TW200420419A - Vacuum-assisted attachment holding device - Google Patents

Vacuum-assisted attachment holding device

Info

Publication number
TW200420419A
TW200420419A TW92127675A TW92127675A TW200420419A TW 200420419 A TW200420419 A TW 200420419A TW 92127675 A TW92127675 A TW 92127675A TW 92127675 A TW92127675 A TW 92127675A TW 200420419 A TW200420419 A TW 200420419A
Authority
TW
Taiwan
Prior art keywords
top face
support substrate
extremely thin
substrate
vacuum
Prior art date
Application number
TW92127675A
Other languages
Chinese (zh)
Inventor
Andreas Habeck
Clemens Ottermann
Silke Knoche
Steffen Astheimer
Armin Plichta
Gerd Rudas
Gerhard Weber
Original Assignee
Schott Glas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schott Glas filed Critical Schott Glas
Publication of TW200420419A publication Critical patent/TW200420419A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Laminated Bodies (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Surface Treatment Of Glass (AREA)

Abstract

The invention relates to a compound comprising: - an extremely thin substrate that is provided with a thickness of < 0.3 mm and a top face and a bottom face; and - a support substrate having a top face and a bottom face. The extremely thin substrate is removably connected to the support substrate by means of a joining material that connects the top face of the extremely thin substrate and the top face of the support substrate and/or the edge region of the extremely thin substrate and the support substrate. Said compound is characterized by the fact that the top face of the support substrate has a fine pattern and forms an open minute recess space with a depth less than 100 μm.
TW92127675A 2002-10-07 2003-10-06 Vacuum-assisted attachment holding device TW200420419A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE20215401U DE20215401U1 (en) 2002-10-07 2002-10-07 Composite of a thin substrate and a carrier substrate with releasable connecting means
DE10323302A DE10323302A1 (en) 2002-10-07 2003-05-21 Composite comprises thin substrate (e.g. glass) less than 0.3 mm thick releasably bound to carrier substrate having fine structuring with open, infinitesimal cavities, useful in e.g. display industry, polymer electronics, and biotechnology

Publications (1)

Publication Number Publication Date
TW200420419A true TW200420419A (en) 2004-10-16

Family

ID=31896475

Family Applications (4)

Application Number Title Priority Date Filing Date
TW92127676A TW200409700A (en) 2002-10-07 2003-10-06 Detachable compound composed by connection of extremely thin substrate and carrier plate
TW92127675A TW200420419A (en) 2002-10-07 2003-10-06 Vacuum-assisted attachment holding device
TW92127673A TW200414949A (en) 2002-10-07 2003-10-06 Detachably connected compound comprising an extremely thin substrate and a support substrate
TW92127674A TW200415679A (en) 2002-10-07 2003-10-06 Composite composed of thin substrate separably bound to carrier substrate

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW92127676A TW200409700A (en) 2002-10-07 2003-10-06 Detachable compound composed by connection of extremely thin substrate and carrier plate

Family Applications After (2)

Application Number Title Priority Date Filing Date
TW92127673A TW200414949A (en) 2002-10-07 2003-10-06 Detachably connected compound comprising an extremely thin substrate and a support substrate
TW92127674A TW200415679A (en) 2002-10-07 2003-10-06 Composite composed of thin substrate separably bound to carrier substrate

Country Status (2)

Country Link
DE (5) DE20215401U1 (en)
TW (4) TW200409700A (en)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
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DE10348946B4 (en) * 2003-10-18 2008-01-31 Schott Ag Machining compound for a substrate
DE102004016627A1 (en) * 2004-03-29 2005-11-24 Gottlieb Binder Gmbh & Co. Kg display device
CN101242951B (en) 2005-08-09 2012-10-31 旭硝子株式会社 Thin sheet glass laminate and method for manufacturing display using thin sheet glass laminate
CN101626991B (en) * 2007-03-12 2012-08-22 旭硝子株式会社 Glass substrate provided with protection glass and method for manufacturing display device using glass substrate provided with protection glass
KR100813851B1 (en) * 2007-04-05 2008-03-17 삼성에스디아이 주식회사 Organic light emitting device having cathode of transparent conducting oxide layer and method of fabricating the same
US8705010B2 (en) 2007-07-13 2014-04-22 Mapper Lithography Ip B.V. Lithography system, method of clamping and wafer table
TWI450047B (en) 2007-07-13 2014-08-21 Mapper Lithography Ip Bv Lithography ststem, method of clamping and wafer table
DE102009012394A1 (en) 2009-03-10 2010-11-18 Schott Ag Housing component, particularly for optoelectronic components, has metallic element and non-metallic element, where the non-metallic element has session layer system on sub-range
US9847243B2 (en) * 2009-08-27 2017-12-19 Corning Incorporated Debonding a glass substrate from carrier using ultrasonic wave
US20120255672A1 (en) * 2011-04-11 2012-10-11 Marshall Dale C Methods and apparatuses for applying a handling tab to continuous glass ribbons
US20130105089A1 (en) * 2011-10-28 2013-05-02 Industrial Technology Research Institute Method for separating substrate assembly
JP6152569B2 (en) * 2011-10-31 2017-06-28 コーニング インコーポレイテッド Electrostatically fixed glass roll, manufacturing method and apparatus thereof
US10077207B2 (en) 2011-11-30 2018-09-18 Corning Incorporated Optical coating method, apparatus and product
US9957609B2 (en) 2011-11-30 2018-05-01 Corning Incorporated Process for making of glass articles with optical and easy-to-clean coatings
US10543662B2 (en) 2012-02-08 2020-01-28 Corning Incorporated Device modified substrate article and methods for making
WO2014008036A1 (en) * 2012-07-02 2014-01-09 Corning Incorporated Methods of processing a glass substrate and glass apparatus
DE102012215149A1 (en) * 2012-08-27 2014-03-20 Schott Ag Glass substrate tape
CN105143500B (en) * 2012-10-04 2017-10-10 康宁股份有限公司 Optics painting method, equipment and product
TWI591040B (en) 2012-10-22 2017-07-11 康寧公司 Glass webs and methods of splicing
TWI617437B (en) 2012-12-13 2018-03-11 康寧公司 Facilitated processing for controlling bonding between sheet and carrier
US10086584B2 (en) 2012-12-13 2018-10-02 Corning Incorporated Glass articles and methods for controlled bonding of glass sheets with carriers
US9340443B2 (en) 2012-12-13 2016-05-17 Corning Incorporated Bulk annealing of glass sheets
US10014177B2 (en) 2012-12-13 2018-07-03 Corning Incorporated Methods for processing electronic devices
EP2953911A4 (en) * 2013-02-07 2016-10-12 Corning Inc Apparatus and methods of forming flexible glass laminates using electrostatic pinning
WO2014159168A1 (en) * 2013-03-14 2014-10-02 Corning Incorporated Methods for fabricating and cutting flexible glass and polymer composite structures and apparatus
CN105307864B (en) 2013-06-20 2018-03-30 肖特玻璃科技(苏州)有限公司 The conjugant of thin glass on the support substrate and its production and use
DE102013106631B4 (en) * 2013-06-25 2017-07-27 Osram Oled Gmbh Method for processing an electronic component and electronic component assembly
US10510576B2 (en) 2013-10-14 2019-12-17 Corning Incorporated Carrier-bonding methods and articles for semiconductor and interposer processing
KR102353030B1 (en) 2014-01-27 2022-01-19 코닝 인코포레이티드 Articles and methods for controlled bonding of thin sheets with carriers
SG11201608442TA (en) 2014-04-09 2016-11-29 Corning Inc Device modified substrate article and methods for making
WO2016025188A1 (en) 2014-08-15 2016-02-18 3M Innovative Properties Company Glass and polymer film assemblies and methods of making
CN106142761A (en) * 2014-10-23 2016-11-23 凤凰集团有限公司 Thin glass processing method
DE202016100186U1 (en) 2015-01-15 2016-02-01 Fhr Anlagenbau Gmbh substrate holder
KR102573207B1 (en) 2015-05-19 2023-08-31 코닝 인코포레이티드 Articles and methods for bonding sheets and carriers
CN117534339A (en) 2015-06-26 2024-02-09 康宁股份有限公司 Methods and articles comprising a sheet and a carrier
TW201825623A (en) 2016-08-30 2018-07-16 美商康寧公司 Siloxane plasma polymers for sheet bonding
TWI821867B (en) 2016-08-31 2023-11-11 美商康寧公司 Articles of controllably bonded sheets and methods for making same
WO2019036710A1 (en) 2017-08-18 2019-02-21 Corning Incorporated Temporary bonding using polycationic polymers
JP7431160B2 (en) 2017-12-15 2024-02-14 コーニング インコーポレイテッド Methods for processing substrates and manufacturing articles including bonded sheets
CN110497667A (en) * 2019-08-19 2019-11-26 东旭科技集团有限公司 A kind of composite glass and its manufacturing method
CN111495643A (en) * 2020-06-02 2020-08-07 拓米(成都)应用技术研究院有限公司 Glass edge glue sealing device and method and application
CN112158385B (en) * 2020-11-16 2021-06-15 乐清海创智能科技有限公司 Large-scale display blocking pad pasting device
CN114436547A (en) * 2022-03-09 2022-05-06 长沙汇意圆科技有限公司 Manufacturing and processing method of flexible glass product
CN115974419B (en) * 2022-12-15 2023-11-24 东华大学 Zinc-boron-silicon ultraviolet protective coating and ultrathin glass coated with same
CN116023040B (en) * 2022-12-15 2024-06-28 东华大学 Ultraviolet protective coating and ultrathin glass coated with same

Also Published As

Publication number Publication date
DE10323302A1 (en) 2004-04-15
DE10323304A1 (en) 2004-04-15
TW200415679A (en) 2004-08-16
DE10323303A1 (en) 2004-04-15
TW200414949A (en) 2004-08-16
TW200409700A (en) 2004-06-16
DE10323301A1 (en) 2004-04-15
DE20215401U1 (en) 2004-02-19

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