TW200513494A - Composition for resin of composite dielectric material, the material itself and electric circuit board using the same - Google Patents

Composition for resin of composite dielectric material, the material itself and electric circuit board using the same

Info

Publication number
TW200513494A
TW200513494A TW093129323A TW93129323A TW200513494A TW 200513494 A TW200513494 A TW 200513494A TW 093129323 A TW093129323 A TW 093129323A TW 93129323 A TW93129323 A TW 93129323A TW 200513494 A TW200513494 A TW 200513494A
Authority
TW
Taiwan
Prior art keywords
dielectric material
composite dielectric
composition
same
resin
Prior art date
Application number
TW093129323A
Other languages
English (en)
Other versions
TWI304830B (zh
Inventor
Hayahide Yamasaki
Yoshinobu Asako
Kazushi Omote
Ai Nishichi
Original Assignee
Nippon Catalytic Chem Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Catalytic Chem Ind filed Critical Nippon Catalytic Chem Ind
Publication of TW200513494A publication Critical patent/TW200513494A/zh
Application granted granted Critical
Publication of TWI304830B publication Critical patent/TWI304830B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having a potential-jump barrier or a surface barrier
    • H10K10/40—Organic transistors
    • H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462—Insulated gate field-effect transistors [IGFETs]
    • H10K10/468—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics
    • H10K10/478—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics the gate dielectric comprising a layer of composite material comprising interpenetrating or embedded materials, e.g. TiO2 particles in a polymer matrix
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/20—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06
    • H01G4/206—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06 inorganic and synthetic material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C08L101/04—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing halogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
TW093129323A 2003-09-30 2004-09-29 Composition for resin of composite dielectric material, the material itself and electric circuit board using the same TW200513494A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003338973 2003-09-30

Publications (2)

Publication Number Publication Date
TW200513494A true TW200513494A (en) 2005-04-16
TWI304830B TWI304830B (zh) 2009-01-01

Family

ID=34419140

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093129323A TW200513494A (en) 2003-09-30 2004-09-29 Composition for resin of composite dielectric material, the material itself and electric circuit board using the same

Country Status (7)

Country Link
US (1) US7632884B2 (zh)
EP (1) EP1669412A1 (zh)
JP (1) JP4601552B2 (zh)
KR (1) KR100884511B1 (zh)
CN (1) CN100582167C (zh)
TW (1) TW200513494A (zh)
WO (1) WO2005033209A1 (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100884511B1 (ko) * 2003-09-30 2009-02-18 가부시키가이샤 닛폰 쇼쿠바이 복합유전체용 수지 조성물 및 복합유전체, 그 유전체를사용한 전기회로기판
US7521705B2 (en) 2005-08-15 2009-04-21 Micron Technology, Inc. Reproducible resistance variable insulating memory devices having a shaped bottom electrode
US8414962B2 (en) 2005-10-28 2013-04-09 The Penn State Research Foundation Microcontact printed thin film capacitors
JP5595629B2 (ja) * 2005-12-13 2014-09-24 東レ株式会社 誘電性樹脂組成物およびそれから得られる成形品
JP4715921B2 (ja) * 2006-04-05 2011-07-06 株式会社村田製作所 積層型セラミック電子部品の製造方法及び積層型セラミック電子部品
JP4991185B2 (ja) * 2006-06-05 2012-08-01 株式会社日本触媒 ポリアリールスルホン系重合体及びその製造方法
JP5470788B2 (ja) * 2008-09-22 2014-04-16 セイコーエプソン株式会社 有機半導体装置、有機半導体装置の製造方法、電子デバイスおよび電子機器
JP5470787B2 (ja) * 2008-09-22 2014-04-16 セイコーエプソン株式会社 有機半導体装置、有機半導体装置の製造方法、電子デバイスおよび電子機器
JP5708160B2 (ja) * 2011-04-04 2015-04-30 Jsr株式会社 高周波回路基板用樹脂基板および高周波回路基板
TWI633342B (zh) * 2012-03-22 2018-08-21 日本觸媒股份有限公司 Light selective transmission filter, resin sheet and solid-state imaging element
KR101452594B1 (ko) 2012-12-26 2014-10-21 주식회사 두산 수지 조성물 및 이를 포함하는 금속박 적층체
US9809720B2 (en) * 2015-07-06 2017-11-07 University Of Massachusetts Ferroelectric nanocomposite based dielectric inks for reconfigurable RF and microwave applications
US10839992B1 (en) 2019-05-17 2020-11-17 Raytheon Company Thick film resistors having customizable resistances and methods of manufacture
CN112574521B (zh) * 2020-12-09 2022-04-26 广东生益科技股份有限公司 一种含氟树脂组合物及包含其的树脂胶液、含氟介质片、层压板、覆铜板和印刷电路板

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2764718A (en) * 1951-12-28 1956-09-25 Sprague Electric Co Electrical condensers
US4518737A (en) * 1978-12-26 1985-05-21 Rogers Corporation Dielectric material and method of making the dielectric material
JPH02225358A (ja) * 1989-02-23 1990-09-07 Matsushita Electric Works Ltd 複合誘電体
US5114780A (en) 1990-04-17 1992-05-19 Raychem Corporation Electronic articles containing a fluorinated poly(arylene ether) dielectric
JP3061194B2 (ja) * 1989-12-08 2000-07-10 アライド・シグナル・インコーポレイテツド フッ素化ポリ（アリーレンエーテル）誘電体を含んでなる電子物品
JP2802173B2 (ja) * 1990-02-06 1998-09-24 松下電工株式会社 複合誘電体
US5275878A (en) 1990-02-06 1994-01-04 Matsushita Electric Works, Ltd. Composite dielectric and printed-circuit use substrate utilizing the same
ES2099155T3 (es) * 1990-04-17 1997-05-16 Allied Signal Inc Poli(arileno-eteres) fluorados.
US5115082A (en) * 1990-04-17 1992-05-19 Raychem Corporation Fluorinated poly(arylene ether)
WO1992018213A1 (en) * 1991-04-12 1992-10-29 E.I. Du Pont De Nemours And Company High dielectric constant flexible ceramic composite
JP2617639B2 (ja) * 1991-11-06 1997-06-04 松下電工株式会社 複合誘電体および回路用基板
US6207764B1 (en) 1995-04-26 2001-03-27 Monsanto Company Halogenated elastomer compositions
US5739193A (en) * 1996-05-07 1998-04-14 Hoechst Celanese Corp. Polymeric compositions having a temperature-stable dielectric constant
US6599631B2 (en) * 2001-01-26 2003-07-29 Nanogram Corporation Polymer-inorganic particle composites
JPH11260148A (ja) 1998-03-13 1999-09-24 Hitachi Ltd 薄膜誘電体とそれを用いた多層配線板とその製造方法
JP4044236B2 (ja) 1999-03-11 2008-02-06 株式会社東芝 半導体装置の製造方法
TWI256959B (en) 2000-07-31 2006-06-21 Sumitomo Chemical Co Aromatic liquid-crystalline polyester solution composition
JP4543518B2 (ja) * 2000-08-11 2010-09-15 住友化学株式会社 誘電体ペースト及び誘電体膜
KR100399018B1 (ko) * 2000-12-19 2003-09-19 광주과학기술원 플로린을 함유한 광소자용 폴리아릴렌에테르설폰 또는 폴리아릴렌에테르설파이드 및 그 제조방법
US6797345B2 (en) 2001-04-27 2004-09-28 Sumitomo Chemical Company, Limited Aromatic liquid-crystalline polyester metal laminate
JP2002344100A (ja) * 2001-05-21 2002-11-29 Sumitomo Electric Ind Ltd 基板用誘電体材料及びその製造方法
JP4273739B2 (ja) 2001-10-16 2009-06-03 東洋紡績株式会社 誘電加熱接着用樹脂組成物、ホットメルト接着剤、被接着材の接着方法、ホットメルト接着剤の被接着材として用いられる被接着用樹脂組成物および接着複合体
US6706136B2 (en) 2001-10-16 2004-03-16 Toyo Boseki Kabushiki Kaisha Resin composition for high-frequency bonding
JP2003138026A (ja) * 2001-11-05 2003-05-14 Nippon Shokubai Co Ltd 樹脂組成物および成形品
US7049393B2 (en) * 2002-05-28 2006-05-23 National Research Council Of Canada Techniques for the preparation of highly fluorinated polyethers
US7164197B2 (en) * 2003-06-19 2007-01-16 3M Innovative Properties Company Dielectric composite material
KR100884511B1 (ko) * 2003-09-30 2009-02-18 가부시키가이샤 닛폰 쇼쿠바이 복합유전체용 수지 조성물 및 복합유전체, 그 유전체를사용한 전기회로기판
JP2009016169A (ja) * 2007-07-04 2009-01-22 Nippon Shokubai Co Ltd 複合誘電体用樹脂組成物および複合誘電体、該誘電体を使用した電気回路基板

Also Published As

Publication number Publication date
EP1669412A1 (en) 2006-06-14
KR20060097719A (ko) 2006-09-14
US20050101714A1 (en) 2005-05-12
TWI304830B (zh) 2009-01-01
JPWO2005033209A1 (ja) 2006-12-14
CN100582167C (zh) 2010-01-20
US7632884B2 (en) 2009-12-15
WO2005033209A1 (ja) 2005-04-14
JP4601552B2 (ja) 2010-12-22
CN1860184A (zh) 2006-11-08
KR100884511B1 (ko) 2009-02-18

Similar Documents

Publication Publication Date Title
TW200513494A (en) Composition for resin of composite dielectric material, the material itself and electric circuit board using the same
DE60332968D1 (de) Herstellungsverfahren
HK1101405A1 (en) Photosensitive dielectric resin compositions and their uses
EP1207726A3 (en) Conductive ink composition
ATE551380T1 (de) Beschichtungszusammensetzung für dielektrisch isolierenden film, daraus hergestellter dielektrisch isolierender film und davon gebrauch machende elektrische oder elektronische vorrichtung
EP1950246A4 (en) CONDUCTIVE RESIN COMPOSITION, CONDUCTIVE FILM THEREFOR AND RESISTIVE FILM SWITCH THEREFOR
ATE354466T1 (de) Leichte leiterplatte mit leitungsmaterial enthaltenden kernen
ATE503287T1 (de) Antennenvorrichtung und kommunikationsgerät
TW200604266A (en) Organic formulations of polythiophenes and polypyrrole polymers made with polymeric acid colloids for electronics applications
TW200620334A (en) Multi-layer insulated wire, processes for preparing the same, and its applications
GB2427408A (en) Circuit Materials Circuits Multi Layer Circuits And Method Of Manufacture
TW200518139A (en) Polythiophenes having alkyleneoxythiathiophene units in electrolyte capacitors
TW200720323A (en) Thermosetting resin, thermosetting composition containing the same, and molded body obtained from the same
TW200600542A (en) Compositions with polymers for advanced materials
AU2002352080A1 (en) Heat-curable resin composition
TW200506015A (en) Coating composition for insulating film production, preparation method of insulation film by using the same, insulation film for semi-conductor device prepared therefrom, and semi-conductor device comprising the same
WO2005033179A8 (en) Flame-retardant thermoset composition, method, and article
TW200621101A (en) Circuit board
TW200504144A (en) Electronic material composition, electronic product and method of using electronic material composition
TW200504139A (en) Epoxy compound and cured epoxy resin product
WO2002058078A3 (en) Thick film compositions containing pyrochlore-related compounds
WO2005024895A3 (de) Polymergemische für gedruckte polymerelektronik-schaltungen
WO2008114674A1 (ja) 絶縁性複合体、その製造方法、および絶縁性複合体の利用
WO2005038907A3 (de) Wärmeleitende verpackung von elektronischen schaltungseinheiten
TW200742191A (en) A plug in the field of telecommunications, an assembly including a telecommunications module and a plug, and a method of manufacturing a plug

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees