TW200507185A - Structure of static random access memory and method of making the same - Google Patents

Structure of static random access memory and method of making the same

Info

Publication number
TW200507185A
TW200507185A TW093102676A TW93102676A TW200507185A TW 200507185 A TW200507185 A TW 200507185A TW 093102676 A TW093102676 A TW 093102676A TW 93102676 A TW93102676 A TW 93102676A TW 200507185 A TW200507185 A TW 200507185A
Authority
TW
Taiwan
Prior art keywords
sram
same
random access
making
access memory
Prior art date
Application number
TW093102676A
Other languages
English (en)
Other versions
TWI260071B (en
Inventor
Ping-Wei Wang
Chang-Ta Yang
Original Assignee
Taiwan Semiconductor Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Mfg Co Ltd filed Critical Taiwan Semiconductor Mfg Co Ltd
Publication of TW200507185A publication Critical patent/TW200507185A/zh
Application granted granted Critical
Publication of TWI260071B publication Critical patent/TWI260071B/zh

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/41Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming static cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger
    • G11C11/412Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming static cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger using field-effect transistors only
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B10/00Static random access memory [SRAM] devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B10/00Static random access memory [SRAM] devices
    • H10B10/12Static random access memory [SRAM] devices comprising a MOSFET load element
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66787Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel
    • H01L29/66795Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/785Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/903FET configuration adapted for use as static memory cell
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/903FET configuration adapted for use as static memory cell
    • Y10S257/904FET configuration adapted for use as static memory cell with passive components,, e.g. polysilicon resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Semiconductor Memories (AREA)
TW093102676A 2003-08-08 2004-02-05 Structure of static random access memory and method of making the same TWI260071B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/637,322 US6924560B2 (en) 2003-08-08 2003-08-08 Compact SRAM cell with FinFET

Publications (2)

Publication Number Publication Date
TW200507185A true TW200507185A (en) 2005-02-16
TWI260071B TWI260071B (en) 2006-08-11

Family

ID=34116591

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093102676A TWI260071B (en) 2003-08-08 2004-02-05 Structure of static random access memory and method of making the same

Country Status (2)

Country Link
US (1) US6924560B2 (zh)
TW (1) TWI260071B (zh)

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CN103151071A (zh) * 2011-12-06 2013-06-12 台湾积体电路制造股份有限公司 用于finfet单元的方法和装置
CN104103579A (zh) * 2013-04-04 2014-10-15 意法半导体公司 集成电路器件和制作技术
CN106486156A (zh) * 2016-09-21 2017-03-08 宁波大学 一种基于FinFET器件的存储单元
TWI608593B (zh) * 2012-01-13 2017-12-11 泰拉創新股份有限公司 半導體裝置的元件電路

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CN103151071A (zh) * 2011-12-06 2013-06-12 台湾积体电路制造股份有限公司 用于finfet单元的方法和装置
CN103151071B (zh) * 2011-12-06 2016-01-27 台湾积体电路制造股份有限公司 用于finfet单元的方法和装置
TWI608593B (zh) * 2012-01-13 2017-12-11 泰拉創新股份有限公司 半導體裝置的元件電路
CN104103579A (zh) * 2013-04-04 2014-10-15 意法半导体公司 集成电路器件和制作技术
CN104103579B (zh) * 2013-04-04 2018-02-02 意法半导体公司 集成电路器件和制作技术
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CN106486156A (zh) * 2016-09-21 2017-03-08 宁波大学 一种基于FinFET器件的存储单元
CN106486156B (zh) * 2016-09-21 2019-02-05 宁波大学 一种基于FinFET器件的存储单元

Also Published As

Publication number Publication date
US20050029556A1 (en) 2005-02-10
TWI260071B (en) 2006-08-11
US6924560B2 (en) 2005-08-02

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