CN106142761A - Thin glass processing method - Google Patents
Thin glass processing method Download PDFInfo
- Publication number
- CN106142761A CN106142761A CN201510135486.4A CN201510135486A CN106142761A CN 106142761 A CN106142761 A CN 106142761A CN 201510135486 A CN201510135486 A CN 201510135486A CN 106142761 A CN106142761 A CN 106142761A
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- CN
- China
- Prior art keywords
- thin glass
- glass plate
- plate
- lamination
- sheet
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/16—Drying; Softening; Cleaning
- B32B38/162—Cleaning
Landscapes
- Engineering & Computer Science (AREA)
- Quality & Reliability (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The present invention provides a kind of thin glass processing method, use binding agent by multiple thin glass plates lamination and to fix when i.e. cutting and process thin glass plate temporarily, then cutting is carried out with shaped by block unit, make binding agent absorb the part stress being delivered to thin glass, and then make the cutting utilizing the cutter sweeps such as diamond wheel, diamond milling cutters, water cutting machine to carry out and processing technique implement automatization and reduce the thin glass-making processes that chip (chipping) occurs.The thin glass-making processes of the etch process removing chip (Chipping) easy to implement is provided in addition.
Description
Technical field
The present invention relates to the thin glass processing method of the uses such as the display screen of mobile terminal device, cover plate.Specifically, after thin glass layer pressure, can cut with block unit and process, chip can be reduced man-hour to greatest extent cutting and adding and removed the thin glass processing method of fine debris by chemical etching.
Background technology
The general thickness glass less than 0.2mm is referred to as thin glass.This thin glass substrate purposes is various, can be used to make the substrate of the device such as LCD and light-emitting diode display, cover plate etc..
The organic light emitting display (OLED) utilization rate on portable mobile apparatus display screen is stepped up at present, therefore develops the thin glass of various form for anti-oxidation and moistureproof.
Fig. 1 is the use-case that makes of thin glass, the composition that display is used as organic light emitting display (OLED) substrate (back plate).
The cover glass thickness of portable mobile apparatus is typically all 0.5mm, but along with the competition on the thickness of portable mobile apparatus and weight, gradually tilts to thin glass, and the demand of each side such as protecting back face cover also continues to increase simultaneously.
Described thin glass is thin because of its thickness, substantially by monolithic, one raw sheet cannot be carried out CNC processing from structure, can only cut its shape of post-treatment with laser or diamond segment.
But, laser or diamond segment cutting and the method for processing peripheral shape is used according to traditional, adding and easily produce chip man-hour, bending strength cannot be satisfactory, and the processing technique in departments of assembly such as mobile phone operation technique upper speaker, keyways becomes more difficult.
And polishing method and chemical drugs must be utilized to be etched could effectively removing the chip (chipping) adding generation in man-hour, but must carry out cutting and processing technique by sheet unit, it is difficult to be etched processing and flexible thin glass cannot being processed.
Summary of the invention
Use binding agent by multiple thin glass plates lamination and to fix when it is an object of the invention to provide a kind of cutting and processing thin glass plate temporarily, then cutting is carried out with shaped by block unit, make binding agent absorb to be delivered to the stress of thin glass and utilize the cutter sweeps such as diamond wheel, diamond milling cutters, water cutting machine to be cut by sheet block unit and processed, and implement automation process and reduce the thin glass processing method that chip occurs.
Can cut by sheet block unit additionally, the present invention provides and process, make the chemical etching operation implemented for the purpose of removing chip (chipping) become easy and be prone to remove the thin glass processing method of fine debris.
Technical scheme
Thin glass processing method according to the present invention, including: after the thin glass plate of composition thin glass sheet being fixed and is laminated with binding agent, metallic plate or glass is placed on the thin glass plate top of lamination, and apply to remove metallic plate or glass after thin glass plate is fixed and removed bubble by pressure, then it is that unit carries out cutting and machining shape by the thin glass plate of lamination by thin glass sheet block, and remove binding agent after removing chip by chemical etching process, then carry out separating by thin glass sheet block and be fabricated to thin glass sheet respectively.
According to the thin glass processing method of the described present invention, implementation process includes:
Fix white glass from lower end, at an upper portion thereof after application of adhesive, thin glass plate is directed at the first process of white glass lamination；Exceed the heavy sheet glass of given thickness at the thin glass plate top placement metallic plate that described first process is laminated or thickness, then apply to set pressure and remove the bubble between thin glass plate and thin glass plate, then remove the second process of described metallic plate and glass；At the top application of adhesive of thin glass plate the laminated thin glass plate of described second process lamination, the most repeatedly implement described second process and be laminated the 3rd process of multiple thin glass plates；After the described 3rd ironed glass plate of process layer, the top thin glass plate top application of adhesive and be laminated white glass and complete thin glass plate lamination the 4th process；The thin glass plate being laminated is carried out the 5th process made by each thin glass sheet units chunk shape；The each thin glass sheet units chunk made by described 5th process is implemented chemical etching process and remove the 6th process of chip；After the chemical etching of described 6th process has processed, the thin glass sheet units chunk bubble of lamination is removed binding agent in warm water and presses the 7th process of thin glass sheet units separate；
The thin glass sheet made by the 7th process is cleaned the 8th process that can complete to make.
As optimal technical scheme, during the 3rd, the lamination process of the thin glass plate of lamination also includes the process supplementing lamination white glass.
As optimal technical scheme, described binding agent is to be mixed by filler.
Beneficial effect
Thin glass processing method according to the present invention, it has the beneficial effects that, after thin glass layer is pressed and is fixed temporarily, cut by sheet block unit and processed, and then to thin glass plate processing and implementation automation process, and minimizing puts on the stress of glass plate and reduces cutting and add sheet breakage in man-hour and produce the phenomenon of chip.
Cut by block unit and process, chemical etching can be implemented in side and remove fine debris.
Accompanying drawing explanation
Fig. 1 is to show the schematic diagram that normal thin glass makes use-case；
Fig. 2 is the schematic diagram of the implementation process of the thin glass processing method showing the present invention；
Fig. 3 is the schematic diagram of the thin glass plate lamination process showing the present invention；
Fig. 4 is the schematic diagram of the example adding white glass in the thin glass plate lamination process showing the present invention.
Detailed description of the invention
The thin glass processing method of the present invention is by under the thin glass plate state fixing and be laminated of composition thin glass sheet temporarily with binding agent, carry out cutting and machining shape by thin glass sheet block unit, remove binding agent after removing chip by chemical etching process, then complete by thin glass sheet (Cell) units separate to make.
The implementation process of the thin glass processing method of the present invention is described below in conjunction with Fig. 2 to Fig. 4, and its process includes:
Fix white glass (dummy glass) 10 from lower end, at an upper portion thereof after application of adhesive, the thin glass plate 20 of composition thin glass sheet 21 is directed at the first process that white glass 10 is laminated；
Place metallic plate 30 or heavy sheet glass on thin glass plate 20 top of described first process lamination, then apply to set pressure and remove the bubble between thin glass plate 20 and thin glass plate 20, then remove the second process of described metallic plate 30 or glass；
At the top application of adhesive of thin glass plate 20 the laminated thin glass plate 20 of described second process lamination, the most repeatedly implement described second process and be laminated the 3rd process of multiple thin glass plates 20；
After being laminated multiple thin glass plates 20 by described 3rd process, the top thin glass plate 20 top application of adhesive and be laminated white glass 10 and complete thin glass plate 20 lamination the 4th process；
Carry out the 5th process made by thin glass sheet 21 units chunk shape after the thin glass plate 20 being laminated implements cutting technique by each thin glass sheet 21 unit；
Each thin glass sheet 21 units chunk made by described 5th process is implemented chemical etching process and remove the 6th process of chip (chipping)；
After the chemical etching of described 6th process has processed, the thin glass sheet 21 units chunk bubble of lamination is separated in warm water and removes binding agent and press the 7th process of thin glass sheet 21 units separate；
The thin glass sheet 21 made by the 7th process is cleaned the 8th process that can complete to make.
Thin glass processing method according to the described present invention, its technical feature is, by laminated together for whole thin glass plate, carried out cutting and processing with cutter sweeps such as diamond wheel, diamond milling cutters, water cutting machines by the sheet units chunk shape intending processing and produced multiple thin glass substrates, reduce stress that each thin glass born simultaneously and reduce chip.
Described first process to the 4th process is the process being laminated by thin glass plate, is the process being laminated multiple thin glass plates 20 in the white glass 10 for protecting thin glass plate 20.
Thin glass plate 20 is fixed by the adhesive lamination that can use warm water to remove.
Described binding agent mixed fillers forms, and makes acrylate pressure-sensitive adhesive binding agent keep certain thickness.
Described filler forms with the acrylic ball (ball) of 0.02mm ~ 0.1mm.
Described second process is that thin glass plate 20 and thin glass plate 20 are applied both constant-pressures, with binding agent by the most securing for thin glass plate 20 process concurrently disinfecting its air entrapment.
As it is shown on figure 3, described second process is to place metallic plate 30 or heavy sheet glass and apply pressure from top.
Described metallic plate 30 or glass are to treat that the 3rd process is removed after terminating, and described metallic plate 30 can form with the metallic plate such as aluminum or rustless steel (0.5 ~ 1mm), and the thickness of described glass can also exceed given thickness, in order to the strength of tolerance top pressurization.
Described 3rd process thin glass plate 20 is implemented described lamination process and as shown in Fig. 2 (c) process of laminated thin glass plate 20.
Described 4th process is to place white glass 10, the as shown in Figure 2 (d) shows process of laminated thin glass plate 20 in white glass 10 in the top of the thin glass plate 20 completing lamination.
Described 5th process is the process by thin glass sheet 21 units chunk cutting thin glass plate 20, and the thin glass plate 20 being laminated as shown in Figure 2 (d) shows cuts into as shown in Fig. 2 (e) process of thin glass sheet 21 pieces.
Described 6th process is the process being etched 21 pieces of sides of thin glass sheet, is for removing the chip of 21 pieces of facets of thin glass sheet and to implement the process that chemical etching processes.
Described 7th process is the process removed binding agent and separated with each thin glass sheet 21 by white glass 10, puts in warm water by thin glass sheet 21 pieces, makes binding agent depart from from thin glass sheet 21 and be eliminated.
Described 8th process is the process cleaned by the thin glass sheet 21 of separation and fulfil assignment.
The manufacturing process of the thin glass-making processes being made up of said process is described below.
First, as shown in Figure 2 (a) shows, being fixed by white glass 10, then at the top application of adhesive of white glass 10 as shown in Fig. 2 (b), lamination includes the thin glass plate 20 of thin glass sheet 21 the most at an upper portion thereof.
Then the top at described thin glass plate 20 places metallic plate 30 or heavy sheet glass as shown in Figure 3, and apply from described metallic plate 30 top both constant-pressure and thin glass plate 20 is fixed temporarily.
Fig. 3 is the schematic diagram showing the process being laminated by thin glass plate 20.
Then remove the top application of adhesive of thin glass plate 20 at described lamination after described metallic plate or glass, then as it has been described above, at an upper portion thereof laminated thin glass plate 20 and fix and the most described process and be laminated multiple raw sheet glass as shown in Figure 2 (c).
If now continuous laminating thin glass plate 20(such as 20), then it would be susceptible to flexural deformation phenomenon, would supplement lamination white glass 10 the most as shown in Figure 4.
Fig. 4 is the schematic diagram of the example adding white glass 10 in the lamination process showing thin glass plate 20.
As it has been described above, the lamination of thin glass plate 20 complete after as shown in Figure 2 (d) shows, white glass 10 is fixed by the thin glass plate 20 top binding agent topmost.
After fixing raw sheet glass 20 in white glass 10 as mentioned above, also as shown in Fig. 2 (e), it is fabricated to thin glass sheet 21 pieces as the cutting of thin glass sheet 21 block unit.
Then for removing chip enforcement chemical etching process.
Then thin glass plate sheet 21 pieces is steeped release adhesive in warm water and white glass (10) is separated with each thin glass sheet 21 as shown in Fig. 2 (f).
By thin glass plate sheet 21 pieces bubble in described warm water then binding agent depart from from thin glass plate sheet 21 pieces and white glass 10 with sheet (sheet) form.
Here, it is possible to use described
The aqueous solution mixing potassium hydroxide (KOH) in warm water removes binding agent.
Binding agent removes aqueous solution can reach the aqueous solution composition of 5 ~ 50% by potassium hydroxide (KOH) concentration, and temperature is advisable between 40 DEG C ~ 80 DEG C.
Thin glass plate sheet 21 steeps in binding agent configured as described above removes aqueous solution then binding agent be broken down into small particles (particle) and be eliminated.
Then each thin glass sheet 21 is carried out completing the making of thin glass sheet 21.
Claims (4)
1. a thin glass processing method, it is characterized in that, the method includes: after the thin glass plate of composition thin glass sheet being fixed and is laminated with binding agent, metallic plate (30) or glass is placed on the thin glass plate top of lamination, and apply to remove metallic plate (30) or glass after thin glass plate is fixed and removed bubble by pressure, then it is that unit carries out cutting and machining shape by the thin glass plate of lamination by thin glass sheet block, and remove binding agent after removing chip by chemical etching process, then carry out separating by thin glass sheet block and be fabricated to thin glass sheet respectively.
2. a thin glass processing method, it is characterised in that the method includes: fix white glass (10) from lower end, at an upper portion thereof after application of adhesive, the first process that the thin glass plate (20) alignment white glass (10) of composition thin glass sheet (21) is laminated；
Metallic plate (30) or heavy sheet glass is placed on thin glass plate (20) top of described first process lamination, then apply to set pressure and remove the bubble between thin glass plate (20) and thin glass plate (20), then remove the second process of described metallic plate (30) or glass；
At the top application of adhesive of thin glass plate (20) the laminated thin glass plate (20) of described second process lamination, the most repeatedly implement described second process and be laminated the 3rd process of multiple thin glass plates (20)；
After being laminated multiple thin glass plates (20) by described 3rd process, at the top thin glass plate (20) top application of adhesive and be laminated white glass (10) and complete the 4th process that thin glass plate (20) is laminated；
In upper the 5th process carrying out by each thin glass sheet (21) units chunk shape making of the thin glass plate (20) being laminated；
Each thin glass sheet (21) units chunk made by described 5th process is implemented chemical etching process and remove the 6th process of chip (chipping)；
After the chemical etching of described 6th process has processed, thin glass sheet (21) the units chunk bubble of lamination is removed binding agent in the aqueous solution of warm water or dissolved hydrogen potassium oxide (KOH) and presses the 7th process that thin glass sheet (21) units chunk separates；
The thin glass sheet (21) made by the 7th process is cleaned the 8th process that can complete to make.
Thin glass processing method the most according to claim 2, it is characterised in that during the described 3rd, the lamination process of the thin glass plate (20) of lamination also includes the process supplementing lamination white glass (10).
4. according to claim 1 or require the thin glass processing method described in 2, it is characterised in that described binding agent is to be mixed by filler.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20140143900 | 2014-10-23 | ||
| KR10-2014-0143900 | 2014-10-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106142761A true CN106142761A (en) | 2016-11-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510135486.4A Pending CN106142761A (en) | 2014-10-23 | 2015-03-26 | Thin glass processing method |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107365067A (en) * | 2017-08-29 | 2017-11-21 | 东莞市银通玻璃有限公司 | A kind of cutting technique of laminated glass |
| CN107500522A (en) * | 2017-10-09 | 2017-12-22 | 张志才 | A kind of processing technology of ultra-thin glass |
| CN113213742A (en) * | 2021-04-01 | 2021-08-06 | 芜湖长信新型显示器件有限公司 | Method for cutting ultrathin flexible glass |
| WO2022026508A1 (en) * | 2020-07-31 | 2022-02-03 | Corning Incorporated | Apparatus and method for cutting glass laminated substrate |
| CN114180822A (en) * | 2021-12-08 | 2022-03-15 | 华天慧创科技（西安）有限公司 | Cutting method of wafer-level stacked structure optical glass |
| US12091348B2 (en) | 2017-07-12 | 2024-09-17 | Corning Incorporated | Apparatus and methods for manufacturing a glass substrate |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200415679A (en) * | 2002-10-07 | 2004-08-16 | Schott Glas | Composite composed of thin substrate separably bound to carrier substrate |
| TW200837028A (en) * | 2007-01-05 | 2008-09-16 | Mdi Schott Advanced Proc Gmbh | Method and device for breaking thin glass sheets |
| TW201420469A (en) * | 2012-08-27 | 2014-06-01 | Schott Ag | Glass substrate strip |
| CN103964681A (en) * | 2013-01-31 | 2014-08-06 | 志亚显示技术（深圳）有限公司 | Processing method for cover plate glass of electronic product |
| CN104108888A (en) * | 2014-06-05 | 2014-10-22 | 深圳市宇顺电子股份有限公司 | OGS touch screen lamination processing manufacturing method |
-
2015
- 2015-03-26 CN CN201510135486.4A patent/CN106142761A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200415679A (en) * | 2002-10-07 | 2004-08-16 | Schott Glas | Composite composed of thin substrate separably bound to carrier substrate |
| TW200837028A (en) * | 2007-01-05 | 2008-09-16 | Mdi Schott Advanced Proc Gmbh | Method and device for breaking thin glass sheets |
| TW201420469A (en) * | 2012-08-27 | 2014-06-01 | Schott Ag | Glass substrate strip |
| CN103964681A (en) * | 2013-01-31 | 2014-08-06 | 志亚显示技术（深圳）有限公司 | Processing method for cover plate glass of electronic product |
| CN104108888A (en) * | 2014-06-05 | 2014-10-22 | 深圳市宇顺电子股份有限公司 | OGS touch screen lamination processing manufacturing method |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12091348B2 (en) | 2017-07-12 | 2024-09-17 | Corning Incorporated | Apparatus and methods for manufacturing a glass substrate |
| CN107365067A (en) * | 2017-08-29 | 2017-11-21 | 东莞市银通玻璃有限公司 | A kind of cutting technique of laminated glass |
| CN107500522A (en) * | 2017-10-09 | 2017-12-22 | 张志才 | A kind of processing technology of ultra-thin glass |
| WO2022026508A1 (en) * | 2020-07-31 | 2022-02-03 | Corning Incorporated | Apparatus and method for cutting glass laminated substrate |
| CN113213742A (en) * | 2021-04-01 | 2021-08-06 | 芜湖长信新型显示器件有限公司 | Method for cutting ultrathin flexible glass |
| CN114180822A (en) * | 2021-12-08 | 2022-03-15 | 华天慧创科技（西安）有限公司 | Cutting method of wafer-level stacked structure optical glass |
| CN114180822B (en) * | 2021-12-08 | 2024-03-12 | 华天慧创科技（西安）有限公司 | Cutting method of wafer-level stacked structure optical glass |
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Application publication date: 20161123 |
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