TW200420419A - Vacuum-assisted attachment holding device - Google Patents
Vacuum-assisted attachment holding deviceInfo
- Publication number
- TW200420419A TW200420419A TW92127675A TW92127675A TW200420419A TW 200420419 A TW200420419 A TW 200420419A TW 92127675 A TW92127675 A TW 92127675A TW 92127675 A TW92127675 A TW 92127675A TW 200420419 A TW200420419 A TW 200420419A
- Authority
- TW
- Taiwan
- Prior art keywords
- top face
- support substrate
- extremely thin
- substrate
- vacuum
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Laminated Bodies (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Vapour Deposition (AREA)
- Surface Treatment Of Glass (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE20215401U DE20215401U1 (de) | 2002-10-07 | 2002-10-07 | Verbund aus einem Dünnstsubsrat und einem Trägersubstrat mit lösbarem Verbindungsmittel |
DE10323302A DE10323302A1 (de) | 2002-10-07 | 2003-05-21 | Vakuumunterstützte adhäsive Haltevorrichtung für Dünnstglas |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200420419A true TW200420419A (en) | 2004-10-16 |
Family
ID=31896475
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW92127675A TW200420419A (en) | 2002-10-07 | 2003-10-06 | Vacuum-assisted attachment holding device |
TW92127676A TW200409700A (en) | 2002-10-07 | 2003-10-06 | Detachable compound composed by connection of extremely thin substrate and carrier plate |
TW92127674A TW200415679A (en) | 2002-10-07 | 2003-10-06 | Composite composed of thin substrate separably bound to carrier substrate |
TW92127673A TW200414949A (en) | 2002-10-07 | 2003-10-06 | Detachably connected compound comprising an extremely thin substrate and a support substrate |
Family Applications After (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW92127676A TW200409700A (en) | 2002-10-07 | 2003-10-06 | Detachable compound composed by connection of extremely thin substrate and carrier plate |
TW92127674A TW200415679A (en) | 2002-10-07 | 2003-10-06 | Composite composed of thin substrate separably bound to carrier substrate |
TW92127673A TW200414949A (en) | 2002-10-07 | 2003-10-06 | Detachably connected compound comprising an extremely thin substrate and a support substrate |
Country Status (2)
Country | Link |
---|---|
DE (5) | DE20215401U1 (de) |
TW (4) | TW200420419A (de) |
Families Citing this family (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10348946B4 (de) * | 2003-10-18 | 2008-01-31 | Schott Ag | Bearbeitungsverbund für ein Substrat |
DE102004016627A1 (de) | 2004-03-29 | 2005-11-24 | Gottlieb Binder Gmbh & Co. Kg | Anzeigevorrichtung |
JP5200538B2 (ja) | 2005-08-09 | 2013-06-05 | 旭硝子株式会社 | 薄板ガラス積層体及び薄板ガラス積層体を用いた表示装置の製造方法 |
JP5532918B2 (ja) * | 2007-03-12 | 2014-06-25 | 旭硝子株式会社 | 保護ガラス付ガラス基板を用いた表示装置の製造方法 |
KR100813851B1 (ko) * | 2007-04-05 | 2008-03-17 | 삼성에스디아이 주식회사 | 투명 전도성 산화막인 캐소드를 구비하는 유기전계발광소자및 그의 제조방법 |
TWI514090B (zh) | 2007-07-13 | 2015-12-21 | Mapper Lithography Ip Bv | 微影系統及用於支撐晶圓的晶圓台 |
US8705010B2 (en) | 2007-07-13 | 2014-04-22 | Mapper Lithography Ip B.V. | Lithography system, method of clamping and wafer table |
DE102009012394A1 (de) | 2009-03-10 | 2010-11-18 | Schott Ag | Gehäusebauteil, insbesondere für optoelektronische Anwendungen |
US9847243B2 (en) * | 2009-08-27 | 2017-12-19 | Corning Incorporated | Debonding a glass substrate from carrier using ultrasonic wave |
US20120255672A1 (en) * | 2011-04-11 | 2012-10-11 | Marshall Dale C | Methods and apparatuses for applying a handling tab to continuous glass ribbons |
US20130105089A1 (en) * | 2011-10-28 | 2013-05-02 | Industrial Technology Research Institute | Method for separating substrate assembly |
TWI586544B (zh) | 2011-10-31 | 2017-06-11 | 康寧公司 | 以靜電釘固之玻璃捲及其製造方法與裝置 |
US10077207B2 (en) | 2011-11-30 | 2018-09-18 | Corning Incorporated | Optical coating method, apparatus and product |
US9957609B2 (en) | 2011-11-30 | 2018-05-01 | Corning Incorporated | Process for making of glass articles with optical and easy-to-clean coatings |
US10543662B2 (en) | 2012-02-08 | 2020-01-28 | Corning Incorporated | Device modified substrate article and methods for making |
WO2014008036A1 (en) * | 2012-07-02 | 2014-01-09 | Corning Incorporated | Methods of processing a glass substrate and glass apparatus |
DE102012215149A1 (de) * | 2012-08-27 | 2014-03-20 | Schott Ag | Glassubstratband |
CN105143500B (zh) * | 2012-10-04 | 2017-10-10 | 康宁股份有限公司 | 光学涂覆方法、设备和产品 |
TWI591040B (zh) | 2012-10-22 | 2017-07-11 | 康寧公司 | 玻璃纖維網和拼接的方法 |
US9340443B2 (en) | 2012-12-13 | 2016-05-17 | Corning Incorporated | Bulk annealing of glass sheets |
US10014177B2 (en) | 2012-12-13 | 2018-07-03 | Corning Incorporated | Methods for processing electronic devices |
US10086584B2 (en) | 2012-12-13 | 2018-10-02 | Corning Incorporated | Glass articles and methods for controlled bonding of glass sheets with carriers |
TWI617437B (zh) | 2012-12-13 | 2018-03-11 | 康寧公司 | 促進控制薄片與載體間接合之處理 |
CN105555732A (zh) * | 2013-02-07 | 2016-05-04 | 康宁股份有限公司 | 使用静电钉扎形成柔性玻璃层压件的设备和方法 |
US11766849B2 (en) | 2013-03-14 | 2023-09-26 | Corning Incorporated | Methods and apparatus for fabricating and cutting flexible glass and polymer composite structures |
KR20160023819A (ko) | 2013-06-20 | 2016-03-03 | 쇼오트 글라스 테크놀로지스 (쑤저우) 코퍼레이션 리미티드. | 지지 기판 상의 얇은 유리의 접합된 물품, 그 준비 방법 및 용도 |
DE102013106631B4 (de) * | 2013-06-25 | 2017-07-27 | Osram Oled Gmbh | Verfahren zum Bearbeiten eines elektronischen Bauelements und elektronische Bauelementeanordnung |
US10510576B2 (en) | 2013-10-14 | 2019-12-17 | Corning Incorporated | Carrier-bonding methods and articles for semiconductor and interposer processing |
JP6770432B2 (ja) | 2014-01-27 | 2020-10-14 | コーニング インコーポレイテッド | 薄いシートの担体との制御された結合のための物品および方法 |
KR20160145062A (ko) | 2014-04-09 | 2016-12-19 | 코닝 인코포레이티드 | 디바이스 변경된 기판 물품 및 제조 방법 |
WO2016025188A1 (en) | 2014-08-15 | 2016-02-18 | 3M Innovative Properties Company | Glass and polymer film assemblies and methods of making |
CN106142761A (zh) * | 2014-10-23 | 2016-11-23 | 凤凰集团有限公司 | 薄玻璃加工方法 |
DE202016100186U1 (de) | 2015-01-15 | 2016-02-01 | Fhr Anlagenbau Gmbh | Substrathalterung |
CN107635769B (zh) | 2015-05-19 | 2020-09-15 | 康宁股份有限公司 | 使片材与载体粘结的制品和方法 |
US11905201B2 (en) | 2015-06-26 | 2024-02-20 | Corning Incorporated | Methods and articles including a sheet and a carrier |
TW202216444A (zh) | 2016-08-30 | 2022-05-01 | 美商康寧公司 | 用於片材接合的矽氧烷電漿聚合物 |
TWI821867B (zh) | 2016-08-31 | 2023-11-11 | 美商康寧公司 | 具以可控制式黏結的薄片之製品及製作其之方法 |
US11999135B2 (en) | 2017-08-18 | 2024-06-04 | Corning Incorporated | Temporary bonding using polycationic polymers |
JP7431160B2 (ja) | 2017-12-15 | 2024-02-14 | コーニング インコーポレイテッド | 基板を処理するための方法および結合されたシートを含む物品を製造するための方法 |
CN110497667A (zh) * | 2019-08-19 | 2019-11-26 | 东旭科技集团有限公司 | 一种复合玻璃板及其制造方法 |
CN111495643A (zh) * | 2020-06-02 | 2020-08-07 | 拓米(成都)应用技术研究院有限公司 | 一种玻璃边缘封胶装置及方法和应用 |
CN112158385B (zh) * | 2020-11-16 | 2021-06-15 | 乐清海创智能科技有限公司 | 一种大型显示器分块贴膜装置 |
CN114436547A (zh) * | 2022-03-09 | 2022-05-06 | 长沙汇意圆科技有限公司 | 一种柔性玻璃制品制作加工方法 |
CN115974419B (zh) * | 2022-12-15 | 2023-11-24 | 东华大学 | 锌硼硅紫外防护涂层及涂覆该涂层的超薄玻璃 |
CN116023040B (zh) * | 2022-12-15 | 2024-06-28 | 东华大学 | 紫外防护涂层及涂覆该涂层的超薄玻璃 |
-
2002
- 2002-10-07 DE DE20215401U patent/DE20215401U1/de not_active Expired - Lifetime
-
2003
- 2003-05-21 DE DE10323304A patent/DE10323304A1/de not_active Ceased
- 2003-05-21 DE DE10323301A patent/DE10323301A1/de not_active Ceased
- 2003-05-21 DE DE10323302A patent/DE10323302A1/de not_active Ceased
- 2003-05-21 DE DE10323303A patent/DE10323303A1/de not_active Ceased
- 2003-10-06 TW TW92127675A patent/TW200420419A/zh unknown
- 2003-10-06 TW TW92127676A patent/TW200409700A/zh unknown
- 2003-10-06 TW TW92127674A patent/TW200415679A/zh unknown
- 2003-10-06 TW TW92127673A patent/TW200414949A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
DE10323302A1 (de) | 2004-04-15 |
DE10323303A1 (de) | 2004-04-15 |
TW200415679A (en) | 2004-08-16 |
TW200414949A (en) | 2004-08-16 |
TW200409700A (en) | 2004-06-16 |
DE10323301A1 (de) | 2004-04-15 |
DE20215401U1 (de) | 2004-02-19 |
DE10323304A1 (de) | 2004-04-15 |
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