WO2009025338A1 - Igbt用のシリコン単結晶ウェーハ及びigbt用のシリコン単結晶ウェーハの製造方法 - Google Patents
Igbt用のシリコン単結晶ウェーハ及びigbt用のシリコン単結晶ウェーハの製造方法 Download PDFInfo
- Publication number
- WO2009025338A1 WO2009025338A1 PCT/JP2008/064951 JP2008064951W WO2009025338A1 WO 2009025338 A1 WO2009025338 A1 WO 2009025338A1 JP 2008064951 W JP2008064951 W JP 2008064951W WO 2009025338 A1 WO2009025338 A1 WO 2009025338A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- igbt
- single crystal
- silicon single
- crystal wafer
- wafer
- Prior art date
Links
- 239000013078 crystal Substances 0.000 title abstract 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 3
- 229910052710 silicon Inorganic materials 0.000 title abstract 3
- 239000010703 silicon Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract 1
- 230000007547 defect Effects 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 229910052760 oxygen Inorganic materials 0.000 abstract 1
- 239000001301 oxygen Substances 0.000 abstract 1
- 239000002244 precipitate Substances 0.000 abstract 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/20—Controlling or regulating
- C30B15/203—Controlling or regulating the relationship of pull rate (v) to axial thermal gradient (G)
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
- C30B33/02—Heat treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/322—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
- H01L21/3221—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering
- H01L21/3225—Thermally inducing defects using oxygen present in the silicon body for intrinsic gettering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66234—Bipolar junction transistors [BJT]
- H01L29/66325—Bipolar junction transistors [BJT] controlled by field-effect, e.g. insulated gate bipolar transistors [IGBT]
- H01L29/66333—Vertical insulated gate bipolar transistors
- H01L29/66348—Vertical insulated gate bipolar transistors with a recessed gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
- H01L29/7395—Vertical transistors, e.g. vertical IGBT
- H01L29/7396—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions
- H01L29/7397—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions and a gate structure lying on a slanted or vertical surface or formed in a groove, e.g. trench gate IGBT
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Thermal Sciences (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
チョクラルスキー法によって育成されたシリコン単結晶からなるIGBT用のシリコン単結晶ウェーハであって、引き上げ速度マージンを拡大することが可能であるとともに、抵抗率のバラツキが小さなウェーハの製造が可能なように、結晶径方向全域においてCOP欠陥および転位クラスタが排除されており、IGBT用デバイスプロセス熱処理後に20nm以上の酸素析出物密度が1×105個/cm3以下である。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009529064A JP5304649B2 (ja) | 2007-08-21 | 2008-08-21 | Igbt用のシリコン単結晶ウェーハの製造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-215332 | 2007-08-21 | ||
JP2007215332 | 2007-08-21 |
Publications (1)
Publication Number | Publication Date |
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WO2009025338A1 true WO2009025338A1 (ja) | 2009-02-26 |
Family
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Family Applications (1)
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PCT/JP2008/064951 WO2009025338A1 (ja) | 2007-08-21 | 2008-08-21 | Igbt用のシリコン単結晶ウェーハ及びigbt用のシリコン単結晶ウェーハの製造方法 |
Country Status (2)
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JP (1) | JP5304649B2 (ja) |
WO (1) | WO2009025338A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012101957A1 (ja) * | 2011-01-24 | 2012-08-02 | 信越半導体株式会社 | シリコン単結晶ウェーハの製造方法及びアニールウェーハ |
JP2013142054A (ja) * | 2012-01-12 | 2013-07-22 | Shin Etsu Handotai Co Ltd | シリコン基板の製造方法 |
JP7466790B1 (ja) | 2023-02-27 | 2024-04-12 | 三菱電機株式会社 | 半導体装置の製造方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20240071775A1 (en) * | 2022-08-24 | 2024-02-29 | Semiconductor Components Industries, Llc | Methods of manufacturing semiconductor devices semiconductor devices |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005154172A (ja) * | 2003-11-21 | 2005-06-16 | Shin Etsu Handotai Co Ltd | シリコン単結晶の製造方法及びシリコン単結晶製造装置の設計方法並びにシリコン単結晶製造装置 |
JP2006312575A (ja) * | 2005-04-08 | 2006-11-16 | Sumco Corp | シリコンウェーハおよびその製造方法 |
JP2006344823A (ja) * | 2005-06-09 | 2006-12-21 | Sumco Corp | Igbt用のシリコンウェーハ及びその製造方法 |
JP2007191350A (ja) * | 2006-01-19 | 2007-08-02 | Sumco Corp | Igbt用シリコン単結晶ウェーハ及びigbt用シリコン単結晶ウェーハの製造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004002239A2 (en) * | 2002-06-28 | 2004-01-08 | Pharmachem Laboratories, Inc. | Purified amylase inhibitor and novel process for obtaining the same |
US7704318B2 (en) * | 2003-02-25 | 2010-04-27 | Sumco Corporation | Silicon wafer, SOI substrate, method for growing silicon single crystal, method for manufacturing silicon wafer, and method for manufacturing SOI substrate |
-
2008
- 2008-08-21 WO PCT/JP2008/064951 patent/WO2009025338A1/ja active Application Filing
- 2008-08-21 JP JP2009529064A patent/JP5304649B2/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005154172A (ja) * | 2003-11-21 | 2005-06-16 | Shin Etsu Handotai Co Ltd | シリコン単結晶の製造方法及びシリコン単結晶製造装置の設計方法並びにシリコン単結晶製造装置 |
JP2006312575A (ja) * | 2005-04-08 | 2006-11-16 | Sumco Corp | シリコンウェーハおよびその製造方法 |
JP2006344823A (ja) * | 2005-06-09 | 2006-12-21 | Sumco Corp | Igbt用のシリコンウェーハ及びその製造方法 |
JP2007191350A (ja) * | 2006-01-19 | 2007-08-02 | Sumco Corp | Igbt用シリコン単結晶ウェーハ及びigbt用シリコン単結晶ウェーハの製造方法 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012101957A1 (ja) * | 2011-01-24 | 2012-08-02 | 信越半導体株式会社 | シリコン単結晶ウェーハの製造方法及びアニールウェーハ |
CN103328696A (zh) * | 2011-01-24 | 2013-09-25 | 信越半导体股份有限公司 | 单晶硅晶片的制造方法及退火晶片 |
US8916953B2 (en) | 2011-01-24 | 2014-12-23 | Shin-Etsu Handotai Co., Ltd. | Method for manufacturing silicon single crystal wafer and annealed wafer |
CN103328696B (zh) * | 2011-01-24 | 2016-05-11 | 信越半导体股份有限公司 | 单晶硅晶片的制造方法及退火晶片 |
JP2013142054A (ja) * | 2012-01-12 | 2013-07-22 | Shin Etsu Handotai Co Ltd | シリコン基板の製造方法 |
JP7466790B1 (ja) | 2023-02-27 | 2024-04-12 | 三菱電機株式会社 | 半導体装置の製造方法 |
WO2024180627A1 (ja) * | 2023-02-27 | 2024-09-06 | 三菱電機株式会社 | 半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
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JPWO2009025338A1 (ja) | 2010-11-25 |
JP5304649B2 (ja) | 2013-10-02 |
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