TW200420517A - High concentration silica slurry - Google Patents

High concentration silica slurry

Info

Publication number
TW200420517A
TW200420517A TW092132959A TW92132959A TW200420517A TW 200420517 A TW200420517 A TW 200420517A TW 092132959 A TW092132959 A TW 092132959A TW 92132959 A TW92132959 A TW 92132959A TW 200420517 A TW200420517 A TW 200420517A
Authority
TW
Taiwan
Prior art keywords
less
silica
high concentration
particle size
ppm
Prior art date
Application number
TW092132959A
Other languages
English (en)
Inventor
Toshio Morii
Paul Brandl
Original Assignee
Nippon Aerosil Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Aerosil Co Ltd filed Critical Nippon Aerosil Co Ltd
Publication of TW200420517A publication Critical patent/TW200420517A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
    • C01B33/141—Preparation of hydrosols or aqueous dispersions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
    • C01B33/141—Preparation of hydrosols or aqueous dispersions
    • C01B33/1415—Preparation of hydrosols or aqueous dispersions by suspending finely divided silica in water
    • C01B33/1417—Preparation of hydrosols or aqueous dispersions by suspending finely divided silica in water an aqueous dispersion being obtained
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Silicon Compounds (AREA)
TW092132959A 2002-11-22 2003-11-21 High concentration silica slurry TW200420517A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002339402 2002-11-22

Publications (1)

Publication Number Publication Date
TW200420517A true TW200420517A (en) 2004-10-16

Family

ID=32212141

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092132959A TW200420517A (en) 2002-11-22 2003-11-21 High concentration silica slurry

Country Status (8)

Country Link
US (1) US7192461B2 (zh)
EP (1) EP1422277B1 (zh)
JP (1) JPWO2004048265A1 (zh)
KR (1) KR100688300B1 (zh)
CN (1) CN1328163C (zh)
DE (1) DE60311053T2 (zh)
TW (1) TW200420517A (zh)
WO (1) WO2004048265A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1323124C (zh) * 1996-09-30 2007-06-27 日立化成工业株式会社 氧化铈研磨剂以及基板的研磨方法
JPH11181403A (ja) * 1997-12-18 1999-07-06 Hitachi Chem Co Ltd 酸化セリウム研磨剤及び基板の研磨法
JP4640981B2 (ja) * 2005-11-25 2011-03-02 花王株式会社 基板の製造方法
DE102006046619A1 (de) * 2006-09-29 2008-04-03 Heraeus Quarzglas Gmbh & Co. Kg Streichfähiger SiO2-Schlicker für die Herstellung von Quarzglas, Verfahren zur Herstellung von Quarzglas unter Einsatz des Schlickers
US20110177623A1 (en) * 2010-01-15 2011-07-21 Confluense Llc Active Tribology Management of CMP Polishing Material

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3673104A (en) * 1969-04-28 1972-06-27 Nalco Chemical Co Method of preparing silica sols containing large particle size silica
US4588421A (en) * 1984-10-15 1986-05-13 Nalco Chemical Company Aqueous silica compositions for polishing silicon wafers
JPS6230333A (ja) 1985-05-20 1987-02-09 ナルコ　ケミカル　カンパニ− シリコンウエ−ハの研磨方法及び組成物
US5030286A (en) * 1988-09-22 1991-07-09 Ppg Industries, Inc. High solids aqueous silica slurry
JPH05154760A (ja) 1991-12-02 1993-06-22 Fujimi Inkooporeetetsudo:Kk シリコンウエーハの研磨用組成物及び研磨方法
KR19990023544A (ko) * 1997-08-19 1999-03-25 마쯔모또 에이찌 무기 입자의 수성 분산체와 그의 제조 방법
JPH11349925A (ja) * 1998-06-05 1999-12-21 Fujimi Inc エッジポリッシング用組成物
JP4500380B2 (ja) 1999-08-11 2010-07-14 株式会社トクヤマ ヒュームドシリカスラリーの製造方法
DE19943103A1 (de) * 1999-09-09 2001-03-15 Wacker Chemie Gmbh Hochgefüllte SiO2-Dispersion, Verfahren zu ihrer Herstellung und Verwendung
WO2001032799A1 (en) * 1999-11-04 2001-05-10 Nanogram Corporation Particle dispersions
JP2001152134A (ja) * 1999-11-22 2001-06-05 Speedfam Co Ltd 酸化物単結晶ウェーハ用研磨用組成物及び酸化物単結晶ウェーハの研磨方法
JP4156175B2 (ja) 2000-05-31 2008-09-24 山口精研工業株式会社 タンタル酸リチウム／ニオブ酸リチウム単結晶材料用精密研磨組成物
JP4789080B2 (ja) * 2000-06-20 2011-10-05 日本アエロジル株式会社 非晶質微細シリカ粒子の製造方法
US6740589B2 (en) * 2000-11-30 2004-05-25 Showa Denko Kabushiki Kaisha Composition for polishing semiconductor wafer, semiconductor circuit wafer, and method for producing the same
DE10065027A1 (de) * 2000-12-23 2002-07-04 Degussa Wäßrige Dispersion, Verfahren zu deren Herstellung und Verwendung
US6857824B2 (en) * 2001-10-18 2005-02-22 Akzo Nobel N.V. Sealing composition and its use
JP3965497B2 (ja) * 2001-12-28 2007-08-29 日本アエロジル株式会社 低増粘性フュームドシリカおよびそのスラリー
US7544726B2 (en) * 2002-10-14 2009-06-09 Akzo Nobel N.V. Colloidal silica composition

Also Published As

Publication number Publication date
KR20050086527A (ko) 2005-08-30
DE60311053T2 (de) 2007-11-08
US7192461B2 (en) 2007-03-20
EP1422277B1 (en) 2007-01-10
KR100688300B1 (ko) 2007-03-02
CN1711216A (zh) 2005-12-21
US20040129176A1 (en) 2004-07-08
JPWO2004048265A1 (ja) 2006-03-23
DE60311053D1 (de) 2007-02-22
WO2004048265A1 (ja) 2004-06-10
EP1422277A1 (en) 2004-05-26
CN1328163C (zh) 2007-07-25

Similar Documents

Publication Publication Date Title
CN102348661B (zh) 具有低熟料含量的混凝土
GB2432589A (en) Molybdenum metal powder and production thereof
TW200420517A (en) High concentration silica slurry
CA2496584A1 (en) Copper-based alloy, and cast ingot and liquid-contacting part each using the alloy
CN102127649A (zh) 渣铝分离熔剂
Kumar et al. Measurement of Flow Characteristics for Multiparticulate Bottom Ash-water Suspension with Additives.
TW345512B (en) Pre-alloyed binder powder and process for the manufacture of diamond tools by using the same
MY136737A (en) High concentration silica slurry
ES2174436T3 (es) Polvo prealeado que contiene cobre, y su utilizacion en la fabricacion de herramientas de diamante.
Fayomi et al. A Review of Energy Consumption in Foundry Industry
SE0300881D0 (sv) Powder metal composition and method for producing components thereof
HK1070833A1 (en) Free-flowing, powdery composition containing alpha-liponic acid (- derivatives)
CN1328889A (zh) 碳化钨铝硬质合金纳米粉末的制备方法
CN205462479U (zh) 一种用于雷蒙磨的碾磨结构
CN107350467A (zh) 一种耐高温粉末冶金连杆的制备方法
CN107955657A (zh) 一种复合型节能净化剂及其制备方法
JPS6479338A (en) Wear-resistant alloy excellent in corrosion resistance to halogen gas and its production
CN1160148C (zh) 生产人造金刚石的动-静态法
CN209531008U (zh) 一种镍铁矿破碎机
CN104073722A (zh) 一种复合粉体材料及其制备方法与应用
JPS5298611A (en) Corrosion-resisting and wear-resisting aluminium alloy and its product ion process
Chrapek et al. Sustainable synthesis and manufacturing of silver powder-based metal clay for zero-waste technology applications
CN101693511A (zh) 支点反力与作用力叠加杠杆
CN205700720U (zh) 一种碳棒定量添加装置
Colorado-Arango et al. Grinding and classification efficiency evaluation in raw materials: cement plant study