。此外，本發明的另一特徵係在 於將可撓性線路基板190設置於第二線路基板ιΐ4，由於可 挽性線路基板19〇具有可撓性的特性，並具有終端部分 194以用來與其他電子零組件連接，因此影像感測模組_ 更可彈性地設置於手機等可攜式電子裝置上。 請參閱第2圖，係繪示根據本發明之另一實施例之影像 感測模組200的剖面示意圖。此影像感測模組細鱼第^ 圖所繪示之影像感測模組刚的差異處係在於將第ικΜ 間隙物m#換成複數個錫,农12〇,其係用卩電性連接第一 線路基板112収第：、㈣基板114，並且㈣省略第工圖 中的連接線118與膠材U9。 岡卜丁' π不很稞本發 〜人一I施例之影像 感測模組300的剖面示音圃旦，你>、、，， ’、 j田不蒽圖。影像感測模組300至少包含某 =組310、光感測晶片33〇、複數個電子元件35〇以及鏡 片Μ組370。其中基板模組3㈣至少包含第—線路基板⑴ 以及苐二線路基板314，第一螝q 具有側壁仙界定凹^基板312之下表面仙 界疋凹槽317 ’ 3⑶係設置於第二線路 " 之上表面314。在本實施例中，第一線路基板312 為具有線路318之陶竟基板，第二線路基板314為可撓性 1311372 線路基板，且此可撓性線路基板 插設於連接件（树示）内，終端部分314b用以 # M . 内以與其他電子元件或零組 =莫雷ί 性連接°此外，第—線路基板312係 藉由導電膠接合以電性連接至第二線路基板314 膠316係使用異方性導電膠（⑽），然、不在此限，也Ϊ 以使用其他電性連接的方法，例如銲錫接合（s〇iderj〇int)， 來電性連接第-線路基板312與第二線路基板3i4。複數個 電子几件350,例如被動元件扣、數位訊號處理器元件… 以及可電除且可程式唯讀記憶體元件…，係設置於第二線 路基板314之上表面314a且電性連接至第二線路基板 314’其中電子元件35G係位於凹槽317以及第二線路基板 314之間。光感測晶片33〇,例如光感二極體、感光耦合元 件或光感電晶體互補式金氧半導體感光元件，係設置於第一 線路基板312之上表面312b，纟中光感測晶片33Q係藉由 複數條連接線3 3 2電性連接至第一線路基板3 12，並經 由線路318、導電膠316以及第二線路基板314電性連接至 此些電子元件350。鏡片模組37〇設置於第一線路基板312 之上表面312b，其中鏡片模組37〇係包圍光感測晶片33〇， 以保護光感測晶片330不受外界顆粒的污染和透光的干 擾。本發明的特徵之一係在於將光感測晶片3 3 〇與此些電子 元件3 5 0分別設置於第一線路基板3丨2以及第二線路基板 314上’亦即本發明之基板模組31〇係提供第二線路基板314 給電子元件350來進行安裝。所以本發明之影像感測模組 300的設置空間遠大於習知之影像感測模組，因此習知結構 1311372 中之電子元件350配置的問題就可以獲得解決。此外，本發 明的另一特徵係在於將第二線路基板3 14用可換性線路基 板來替代，由於可撓性線路基板具有可撓性的特性，並具 有終端部分3 1 4b以用來與其他電子零組件連接，因此影 像感測模組300更可彈性的設置於手機等可攜式電子裝置 上。When the electronic components 15 are disposed on the substrate module 110, they can be selectively disposed on the first circuit substrate 112 or the second circuit substrate 14 by the designer, that is, the substrate module 11 of the present invention provides sufficient settings. The space is supplied to the electronic component 15 for mounting. Therefore, the installation space of the electronic component 150 of the image sensing module 1 of the present invention is much larger than that of the conventional image sensing module, so that the problem of the configuration in the conventional structure can be effectively improved. Further, another feature of the present invention is that the flexible circuit substrate 190 is disposed on the second wiring substrate ι 4, since the flexible circuit substrate 19 has flexibility characteristics, and has a terminal portion 194 for use with other The electronic components are connected, so the image sensing module _ is more elastically disposed on a portable electronic device such as a mobile phone. Referring to FIG. 2, a cross-sectional view of an image sensing module 200 in accordance with another embodiment of the present invention is shown. The difference between the image sensing module and the image sensing module shown in the image sensing module is that the first ικΜ spacer m# is replaced by a plurality of tins, which are used for electrical connection. The first circuit substrate 112 receives the :, (4) substrate 114, and (4) omits the connection line 118 and the glue U9 in the drawing.冈布丁' π is not very 稞 发 ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ The image sensing module 300 includes at least a certain group 310, a light sensing chip 33A, a plurality of electronic components 35A, and a lens group 370. The substrate module 3 (4) includes at least a first circuit substrate (1) and a second circuit substrate 314. The first 螝q has a sidewall defining a concave surface 312. The lower surface of the substrate 312 is disposed on the second line. Upper surface 314. In this embodiment, the first circuit substrate 312 is a ceramic substrate having a line 318, and the second circuit substrate 314 is a flexible 1131372 circuit substrate, and the flexible circuit substrate is inserted into the connector (tree). The terminal portion 314b is used to connect with other electronic components or zero group=more ray. In addition, the first circuit substrate 312 is electrically connected to the second circuit substrate 314 by the conductive adhesive 316. The anisotropic conductive paste ((10)) is used, but not limited thereto, and other electrical connection methods, such as solder bonding, are used to electrically connect the first-line substrate 312 and the second. Circuit board 3i4. A plurality of electronic components 350, such as a passive component buckle, a digital signal processor component, and an electrically erasable and programmable read-only memory component, are disposed on the upper surface 314a of the second circuit substrate 314 and electrically connected to the first The two circuit substrates 314' are in which the electronic component 35G is located between the recess 317 and the second wiring substrate 314. The light sensing chip 33, for example, a photodiode, a photosensitive coupling element or a photo-sensing transistor complementary MOS sensor, is disposed on the upper surface 312b of the first circuit substrate 312, and the photo-sensing wafer 33Q in the 纟The plurality of connecting wires 323 are electrically connected to the first circuit substrate 3 12 , and are electrically connected to the electronic components 350 via the wires 318 , the conductive adhesive 316 , and the second circuit substrate 314 . The lens module 37 is disposed on the upper surface 312b of the first circuit substrate 312, wherein the lens module 37 surrounds the light sensing chip 33A to protect the light sensing chip 330 from external particles and light interference. . One of the features of the present invention is that the photo-sensing wafer 3 3 〇 and the electronic components 350 are disposed on the first circuit substrate 3 丨 2 and the second circuit substrate 314 respectively, that is, the substrate module of the present invention. The second circuit substrate 314 is supplied to the electronic component 350 for mounting. Therefore, the installation space of the image sensing module 300 of the present invention is much larger than that of the conventional image sensing module. Therefore, the problem of the configuration of the electronic component 350 in the conventional structure 1311372 can be solved. Further, another feature of the present invention is to replace the second circuit substrate 314 with a replaceable circuit substrate, which has a flexible characteristic and has a terminal portion 3 1 4b for use with The other electronic components are connected, so that the image sensing module 300 can be more flexibly disposed on a portable electronic device such as a mobile phone.
簡言之’本發明之影像感測模組，其特徵在於提供具有 複數個基板之基板模組’由於基板模組係提供足夠的設置空 間給電子元件來進行安裝，所以複數個電子元件設置於基板 模組上時，不會有難以安裝導致良率下降的問題。所以二發 明之影像感測模組的設置空間遠大於習知之影像感測模 組，因此習知結構中之電子元件配置的問題就可以獲得解 決。此外，本發明之影像感測模組另至少包含設置有可撓 性線路基板，由於可撓性線路基板具有可撓性的特性，並 具有終端部分以用來與盆他雷子愛相土 个/、，、犯电于翠組件連接，因此本發明 之影像感測模、组更可彈性地設置於手機等可攜式電子 r· η •贸* 影像感測 成具有較 地設置於 以本發明 僅可解決 由上述本發明較佳實施例可知，應用本發明之 模組，其優點在於只需安裝複數個線路基板，以形 多谷置空間之基板模組，即可使得電子元 基板模組上，就可以解決電子元件配置的問題1 带，、匕習知之杈組結構相比，本發明所用的結構不 其並非用 明之精神 的問題，更可大幅提高製程的良率 雖然本發明已以數個較佳實施例揭露如上，羊铁 限疋本發明’任何熟習此技藝者，在不脫離本； 1311372 和範圍内，當可作各種之更動與潤飾，因此本發明之保護範 圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明] 為讓本發明之上述和其他目的、特徵、和優點能更明顯 易懂，下文特舉一較佳實施例，並配合所附圖式，作詳細說 明如下： 第1圖係繪示根據本發明之一實施例之影像感測模組 的剖面示意圖； 第2圖係繪示根據本發明之另一實施例之影像感測模 組的剖面示意圖；以及 第3圖係續·示根據本發明之又一實施例之影像感測模 組的剖面示意圖。 【主要元件符號說明】 11 0 :基板模組 112 a .下表面 11 4 :第二線路基板 11 4b .下表面 11 7 :容置空間 119 :膠材 13 0 :光感測晶片 1 5 2 :被動元件 器元件 I 0 0 :影像感測模組 112 :第一線路基板 112b .上表面 114a .上表面 116 :間隙物 II 8 :連接線 12 0 .錫球 1 5 0 .電子元件 154 :數位訊號處理 12 1311372 156 ： 可電除且可程式唯讀記 憶體元件 170 ： 鏡片模組 190 ： 可撓性線 192 ： 導電膠 194 ： 終端部分 300 ： 影像感測模組 310 ： 基板模組 312 : 第一線路基板 312a :下表面 312b :上表面 312c :側壁 314 ： 第二線路基板 314a :上表面 314b :終端部分 316 ： 導電膠 317 ： 凹槽 318 ： 線路 330 ： 光感測晶片 332 :連接線 350 ： 電子元件 352 ： 被動元件 354 ： 數位訊號處理器 元件 356 ： 可電除且可程式唯讀記 憶體元件 370 ： 鏡片模組 13Briefly, the image sensing module of the present invention is characterized in that a substrate module having a plurality of substrates is provided. Since the substrate module provides sufficient space for mounting the electronic components, a plurality of electronic components are disposed. When the substrate module is mounted, there is no problem that it is difficult to install and the yield is lowered. Therefore, the setting space of the image sensing module of the second invention is much larger than that of the conventional image sensing module, so that the problem of the electronic component configuration in the conventional structure can be solved. In addition, the image sensing module of the present invention further includes at least a flexible circuit substrate, and the flexible circuit substrate has flexibility characteristics, and has a terminal portion for use with the Potter. /,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, The invention can only solve the above-mentioned preferred embodiment of the present invention, and the module to which the present invention is applied has the advantages that only a plurality of circuit substrates need to be installed to form a substrate module with multiple valleys, so that the electronic element substrate can be molded. In the group, the problem of the electronic component configuration can be solved. Compared with the conventional structure, the structure used in the present invention is not a problem of the spirit of the invention, and the process yield can be greatly improved. The invention has been disclosed in several preferred embodiments. As described above, the present invention is capable of various modifications and refinements without departing from the scope of the present invention. When depends on the protection scope defined by the scope of the appended patent and their equivalents. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features and advantages of the present invention will become more apparent and understood. FIG. 2 is a cross-sectional view showing an image sensing module according to an embodiment of the present invention; and FIG. 2 is a cross-sectional view showing an image sensing module according to another embodiment of the present invention; and FIG. A cross-sectional view of an image sensing module in accordance with yet another embodiment of the present invention. [Main component symbol description] 11 0: substrate module 112 a. lower surface 11 4 : second circuit substrate 11 4b . lower surface 11 7 : accommodation space 119 : glue material 13 0 : light sensing wafer 1 5 2 : Passive component element I 0 0 : image sensing module 112 : first circuit substrate 112 b . upper surface 114 a . upper surface 116 : spacer II 8 : connecting line 12 0 . solder ball 1 50 . electronic component 154 : digital Signal Processing 12 1311372 156 : Detachable and Programmable Read Memory Element 170 : Lens Module 190 : Flexible Line 192 : Conductive Adhesive 194 : Terminal Part 300 : Image Sensing Module 310 : Substrate Module 312 : First circuit substrate 312a: lower surface 312b: upper surface 312c: side wall 314: second circuit substrate 314a: upper surface 314b: terminal portion 316: conductive paste 317: groove 318: line 330: light sensing wafer 332: connecting line 350 : Electronic component 352 : Passive component 354 : Digital signal processor component 356 : Electrically erasable and programmable read only memory component 370 : Lens module 13