TW200510930A - Photosensitive insulating resin composition and its hardened product - Google Patents

Photosensitive insulating resin composition and its hardened product

Info

Publication number
TW200510930A
TW200510930A TW093127169A TW93127169A TW200510930A TW 200510930 A TW200510930 A TW 200510930A TW 093127169 A TW093127169 A TW 093127169A TW 93127169 A TW93127169 A TW 93127169A TW 200510930 A TW200510930 A TW 200510930A
Authority
TW
Taiwan
Prior art keywords
resin composition
insulating resin
vinyl monomer
photosensitive insulating
hardened product
Prior art date
Application number
TW093127169A
Other languages
English (en)
Inventor
Hirohumi Goto
Katsumi Inomata
Shin-Ichiro Iwanaga
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200510930A publication Critical patent/TW200510930A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
    • H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/312—Organic layers, e.g. photoresist

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
TW093127169A 2003-09-09 2004-09-08 Photosensitive insulating resin composition and its hardened product TW200510930A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003317112A JP4175221B2 (ja) 2003-09-09 2003-09-09 感光性絶縁樹脂組成物およびその硬化物

Publications (1)

Publication Number Publication Date
TW200510930A true TW200510930A (en) 2005-03-16

Family

ID=34308474

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093127169A TW200510930A (en) 2003-09-09 2004-09-08 Photosensitive insulating resin composition and its hardened product

Country Status (6)

Country Link
US (1) US20070027231A1 (zh)
EP (1) EP1666969B1 (zh)
JP (1) JP4175221B2 (zh)
KR (1) KR101095711B1 (zh)
TW (1) TW200510930A (zh)
WO (1) WO2005026841A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101097908B1 (ko) * 2004-12-09 2011-12-23 주식회사 이엔에프테크놀로지 세정액 조성물 및 이의 제조방법
KR100737383B1 (ko) * 2006-09-11 2007-07-09 한국전자통신연구원 절연막, 이를 이용한 유기박막 트랜지스터 및 제조방법
JP2008180879A (ja) * 2007-01-24 2008-08-07 Tokyo Ohka Kogyo Co Ltd 感光性樹脂組成物及びこれを用いたレジストパターンの形成方法
KR101510883B1 (ko) 2008-06-05 2015-04-10 엘지디스플레이 주식회사 유기 박막트랜지스터와 그 제조방법
KR20140131609A (ko) * 2013-05-02 2014-11-14 삼성디스플레이 주식회사 감광성 수지 조성물, 패턴 형성 방법 및 이를 이용한 액정 표시 장치
CN105899568A (zh) 2014-01-10 2016-08-24 三菱化学株式会社 热固性树脂组合物、使用该组合物而形成的固化构件及保护涂层、具备该保护涂层的偏光元件、以及图像显示装置
JP6428393B2 (ja) * 2014-03-18 2018-11-28 Jsr株式会社 感放射線性組成物、硬化膜、表示素子及び着色剤分散液
TWI519560B (zh) 2014-11-24 2016-02-01 財團法人工業技術研究院 含氧雜環丁烷基與環氧基之樹脂與樹脂組成物
JP7151286B2 (ja) * 2018-09-03 2022-10-12 Jnc株式会社 熱硬化性組成物

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5416138A (en) * 1992-09-24 1995-05-16 Sumitomo Bakelite Company Limited Epoxy resin composition
JP3190251B2 (ja) * 1995-06-06 2001-07-23 太陽インキ製造株式会社 アルカリ現像型のフレキシブルプリント配線板用光硬化性・熱硬化性樹脂組成物
US5882842A (en) * 1996-02-16 1999-03-16 Kansai Paint Co., Ltd. Active energy ray-curable resin composition
JP3839543B2 (ja) * 1996-02-16 2006-11-01 関西ペイント株式会社 活性エネルギー線硬化性樹脂組成物
US6190833B1 (en) * 1997-03-30 2001-02-20 Jsr Corporation Radiation-sensitive resin composition
JP4125805B2 (ja) * 1997-06-03 2008-07-30 関西ペイント株式会社 活性エネルギー線硬化型粉体塗料組成物
JPH11148045A (ja) * 1997-11-19 1999-06-02 Kansai Paint Co Ltd 活性エネルギー線硬化型塗料組成物及びそれを用いた被膜形成方法
JP3956490B2 (ja) * 1998-07-09 2007-08-08 Ｊｓｒ株式会社 オキセタン共重合体およびその製造方法
US6166100A (en) * 1998-07-22 2000-12-26 Kansai Paint Co., Ltd. Cationically polymerizable pigmented composition
US6498200B1 (en) * 1999-01-12 2002-12-24 Namics Corporation Cationically polymerizable resin composition
JP3835120B2 (ja) * 2000-05-22 2006-10-18 Ｊｓｒ株式会社 感放射線性樹脂組成物並びに層間絶縁膜およびマイクロレンズ
JP2002040632A (ja) * 2000-07-21 2002-02-06 Showa Denko Kk レジストインキ組成物
JP2003156843A (ja) * 2001-11-21 2003-05-30 Sumitomo Chem Co Ltd 感放射線性樹脂組成物

Also Published As

Publication number Publication date
KR20060082076A (ko) 2006-07-14
WO2005026841A1 (ja) 2005-03-24
KR101095711B1 (ko) 2011-12-20
EP1666969A4 (en) 2007-06-13
US20070027231A1 (en) 2007-02-01
JP2005084415A (ja) 2005-03-31
EP1666969A1 (en) 2006-06-07
JP4175221B2 (ja) 2008-11-05
EP1666969B1 (en) 2018-01-10

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