TW200512547A - Exposure mask, exposure equipment, and method for manufacturing display panel - Google Patents

Exposure mask, exposure equipment, and method for manufacturing display panel

Info

Publication number
TW200512547A
TW200512547A TW093126036A TW93126036A TW200512547A TW 200512547 A TW200512547 A TW 200512547A TW 093126036 A TW093126036 A TW 093126036A TW 93126036 A TW93126036 A TW 93126036A TW 200512547 A TW200512547 A TW 200512547A
Authority
TW
Taiwan
Prior art keywords
exposure
taper portion
exposure mask
area proximate
display panel
Prior art date
Application number
TW093126036A
Other languages
English (en)
Inventor
Seong-Bong Kim
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of TW200512547A publication Critical patent/TW200512547A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70475—Stitching, i.e. connecting image fields to produce a device field, the field occupied by a device such as a memory chip, processor chip, CCD, flat panel display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/13625—Patterning using multi-mask exposure

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Liquid Crystal (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW093126036A 2003-09-01 2004-08-30 Exposure mask, exposure equipment, and method for manufacturing display panel TW200512547A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020030060707A KR101006435B1 (ko) 2003-09-01 2003-09-01 노광 마스크, 이를 포함하는 노광 장치 및 이를 이용한표시 장치용 표시판의 제조 방법

Publications (1)

Publication Number Publication Date
TW200512547A true TW200512547A (en) 2005-04-01

Family

ID=34101866

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093126036A TW200512547A (en) 2003-09-01 2004-08-30 Exposure mask, exposure equipment, and method for manufacturing display panel

Country Status (4)

Country Link
US (1) US7388653B2 (zh)
JP (1) JP2005107504A (zh)
KR (1) KR101006435B1 (zh)
TW (1) TW200512547A (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7588869B2 (en) * 2003-12-30 2009-09-15 Lg Display Co., Ltd. Divided exposure method for making a liquid crystal display
JP3890333B2 (ja) * 2004-02-06 2007-03-07 キヤノン株式会社 固体撮像装置
KR100925984B1 (ko) * 2004-10-26 2009-11-10 엘지디스플레이 주식회사 액정표시장치 제조방법
JP5079448B2 (ja) * 2007-10-24 2012-11-21 株式会社ジャパンディスプレイウェスト 液晶装置及びそれを備えた電子機器
KR101030030B1 (ko) 2009-12-11 2011-04-20 삼성모바일디스플레이주식회사 마스크 조립체
KR101309864B1 (ko) * 2010-02-02 2013-09-16 엘지디스플레이 주식회사 마스크 어셈블리
KR101232181B1 (ko) * 2010-02-03 2013-02-12 엘지디스플레이 주식회사 마스크 어셈블리
JP5879575B2 (ja) * 2011-09-02 2016-03-08 株式会社Ｊｏｌｅｄ 表示パネルの製造方法
JP2013238670A (ja) * 2012-05-11 2013-11-28 Canon Inc 露光装置、露光方法、デバイスの製造方法及び開口板
CN102749801A (zh) * 2012-06-29 2012-10-24 北京京东方光电科技有限公司 一种掩模板
JP6243616B2 (ja) * 2013-03-26 2017-12-06 キヤノン株式会社 露光装置および物品の製造方法
KR102290753B1 (ko) * 2014-09-19 2021-08-19 삼성디스플레이 주식회사 패턴 형성 방법 및 이를 이용한 표시 패널의 제조 방법
KR102343411B1 (ko) * 2015-05-15 2021-12-24 삼성디스플레이 주식회사 표시 장치
DE102017105402A1 (de) * 2017-03-14 2018-09-20 Infineon Technologies Ag Retikel und belichtungsverfahren, das eine projektion eines retikelmusters in benachbarte belichtungsfelder einschliesst
KR102150881B1 (ko) 2019-03-21 2020-09-02 동우 화인켐 주식회사 터치센서 및 이를 형성하는 노광 마스크

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02180013A (ja) * 1989-01-05 1990-07-12 Nippon Telegr & Teleph Corp <Ntt> Ｘ線投影露光装置
US5729331A (en) * 1993-06-30 1998-03-17 Nikon Corporation Exposure apparatus, optical projection apparatus and a method for adjusting the optical projection apparatus
JP3451721B2 (ja) * 1994-06-06 2003-09-29 株式会社ニコン 投影光学装置及びそれを備えた露光装置並びにその調整方法
JPH088169A (ja) * 1994-06-23 1996-01-12 Nikon Corp 露光装置
KR950034472A (ko) * 1994-04-06 1995-12-28 가나이 쓰토무 패턴형성방법 및 그것에 사용되는 투영노광장치
JP3087209B2 (ja) * 1994-11-19 2000-09-11 東京エレクトロン株式会社 露光装置
JPH09129550A (ja) * 1995-08-30 1997-05-16 Canon Inc 露光装置及びそれを用いたデバイスの製造方法
JPH1062809A (ja) * 1996-08-13 1998-03-06 Nikon Corp 投影露光方法
US6027865A (en) * 1997-02-10 2000-02-22 Texas Instruments Incorporated Method for accurate patterning of photoresist during lithography process
JP3159163B2 (ja) * 1998-04-06 2001-04-23 日本電気株式会社 走査露光方法及び走査露光装置
JP2000267257A (ja) * 1999-03-12 2000-09-29 Canon Inc マスク及びそれを用いた露光方法
JP2000321784A (ja) * 1999-05-07 2000-11-24 Nikon Corp 露光方法および露光装置
US6445439B1 (en) * 1999-12-27 2002-09-03 Svg Lithography Systems, Inc. EUV reticle thermal management
US6476905B1 (en) * 2000-01-20 2002-11-05 Taiwan Semiconductor Manufacturing Co., Ltd. Step and scan exposure system equipped with a plurality of attenuator blades for exposure control
TW495836B (en) * 2000-02-02 2002-07-21 Nikon Corp Scanning exposure method and device
US6573975B2 (en) * 2001-04-04 2003-06-03 Pradeep K. Govil DUV scanner linewidth control by mask error factor compensation
US6960415B2 (en) * 2001-10-01 2005-11-01 Canon Kabushiki Kaisha Aberration measuring method and projection exposure apparatus
JP4362999B2 (ja) * 2001-11-12 2009-11-11 株式会社ニコン 露光装置及び露光方法、並びにデバイス製造方法
US6774983B2 (en) * 2002-08-12 2004-08-10 Anvik Corporation Distributed projection system
JP2004341365A (ja) * 2003-05-16 2004-12-02 Tadahiro Omi マスク描画方法、及びマスク描画装置

Also Published As

Publication number Publication date
US20050024622A1 (en) 2005-02-03
JP2005107504A (ja) 2005-04-21
US7388653B2 (en) 2008-06-17
KR101006435B1 (ko) 2011-01-06
KR20050024642A (ko) 2005-03-11

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