TW200500291A - Micromechanical or microoptoelectronic devices with deposit of getter material and integrated heater, and support for the production thereof - Google Patents

Micromechanical or microoptoelectronic devices with deposit of getter material and integrated heater, and support for the production thereof

Info

Publication number
TW200500291A
TW200500291A TW093100361A TW93100361A TW200500291A TW 200500291 A TW200500291 A TW 200500291A TW 093100361 A TW093100361 A TW 093100361A TW 93100361 A TW93100361 A TW 93100361A TW 200500291 A TW200500291 A TW 200500291A
Authority
TW
Taiwan
Prior art keywords
getter material
micromechanical
deposit
support
production
Prior art date
Application number
TW093100361A
Other languages
English (en)
Chinese (zh)
Inventor
Marco Amiotti
Original Assignee
Getters Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Getters Spa filed Critical Getters Spa
Publication of TW200500291A publication Critical patent/TW200500291A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
    • B81B7/0038—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)
  • Common Detailed Techniques For Electron Tubes Or Discharge Tubes (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
TW093100361A 2003-01-17 2004-01-07 Micromechanical or microoptoelectronic devices with deposit of getter material and integrated heater, and support for the production thereof TW200500291A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT000069A ITMI20030069A1 (it) 2003-01-17 2003-01-17 Dispositivi micromeccanici o microoptoelettronici con deposito di materiale getter e riscaldatore integrato.

Publications (1)

Publication Number Publication Date
TW200500291A true TW200500291A (en) 2005-01-01

Family

ID=32750478

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093100361A TW200500291A (en) 2003-01-17 2004-01-07 Micromechanical or microoptoelectronic devices with deposit of getter material and integrated heater, and support for the production thereof

Country Status (11)

Country Link
EP (1) EP1592643A2 (enExample)
JP (1) JP2006513046A (enExample)
KR (1) KR20050092426A (enExample)
CN (1) CN100453442C (enExample)
AU (1) AU2003295223A1 (enExample)
CA (1) CA2511836A1 (enExample)
IT (1) ITMI20030069A1 (enExample)
MY (1) MY157923A (enExample)
NO (1) NO20053804L (enExample)
TW (1) TW200500291A (enExample)
WO (1) WO2004065289A2 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005001449B3 (de) * 2005-01-12 2006-07-20 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Erzeugen eines vorgegebenen Innendrucks in einem Hohlraum eines Halbleiterbauelements
ITMI20052343A1 (it) * 2005-12-06 2007-06-07 Getters Spa Processo per la produzione di dispositivi micromeccanici contenenti un materiale getter e dispositivi cosi'prodotti
FR2898597B1 (fr) 2006-03-16 2008-09-19 Commissariat Energie Atomique Encapsulation dans une cavite hermetique d'un compose microelectronique, notamment d'un mems
FR2903678B1 (fr) * 2006-07-13 2008-10-24 Commissariat Energie Atomique Microcomposant encapsule equipe d'au moins un getter
US7402905B2 (en) * 2006-08-07 2008-07-22 Honeywell International Inc. Methods of fabrication of wafer-level vacuum packaged devices
ITMI20070301A1 (it) 2007-02-16 2008-08-17 Getters Spa Supporti comprendenti materiali getter e sorgenti di metalli alcalini o alcalino-terrosi per sistemi di termoregolazione basati su effetto tunnel
FR2933389B1 (fr) * 2008-07-01 2010-10-29 Commissariat Energie Atomique Structure a base d'un materiau getter suspendu
JP2010251702A (ja) * 2009-03-27 2010-11-04 Kyocera Corp 電子部品、パッケージおよび赤外線センサ
FR2956521B1 (fr) * 2010-02-16 2012-08-17 Thales Sa Dispositif comprenant des composants electriques, electroniques, electromecaniques ou electro-optiques, a sensibilite reduite a faible debit de dose
US9491802B2 (en) 2012-02-17 2016-11-08 Honeywell International Inc. On-chip alkali dispenser
EP2736071B8 (en) 2012-11-22 2017-04-19 Tronic's Microsystems S.A. Wafer level package with getter
JP6193480B2 (ja) 2013-05-24 2017-09-06 スナップトラック・インコーポレーテッド 微小電気機械システムデバイスパッケージおよび微小電気機械システムデバイスパッケージを製造するための方法
EP2813465B1 (en) 2013-06-12 2020-01-15 Tronic's Microsystems MEMS device with getter layer
FR3008965B1 (fr) * 2013-07-26 2017-03-03 Commissariat Energie Atomique Structure d'encapsulation comprenant un capot renforce mecaniquement et a effet getter
CN104743502A (zh) * 2013-12-31 2015-07-01 北京有色金属研究总院 一种具有复合吸气剂层的mems组件及其制备方法
JP2017224704A (ja) 2016-06-15 2017-12-21 セイコーエプソン株式会社 真空パッケージ、電子デバイス、電子機器及び移動体
CN109173690B (zh) * 2018-09-20 2020-10-09 内蒙古科技大学 一种用于金属材料热处理中的空气消耗剂
CN114057156A (zh) * 2021-12-21 2022-02-18 罕王微电子（辽宁）有限公司 一种用于晶圆级mems真空封装的金属扩散吸附系统及工艺

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5734226A (en) * 1992-08-12 1998-03-31 Micron Technology, Inc. Wire-bonded getters useful in evacuated displays
US5610438A (en) * 1995-03-08 1997-03-11 Texas Instruments Incorporated Micro-mechanical device with non-evaporable getter
US5837935A (en) * 1996-02-26 1998-11-17 Ford Motor Company Hermetic seal for an electronic component having a secondary chamber
SE9700612D0 (sv) * 1997-02-20 1997-02-20 Cecap Ab Sensorelement med integrerat referenstryck
US6992375B2 (en) * 2000-11-30 2006-01-31 Texas Instruments Incorporated Anchor for device package

Also Published As

Publication number Publication date
KR20050092426A (ko) 2005-09-21
ITMI20030069A1 (it) 2004-07-18
HK1087090A1 (zh) 2006-10-06
WO2004065289A2 (en) 2004-08-05
WO2004065289A3 (en) 2005-01-06
AU2003295223A1 (en) 2004-08-13
JP2006513046A (ja) 2006-04-20
MY157923A (en) 2016-08-15
CN1738765A (zh) 2006-02-22
CA2511836A1 (en) 2004-08-05
EP1592643A2 (en) 2005-11-09
CN100453442C (zh) 2009-01-21
NO20053804L (no) 2005-08-12

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