TW200508429A - Process for producing single crystal and silicon single crystal wafer - Google Patents

Process for producing single crystal and silicon single crystal wafer

Info

Publication number
TW200508429A
TW200508429A TW093124770A TW93124770A TW200508429A TW 200508429 A TW200508429 A TW 200508429A TW 093124770 A TW093124770 A TW 093124770A TW 93124770 A TW93124770 A TW 93124770A TW 200508429 A TW200508429 A TW 200508429A
Authority
TW
Taiwan
Prior art keywords
single crystal
pulled
producing
straightening pipe
region
Prior art date
Application number
TW093124770A
Other languages
English (en)
Chinese (zh)
Other versions
TWI338728B (OSRAM
Inventor
Izumi Fusegawa
Nobuaki Mitamura
Takahiro Yanagimachi
Original Assignee
Shinetsu Handotai Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Handotai Kk filed Critical Shinetsu Handotai Kk
Publication of TW200508429A publication Critical patent/TW200508429A/zh
Application granted granted Critical
Publication of TWI338728B publication Critical patent/TWI338728B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/20—Controlling or regulating
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02—Elements
    • C30B29/06—Silicon
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
    • Y10T117/10—Apparatus
    • Y10T117/1024—Apparatus for crystallization from liquid or supercritical state
    • Y10T117/1032—Seed pulling
    • Y10T117/1068—Seed pulling including heating or cooling details [e.g., shield configuration]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
TW093124770A 2003-08-20 2004-08-18 Process for producing single crystal and silicon single crystal wafer TW200508429A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003296837 2003-08-20

Publications (2)

Publication Number Publication Date
TW200508429A true TW200508429A (en) 2005-03-01
TWI338728B TWI338728B (OSRAM) 2011-03-11

Family

ID=34213598

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093124770A TW200508429A (en) 2003-08-20 2004-08-18 Process for producing single crystal and silicon single crystal wafer

Country Status (6)

Country Link
US (1) US7326395B2 (OSRAM)
EP (1) EP1662024B1 (OSRAM)
JP (1) JP4293188B2 (OSRAM)
KR (1) KR101120615B1 (OSRAM)
TW (1) TW200508429A (OSRAM)
WO (1) WO2005019506A1 (OSRAM)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005073439A1 (ja) * 2004-02-02 2005-08-11 Shin-Etsu Handotai Co., Ltd. シリコン単結晶及びシリコンウェーハ及びそれらの製造装置並びに製造方法
US7387680B2 (en) * 2005-05-13 2008-06-17 Cree, Inc. Method and apparatus for the production of silicon carbide crystals
DE102006002682A1 (de) 2006-01-19 2007-08-02 Siltronic Ag Vorrichtung und Verfahren zur Herstellung eines Einkristalls, Einkristall und Halbleiterscheibe
KR101384060B1 (ko) * 2012-08-03 2014-04-09 주식회사 엘지실트론 실리콘 단결정 잉곳 성장 방법
CN103911654B (zh) * 2014-04-15 2016-08-17 宁夏大学 制备直径为400mm以上的单晶硅的方法
CN111962140A (zh) * 2020-08-28 2020-11-20 晶科绿能(上海)管理有限公司 连续拉晶装置和连续拉制晶棒的方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0741383A (ja) 1993-07-29 1995-02-10 Nippon Steel Corp 半導体単結晶およびその製造方法
JP3085146B2 (ja) 1995-05-31 2000-09-04 住友金属工業株式会社 シリコン単結晶ウェーハおよびその製造方法
JPH09202684A (ja) 1996-01-19 1997-08-05 Shin Etsu Handotai Co Ltd 結晶欠陥が少ないシリコン単結晶の製造方法およびこの方法で製造されたシリコン単結晶
JP3460551B2 (ja) 1997-11-11 2003-10-27 信越半導体株式会社 結晶欠陥の少ないシリコン単結晶ウエーハ及びその製造方法
JP3601324B2 (ja) * 1998-11-19 2004-12-15 信越半導体株式会社 結晶欠陥の少ないシリコン単結晶ウエーハ及びその製造方法
JP3752890B2 (ja) 1999-05-26 2006-03-08 株式会社Ｓｕｍｃｏ シリコン単結晶インゴットの製造方法
WO2001063027A1 (en) 2000-02-28 2001-08-30 Shin-Etsu Handotai Co., Ltd Method for preparing silicon single crystal and silicon single crystal
WO2001081661A1 (fr) * 2000-04-25 2001-11-01 Shin-Etsu Handotai Co.,Ltd. Tranche de silicium monocristallin, son procede d'elaboration et procede d'obtention d'une tranche de silicium monocristallin
JP3994665B2 (ja) * 2000-12-28 2007-10-24 信越半導体株式会社 シリコン単結晶ウエーハおよびシリコン単結晶の製造方法
US7129123B2 (en) * 2002-08-27 2006-10-31 Shin-Etsu Handotai Co., Ltd. SOI wafer and a method for producing an SOI wafer
JP4193610B2 (ja) * 2003-06-27 2008-12-10 信越半導体株式会社 単結晶の製造方法

Also Published As

Publication number Publication date
KR101120615B1 (ko) 2012-03-16
WO2005019506A1 (ja) 2005-03-03
KR20060037445A (ko) 2006-05-03
JPWO2005019506A1 (ja) 2007-11-01
EP1662024A4 (en) 2008-10-15
EP1662024A1 (en) 2006-05-31
EP1662024B1 (en) 2016-01-13
US20060236919A1 (en) 2006-10-26
JP4293188B2 (ja) 2009-07-08
TWI338728B (OSRAM) 2011-03-11
US7326395B2 (en) 2008-02-05

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees