TW200514284A - LED lighting source and LED lighting apparatus - Google Patents
LED lighting source and LED lighting apparatusInfo
- Publication number
- TW200514284A TW200514284A TW093127873A TW93127873A TW200514284A TW 200514284 A TW200514284 A TW 200514284A TW 093127873 A TW093127873 A TW 093127873A TW 93127873 A TW93127873 A TW 93127873A TW 200514284 A TW200514284 A TW 200514284A
- Authority
- TW
- Taiwan
- Prior art keywords
- led lighting
- metal electrode
- wiring pattern
- semiconductor layer
- area
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003323575 | 2003-09-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200514284A true TW200514284A (en) | 2005-04-16 |
Family
ID=34372711
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093127873A TW200514284A (en) | 2003-09-16 | 2004-09-15 | LED lighting source and LED lighting apparatus |
Country Status (5)
Country | Link |
---|---|
US (1) | US20070023769A1 (zh) |
EP (1) | EP1665397A2 (zh) |
JP (1) | JP2007528588A (zh) |
TW (1) | TW200514284A (zh) |
WO (1) | WO2005029185A2 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI407038B (zh) * | 2005-09-15 | 2013-09-01 | Mag Instr Inc | 改良過發光二極體模組 |
TWI427832B (zh) * | 2011-10-24 | 2014-02-21 | Opto Tech Corp | 具鰭狀電極的發光二極體及其製造方法 |
US9666556B2 (en) | 2015-06-29 | 2017-05-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Flip chip packaging |
Families Citing this family (74)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005055997A1 (de) * | 2005-05-02 | 2006-11-09 | Hieke, Bernhard | Homogene Lichtquelle |
KR101047683B1 (ko) * | 2005-05-17 | 2011-07-08 | 엘지이노텍 주식회사 | 와이어 본딩이 불필요한 발광소자 패키징 방법 |
US7348212B2 (en) * | 2005-09-13 | 2008-03-25 | Philips Lumileds Lighting Company Llc | Interconnects for semiconductor light emitting devices |
EP2161752B1 (en) | 2005-06-22 | 2015-08-12 | Seoul Viosys Co., Ltd | Light-emitting device |
US7329907B2 (en) | 2005-08-12 | 2008-02-12 | Avago Technologies, Ecbu Ip Pte Ltd | Phosphor-converted LED devices having improved light distribution uniformity |
GB0517171D0 (en) * | 2005-08-22 | 2005-09-28 | Hawes Signs Ltd | LED lighting strip |
JP2007087712A (ja) * | 2005-09-21 | 2007-04-05 | Toshiba Lighting & Technology Corp | ランプ |
US20070176182A1 (en) * | 2006-01-27 | 2007-08-02 | Way-Jze Wen | Structure for integrating LED circuit onto heat-dissipation substrate |
KR100738933B1 (ko) * | 2006-03-17 | 2007-07-12 | (주)대신엘이디 | 조명용 led 모듈 |
US7710045B2 (en) | 2006-03-17 | 2010-05-04 | 3M Innovative Properties Company | Illumination assembly with enhanced thermal conductivity |
TW200822384A (en) * | 2006-11-03 | 2008-05-16 | Coretronic Corp | LED package structure |
JP2008288456A (ja) * | 2007-05-18 | 2008-11-27 | Panasonic Electric Works Co Ltd | 光源装置 |
US8368114B2 (en) * | 2007-05-18 | 2013-02-05 | Chiuchung Yang | Flip chip LED die and array thereof |
JPWO2009107535A1 (ja) * | 2008-02-25 | 2011-06-30 | 株式会社東芝 | 白色ledランプ、バックライト、発光装置、表示装置および照明装置 |
JP5129329B2 (ja) * | 2008-07-07 | 2013-01-30 | パナソニック株式会社 | 電球形照明用光源 |
US8247827B2 (en) * | 2008-09-30 | 2012-08-21 | Bridgelux, Inc. | LED phosphor deposition |
RU2524400C2 (ru) * | 2008-10-14 | 2014-07-27 | Конинклейке Филипс Электроникс Н.В. | Система для передачи тепла между двумя соединяемыми элементами |
TW201017922A (en) * | 2008-10-23 | 2010-05-01 | Everlight Electronics Co Ltd | Light emitting diode package |
US8408724B2 (en) * | 2008-12-26 | 2013-04-02 | Toshiba Lighting & Technology Corporation | Light source module and lighting apparatus |
KR100969146B1 (ko) * | 2009-02-18 | 2010-07-08 | 엘지이노텍 주식회사 | 반도체 발광소자 및 그 제조방법 |
JP2010192701A (ja) * | 2009-02-18 | 2010-09-02 | Showa Denko Kk | 発光ダイオード、発光ダイオードランプ及び発光ダイオードの製造方法 |
JP5465898B2 (ja) * | 2009-03-11 | 2014-04-09 | 日本航空電子工業株式会社 | 光半導体デバイス、ソケットおよび光半導体ユニット |
CN101894901B (zh) | 2009-04-08 | 2013-11-20 | 硅谷光擎 | 用于多个发光二极管的封装 |
US8912023B2 (en) | 2009-04-08 | 2014-12-16 | Ledengin, Inc. | Method and system for forming LED light emitters |
US8598793B2 (en) | 2011-05-12 | 2013-12-03 | Ledengin, Inc. | Tuning of emitter with multiple LEDs to a single color bin |
US20100270930A1 (en) * | 2009-04-24 | 2010-10-28 | City University Of Hong Kong | Apparatus and methods of operation of passive led lighting equipment |
US20100270931A1 (en) * | 2009-04-24 | 2010-10-28 | City University Of Hong Kong | Apparatus and methods of operation of passive led lighting equipment |
US9717120B2 (en) * | 2009-04-24 | 2017-07-25 | City University Of Hong Kong | Apparatus and methods of operation of passive LED lighting equipment |
KR20120027401A (ko) * | 2009-05-28 | 2012-03-21 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 조명 장치 및 조명 장치 조립 방법 |
WO2010150170A1 (en) | 2009-06-25 | 2010-12-29 | Koninklijke Philips Electronics N.V. | Heat managing device |
JP5403346B2 (ja) * | 2009-07-29 | 2014-01-29 | 株式会社ギガテック | ドップラーセンサ内蔵電球型led照明器具 |
JP2010109328A (ja) * | 2009-08-04 | 2010-05-13 | Allied Material Corp | 半導体素子搭載部材とそれを用いた半導体装置 |
JP5683799B2 (ja) * | 2009-09-14 | 2015-03-11 | スターライト工業株式会社 | 自動車用led用ヒートシンク |
JP5327472B2 (ja) * | 2009-09-25 | 2013-10-30 | 東芝ライテック株式会社 | 電球形ランプおよび照明器具 |
CN102074637B (zh) * | 2009-11-19 | 2013-06-05 | 深圳市光峰光电技术有限公司 | 封装固态发光芯片的方法、结构及使用该封装结构的光源装置 |
JP2011159770A (ja) * | 2010-01-29 | 2011-08-18 | Yamaguchi Univ | 白色半導体発光装置 |
US8820950B2 (en) * | 2010-03-12 | 2014-09-02 | Toshiba Lighting & Technology Corporation | Light emitting device and illumination apparatus |
US20110225818A1 (en) * | 2010-03-19 | 2011-09-22 | Shih-Bin Chiu | Method of manufacturing an led illuminator device |
KR101192181B1 (ko) | 2010-03-31 | 2012-10-17 | (주)포인트엔지니어링 | 광 소자 디바이스 및 그 제조 방법 |
US8858022B2 (en) | 2011-05-05 | 2014-10-14 | Ledengin, Inc. | Spot TIR lens system for small high-power emitter |
US9345095B2 (en) | 2010-04-08 | 2016-05-17 | Ledengin, Inc. | Tunable multi-LED emitter module |
US9080729B2 (en) | 2010-04-08 | 2015-07-14 | Ledengin, Inc. | Multiple-LED emitter for A-19 lamps |
JP5545848B2 (ja) * | 2010-06-24 | 2014-07-09 | シチズン電子株式会社 | 半導体発光装置 |
JP2012015226A (ja) * | 2010-06-30 | 2012-01-19 | Toshiba Lighting & Technology Corp | 発光装置及び照明装置 |
US20120043886A1 (en) * | 2010-08-18 | 2012-02-23 | Hua Ji | Integrated Heat Conductive Light Emitting Diode (LED) White Light Source Module |
US8371715B2 (en) * | 2010-09-21 | 2013-02-12 | Catcher Technology Co., Ltd. | LED illuminator module with high heat-dissipating efficiency and manufacturing method therefor |
JP5647028B2 (ja) * | 2011-02-14 | 2014-12-24 | スタンレー電気株式会社 | 発光装置およびその製造方法 |
KR20120119350A (ko) * | 2011-04-21 | 2012-10-31 | 삼성전자주식회사 | 발광소자 모듈 및 이의 제조방법 |
DE102011084795B4 (de) * | 2011-10-19 | 2013-11-07 | Osram Gmbh | Halbleiterleuchtvorrichtung mit einem galvanisch nicht-isolierten Treiber |
KR20130052825A (ko) * | 2011-11-14 | 2013-05-23 | 삼성전자주식회사 | 반도체 발광소자 |
US8907362B2 (en) | 2012-01-24 | 2014-12-09 | Cooledge Lighting Inc. | Light-emitting dies incorporating wavelength-conversion materials and related methods |
US8896010B2 (en) | 2012-01-24 | 2014-11-25 | Cooledge Lighting Inc. | Wafer-level flip chip device packages and related methods |
WO2013112435A1 (en) | 2012-01-24 | 2013-08-01 | Cooledge Lighting Inc. | Light - emitting devices having discrete phosphor chips and fabrication methods |
US11032884B2 (en) | 2012-03-02 | 2021-06-08 | Ledengin, Inc. | Method for making tunable multi-led emitter module |
US9897284B2 (en) | 2012-03-28 | 2018-02-20 | Ledengin, Inc. | LED-based MR16 replacement lamp |
CN103681644B (zh) * | 2012-09-14 | 2016-08-17 | 晶元光电股份有限公司 | 具有改进的热耗散和光提取的高压led |
US9076950B2 (en) | 2012-09-14 | 2015-07-07 | Tsmc Solid State Lighting Ltd. | High voltage LED with improved heat dissipation and light extraction |
US9234801B2 (en) | 2013-03-15 | 2016-01-12 | Ledengin, Inc. | Manufacturing method for LED emitter with high color consistency |
JP5456197B2 (ja) * | 2013-06-14 | 2014-03-26 | 三菱電機照明株式会社 | Led照明装置 |
TWI540766B (zh) * | 2013-07-10 | 2016-07-01 | 隆達電子股份有限公司 | 發光二極體封裝結構 |
EP3022779B1 (en) * | 2013-07-19 | 2020-03-18 | Lumileds Holding B.V. | Pc led with optical element and without substrate carrier |
JP5701411B2 (ja) * | 2014-01-16 | 2015-04-15 | 三菱電機照明株式会社 | Led照明装置 |
US9406654B2 (en) | 2014-01-27 | 2016-08-02 | Ledengin, Inc. | Package for high-power LED devices |
WO2015119858A1 (en) | 2014-02-05 | 2015-08-13 | Cooledge Lighting Inc. | Light-emitting dies incorporating wavelength-conversion materials and related methods |
US10797188B2 (en) * | 2014-05-24 | 2020-10-06 | Hiphoton Co., Ltd | Optical semiconductor structure for emitting light through aperture |
DE102014110010A1 (de) * | 2014-07-16 | 2016-01-21 | Itz Innovations- Und Technologiezentrum Gmbh | Lichtmodul |
KR102282141B1 (ko) * | 2014-09-02 | 2021-07-28 | 삼성전자주식회사 | 반도체 발광소자 |
US9642206B2 (en) | 2014-11-26 | 2017-05-02 | Ledengin, Inc. | Compact emitter for warm dimming and color tunable lamp |
KR102346798B1 (ko) | 2015-02-13 | 2022-01-05 | 삼성전자주식회사 | 반도체 발광장치 |
EP3278018B1 (en) * | 2015-03-31 | 2021-09-22 | Lumileds LLC | Led lighting module with heat sink and a method of replacing an led module |
TWI646706B (zh) * | 2015-09-21 | 2019-01-01 | 隆達電子股份有限公司 | 發光二極體晶片封裝體 |
US20190267525A1 (en) * | 2018-02-26 | 2019-08-29 | Semicon Light Co., Ltd. | Semiconductor Light Emitting Devices And Method Of Manufacturing The Same |
US10575374B2 (en) | 2018-03-09 | 2020-02-25 | Ledengin, Inc. | Package for flip-chip LEDs with close spacing of LED chips |
USD899384S1 (en) * | 2019-11-04 | 2020-10-20 | Putco, Inc. | Surface-mount device |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6122704A (en) * | 1989-05-15 | 2000-09-19 | Dallas Semiconductor Corp. | Integrated circuit for identifying an item via a serial port |
US6036101A (en) * | 1990-05-15 | 2000-03-14 | Dallas Semiconductor Corporation | Electronic labeling systems and methods and electronic card systems and methods |
US5544268A (en) * | 1994-09-09 | 1996-08-06 | Deacon Research | Display panel with electrically-controlled waveguide-routing |
US5835458A (en) * | 1994-09-09 | 1998-11-10 | Gemfire Corporation | Solid state optical data reader using an electric field for routing control |
AU4902897A (en) * | 1996-11-08 | 1998-05-29 | W.L. Gore & Associates, Inc. | Method for improving reliability of thin circuit substrates by increasing the T of the substrate |
US6462976B1 (en) * | 1997-02-21 | 2002-10-08 | University Of Arkansas | Conversion of electrical energy from one form to another, and its management through multichip module structures |
US6351081B1 (en) * | 1998-03-27 | 2002-02-26 | Gapwoo Hwang | Electronic ballast for high intensity discharge lamp |
US6903376B2 (en) * | 1999-12-22 | 2005-06-07 | Lumileds Lighting U.S., Llc | Selective placement of quantum wells in flipchip light emitting diodes for improved light extraction |
US6573537B1 (en) * | 1999-12-22 | 2003-06-03 | Lumileds Lighting, U.S., Llc | Highly reflective ohmic contacts to III-nitride flip-chip LEDs |
US6885035B2 (en) * | 1999-12-22 | 2005-04-26 | Lumileds Lighting U.S., Llc | Multi-chip semiconductor LED assembly |
US6448642B1 (en) * | 2000-01-27 | 2002-09-10 | William W. Bewley | Pressure-bonded heat-sink system |
DE60129793T2 (de) * | 2000-01-28 | 2008-04-30 | Interuniversitair Micro-Electronica Centrum Vzw | Verfahren zum transfer und stapeln von halbleiterbausteinen |
US6791119B2 (en) * | 2001-02-01 | 2004-09-14 | Cree, Inc. | Light emitting diodes including modifications for light extraction |
ATE551731T1 (de) * | 2001-04-23 | 2012-04-15 | Panasonic Corp | Lichtemittierende einrichtung mit einem leuchtdioden-chip |
CN100524746C (zh) * | 2001-05-26 | 2009-08-05 | 吉尔科有限公司 | 用于局部照明的高功率led模块 |
US6740906B2 (en) * | 2001-07-23 | 2004-05-25 | Cree, Inc. | Light emitting diodes including modifications for submount bonding |
TW591990B (en) * | 2001-07-25 | 2004-06-11 | Sanyo Electric Co | Method for making an illumination device |
JP3989794B2 (ja) * | 2001-08-09 | 2007-10-10 | 松下電器産業株式会社 | Led照明装置およびled照明光源 |
WO2003083543A1 (fr) * | 2002-04-01 | 2003-10-09 | Ibiden Co., Ltd. | Substrat support de puce a circuit integre, procede de fabrication de substrat support de puce a circuit integre, dispositif de communication optique et procede de fabrication de dispositif de communication optique |
US6828596B2 (en) * | 2002-06-13 | 2004-12-07 | Lumileds Lighting U.S., Llc | Contacting scheme for large and small area semiconductor light emitting flip chip devices |
US20040140474A1 (en) * | 2002-06-25 | 2004-07-22 | Matsushita Electric Industrial Co., Ltd. | Semiconductor light-emitting device, method for fabricating the same and method for bonding the same |
KR101095753B1 (ko) * | 2002-08-01 | 2011-12-21 | 니치아 카가쿠 고교 가부시키가이샤 | 반도체 발광 소자 및 그 제조 방법과 그것을 이용한 발광장치 |
US7070207B2 (en) * | 2003-04-22 | 2006-07-04 | Ibiden Co., Ltd. | Substrate for mounting IC chip, multilayerd printed circuit board, and device for optical communication |
US6847057B1 (en) * | 2003-08-01 | 2005-01-25 | Lumileds Lighting U.S., Llc | Semiconductor light emitting devices |
-
2004
- 2004-09-07 WO PCT/JP2004/013290 patent/WO2005029185A2/en active Application Filing
- 2004-09-07 EP EP04772972A patent/EP1665397A2/en not_active Withdrawn
- 2004-09-07 US US10/569,360 patent/US20070023769A1/en not_active Abandoned
- 2004-09-07 JP JP2006519279A patent/JP2007528588A/ja not_active Withdrawn
- 2004-09-15 TW TW093127873A patent/TW200514284A/zh unknown
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI407038B (zh) * | 2005-09-15 | 2013-09-01 | Mag Instr Inc | 改良過發光二極體模組 |
TWI427832B (zh) * | 2011-10-24 | 2014-02-21 | Opto Tech Corp | 具鰭狀電極的發光二極體及其製造方法 |
US9666556B2 (en) | 2015-06-29 | 2017-05-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Flip chip packaging |
Also Published As
Publication number | Publication date |
---|---|
EP1665397A2 (en) | 2006-06-07 |
JP2007528588A (ja) | 2007-10-11 |
WO2005029185A3 (en) | 2005-11-10 |
WO2005029185A2 (en) | 2005-03-31 |
US20070023769A1 (en) | 2007-02-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200514284A (en) | LED lighting source and LED lighting apparatus | |
US7408204B2 (en) | Flip-chip packaging structure for light emitting diode and method thereof | |
US8227824B2 (en) | Light emitting device package | |
WO2003107444A3 (en) | LIGHT EMITTING DIODE DEVICE GEOMETRY | |
TWI256719B (en) | Semiconductor device package module and manufacturing method thereof | |
WO2003079434A3 (en) | Semiconductor device having a wire bond pad and method therefor | |
TW200715437A (en) | Semiconductor device and method of manufacturing the same | |
JP2008519419A5 (zh) | ||
SG139753A1 (en) | Semiconductor device | |
TW200509270A (en) | Semiconductor package having semiconductor constructing body and method of manufacturing the same | |
TW200628725A (en) | Illumination assembly using circuitized strips | |
TW200721336A (en) | Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices | |
EP1701380A3 (en) | Semiconductor power module | |
TW200631136A (en) | Method and device for heat dissipation in semiconductor modules | |
TW200635013A (en) | Stacked semiconductor package | |
TW200509260A (en) | Semiconductor integrated circuit | |
TW201304624A (zh) | 基板結構、半導體裝置陣列及其半導體裝置 | |
EP2221889A2 (en) | Light emitting device package | |
JP2004048067A5 (zh) | ||
TW200514276A (en) | Light-emitting semiconductor device having enhanced brightness | |
CN103199173A (zh) | 发光二极管芯片、封装基板、封装结构及其制法 | |
CN201053654Y (zh) | 一种大功率led直触式导热电路板 | |
CN100461474C (zh) | 倒装芯片式发光二极管封装结构及其封装方法 | |
US20070121327A1 (en) | Light-emitting device and process for manufacturing the same | |
US9839159B1 (en) | Dispense pattern for thermal interface material for a high aspect ratio thermal interface |