TW200408035A - Method to separate an object and adhesive film - Google Patents

Abstract

The present invention provides a method to separate an object and an adhesive film, whose feature is: preapply peeling force on the adhesive film appropriately to separate from the object, so as to reduce the adhesion between the object and the adhesive film, and suck the object by a disposing head. To achieve the purpose, a vacuum sucking base which is moveable and has a vacuum sucking hole is disposed under the adhesive film. The sucking force of vacuum sucking base generates a peeling force to the adhesive film, and the disposing head sucks the object. Or, a linking lever can be installed to elevate synchronically with the disposing head together. Before the disposing head moves downward and contacts with the object, the linking lever can press the adhesive film to generate peeling force on the adhesive film, and the disposing head sucks the object. Since there is no external force acting on the object, the deformation of object is controlled to the minimum, so that the object is prevented form broken, and the object is not shifted. Also, plural chips can be peeled at one time to increase the production speed and shorten the picking time.

Description

200408035

Summary of the invention: The present invention provides — # 4 心 * in: pre-applied = a method of separating from the film, which is characterized by reducing the external force such as tearing off the private film of the knife when the object ’s plastic film is cut. Does not act on the object C, 'Then pick the object with the pick-and-place head, so as to avoid the object m :: control the amount of deformation of the object to a minimum to peel off multiple crystals, the parts will not be shifted, and can be-times directly h « Those who increase production speed and shorten picking time.

Background of the invention: Traditional object manufacturing process, in which the adhesive film of the object is separated, and then pick up the object for the semiconductor die-bonding process, it must be taken out, and then the wafer and the substrate are soldered. See Figure 1A to Figure D: One step is necessary Glue the objects to the subsequent process steps; for example, you must first connect a piece of wafer by a glue film. For the method of picking the wafer, see

a · As shown in FIG. 1A, the pick-and-place head 10 with vacuum suction is disposed in a body, and an elastic element 12 is provided on the top of the pick-and-place head 10, and there is a thimble below δ corresponding to the pick-and-place head 10. 20, the wafer 30 is attached to the UV-curable adhesive film 4 ', and the adhesive film 40 with the wafer 30 is sent between the pick-and-place head 10 and the ejector pin 20 by a conveying device (not shown). To perform the crystallizing step, b. As shown in FIG. 1B, after the wafer 30 is positioned, the pick-and-place head is lowered to the surface of the wafer 30 and adsorbed on the surface of the wafer 30; c. As shown in FIG. 1C After the pick-and-place head 10 has indeed absorbed the wafer 30, the ejector pin 20 is pushed up against the wafer 30 to rise by an appropriate distance, while compressing the elastic element 12 provided on the top of the pick-and-place head 10, and the ejector pin 20 is in contact with the wafer 30. Point 21

_ 1 η awake__ι Page 6 20040835 V. Description of the invention (2) The surrounding adhesive film 40 is separated from the wafer 30 due to the tensile force of the surrounding film 40; d. As shown in FIG. 1D, the wafer 30 and the adhesive film Simultaneously with the separation of 4.0, the pick-up head 10 rises, and the wafer 30 is sucked away from the adhesive film 40. The main method of separating the wafer from the film by using a thimble is that the main drawback is that for a 5 mm (mm) length and width wafer, it takes 400 grams (g) to overcome the adhesive force of the film. When the wafer is thinned to a limit, the stress on the wafer will increase, which will increase the deformation of the wafer, and even cause cracks. It can be seen that the method of ejecting the pin has its limit, especially for thin wafers. Please refer to Fig. 2A to Fig. 2c, US Patent No. 4,990, 05 "PRE_PEEL DIE EJECTOR APpARATus". This case discloses a method and a device for removing an object from a film, as shown in the figure. A vacuum disc device 1 is provided with a ejector pin 2 inside the vacuum disc device 1, and a cylindrical structure 3 is sleeved outside the ejector pin 2. Corresponding to the installation position of the ejector pin 2 and the cylindrical structure 3, a The vacuum suction pick-and-place head 4, the object ° is attached to the bottom of the adhesive layer 6, and the adhesive layer β is set on the bottom of an elastic film 7 ^ The part 5 can be an object such as a semiconductor wafer, and the step of picking the object 5 'the object a As shown in Fig. 2A ', the object 5 is transported to the empty disk device 1… · above the head 4 and the vacuum disk device is used to adsorb and remove the side 4 b. As shown in FIG. 2B, the object 5 is positioned The cylindrical structure, the part, the distance 'at the same time against the elastic film 7, the adhesive layer 6, the material drop-appropriate access to the head 4, the adhesive layer 6 and the object 5 can be used as the first-talk about the object 5 and adhesive There is a separating part 8 between the glue layer δ and the object 5; the separation from the slave, C · As shown in Figure 2C, the 'sticky layer 6 and the object 5 are the first order of eight After further away from the knife in vacuo

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V. Description of the invention (3) The disc really touches the device 1 and the thimble 2 descends at the same time and protrudes from the tubular structure 3. The borrowed disk strike 1 and the thimble 2 act in the opposite direction, making the adhesive layer 6 and the object 5 the first Phase separation, at this time, the adhesive layer 6 and the object 5 are only connected at the thimble 2, and then the pick-and-place head 4 is controlled to lower the object 5 and the adhesive layer 6 completely. The improvement of the aforementioned US case is focused on the traditional The way of ejecting the object from the film by ejecting the pin is because the outer diameter of the ejection pin is smaller than the object and the pick-and-place head, so it is easy to cause the object to be skewed and cannot be accurately sucked by the pick-and-place head. The case uses a large cylindrical shape The structure 3 first presses the object 5 to the pick-and-place head 4 to apply uniform force on the object 5 to avoid the object from being skewed. However, the object picking method adopted in this case is actually the same as the ejection pin ejection method shown in Figure 1A. No difference, the only difference is that in the US case, the adhesive layer 6 is separated into two stages by the cylindrical structure 3 and the ejector pin 2. Although the cylindrical structure 3 shares the binding force of the adhesive layer 6 that the ejector pin 2 must overcome , But it makes the overall structure extremely complicated. Furthermore, the cylindrical structure 3 and the thimble 2 causes a double impact force on the object 5. When the object is thinned to a limit, the stress on the object also increases, which increases the amount of deformation of the object and even causes cracking. See also a "fine wafer pick-up method and fine wafer pick-up device" (Republic of China Invention Patent Case, Publication No. 4 6 9 5 6 2) 'Please refer to Fig. 3a to Fig. 3C. The method disclosed in the case includes the following steps (A) A machine 8 is provided, the machine 8 has a surface that is in contact with the lower surface of the adhesive sheet Γ; the thin wafer 3 is attached to the upper surface of the adhesive sheet 1 '; The machine 8 'has a suction hole 7a', 7b ', and the adhesive sheet is pulled down

200408035 V. Description of the invention (4) Γ; The suction holes 7a ', 7b' have a suction end which will contact the adhesive sheet Γ, and the adhesive sheet 1 'is located on the surface of the machine 8'; the The machine 8 'can be moved on a horizontal plane relative to a specific reference position (can be translated and rotated): (b) a collet 4' is provided to hold the thin wafer 3 'by a suction force; the The collet 4 'has a suction end that will contact the thin wafer 3'; the collet 4 'can hold the thin wafer 3' at the suction end by the suction force: (c) placing the adhesive sheet Γ on the surface of the machine 8 ′, so that the thin wafer 3 ′ on the adhesive sheet 1 ′ is located at the reference position; (d) holding the thin wafer 3 ′ to the collet 4 by the suction force 'The suction end: (e) The suction end of the suction hole 7a', 7b 'holding the adhesive sheet 1' in the machine 8 '; (f) relative to the horizontal plane The reference position is moved to the machine 8 ′, thereby removing the adhesive sheet 1 ′ from the fine wafer 3 ′; and (g) which is picked up by the collet 4 ′ and thus removed from the adhesive sheet Γ Thin wafer 3. In short, the conventional case is to first attract the collet 4 'to the thin wafer 3', then pull down the adhesive sheet Γ through the suction holes 7a ', 7b', and then the collet 4 ' Wafer 3 'sucks off the adhesive sheet Γ; Although this method can avoid the defects of the traditional thimble picking method, it still has the following defects: 1. Thin wafer 3' shift: The thin wafer 3 'adheres to the adhesive sheet Γ, and crashes When the stage 8 'moves to the left, the thin chip 3' is still adhered to the adhesive sheet 1 'due to friction

Page 9 200408035 V. Explanation of the invention (5) The presence of force indirectly drives the adhesive sheet Γ to move slightly, and even the adhesive sheet 1 ′ deforms, causing the thin wafer 3 ′ to be slightly tilted, and the collet 4 ′ only by vacuum suction cannot The positioning of wafer 3 'reduces the precision of picking and placing the thin wafer 3', which greatly affects the precision requirements of semiconductor equipment in units of 7? M.-I. Destruction of the thin wafer 3 · Generally, the surface of the thin wafer 3 is provided with bumps (Bump ) Or Air Bridge (Airbridge) and other specific structures, the collet 4 'sucks the thin wafer 3' must avoid the specific structure, however, the aforementioned micro wafer 3 'micro displacement will cause the collet 4' to touch the specific structure, It is even more unfavorable for the development of high-density thin wafers in the future; 3. The suction force causes the adhesive sheet Γ deformation ... The adhesive sheet Γ is placed on the surface of the suction holes 7a ', 7b' of the machine 8 ', and the suction holes 7a' 7b 'must provide a strong suction force higher than the surface tension of the adhesive sheet Γ, otherwise the adhesive sheet Γ cannot be pulled down, and this strong suction force causes the adhesive sheet Γ to deform. The adhesive sheet Γ located on the right side of the machine 8' is affected by Pull and become longer, located on the machine 8 'left The adhesive sheet Γ on the side becomes shorter due to the pressure, which not only causes the thin wafers 3 that have been adsorbed by the collet 4 to be displaced, but the thin wafers 3 that are not adsorbed by the collet 4 may be displaced, causing fine The precision of wafer picking and placing is reduced; 4. Time-consuming: Only one thin wafer is sucked 3 'at a time. During the picking process, it is necessary to wait for the pick-up time and the collet 4' left and right movement time, resulting in a low speed of picking up fine wafers. Smaller size thin wafers; the suction holes 7a ', 7b' must be changed according to the size of the thin wafers 3 '. When the size of the thin wafers 3' is less than 0.5 X 0.5 mm, the suction holes 7a ', 7 b 'Small to produce enough

200408035 V. Description of the invention (6) The vacuum suction force detaches the thin wafer 3 'from the adhesive sheet j, and the: 矣 :: most of the body is less than 5 mm (mm) in length and width. . Lack of structure. Purpose of the invention: Firstly, to provide a film that can withstand the external force between the film and the film, and can be shrunk and shrinkable. The method of the present invention can make points, increase the method of the present invention, avoid the deformation of the method of the present invention, avoid the adhesiveness of the object and the glue and the object, and directly peel the secondary object when the object is picked short. The lack of other methods of film and tearing, the method of membrane separation, the degree of separation, such as tearing, and then using the pick-and-place head to absorb the deformation between the poles and the object does not move is to provide a plurality of wafers, the increase is to provide The action of a film can be the same as the main feature of the present invention. It is characterized by external force, so that the object can be reduced to a small degree. The speed of production of objects and film is carried out when the object and the film are produced. The main purpose is to reduce the object in advance and reduce the object to avoid the separation of the object and increase the production. Another purpose is to provide a method of separating the object from the film. Head pick and place head, one cycle can pick up multiple wafers to a fixed production rate. Another object is to provide a way to separate the object from the film. The presence of friction forces indirectly drives the tape to move slightly and even the film becomes slightly inclined, which can increase the accuracy of picking and placing. Another object is to provide a method for separating the object from the adhesive film with a slight displacement of the pick-and-place head and touching a specific structure on the front side of the wafer.

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200408035 V. Description of the invention (7) Specific embodiments: The other objects and detailed structures of the present invention will be made clearer by the following detailed description. 'Of course' the present invention is on some other parts, or on other parts. The arrangement is allowed to be different, but the selected embodiment is described in detail in this specification and its structure is shown in the drawings, so that the technical content of the present invention is further disclosed. Please refer to FIGS. 4A to 4C, and correspondingly to FIGS. 5A to 5c, to disclose the specific configuration of a preferred embodiment of the present invention. Take wafer picking as an example, and the wafer 30 is adhered to the ultraviolet curing adhesive. On the film 40, an adhesive film 40 attached with a wafer 3 0 is set on a stationary machine (not shown), and a movable pick-and-place head 10 is provided above the machine, and the film 40 is A movable vacuum suction base 50 is provided at the bottom. The vacuum suction base 50 has a vacuum suction hole 51 which can generate a downward suction force, and the size of the vacuum suction hole 51 can cover at least one wafer 30. To sum up, the procedure for tearing off the adhesive film in this embodiment is as follows: a. A fixed machine for carrying a wafer 3 with a glue film 40 attached on the bottom is provided, and a movable machine is provided above the machine. The pick-and-place head b. A vacuum picking base 50 having a vacuum suction hole 51 and capable of shifting the position of the wafer 30 is provided; c. The vacuum picking base 50 is moved at the bottom of the wafer 30, and the vacuum picking base 50 is provided. The suction force generated by the vacuum suction hole 51 creates an external force such as tearing on the adhesive film 40 to separate the wafer 30 from the adhesive film 40 and reduce the adhesiveness between the wafer 30 and the adhesive film 40;

Page 12 200408035

V. Description of the invention (8) d. Move the pick-and-place head 10 to a position above the wafer 30, and the pick-and-place head 10 descends and contacts the wafer 30 and adheres to the surface of the wafer 30; and e. After 10 has indeed adsorbed the wafer 30, the pick-and-place head 10 is raised to lift the wafer 3 up. In this embodiment, the vacuum suction seat 50 is driven to repeat the action so that the plurality of wafers ^ 0 and the film 40 are separated moderately. The suction force of the vacuum suction seat 50 which acts on the film 40 can reduce the wafer 30 and the film 40. The adhesiveness of the wafer 30 is not completely separated from the adhesive film 40. As for the case where the adhesive film 40 is adhered to the adhesive film 40 with a length of 5 mm (mm), the adhesive film 40 has a certain degree. Surface tension, so if the suction force of the suction hole 51 on the adhesive film 40 is eliminated, the adhesive force between the adhesive film 40 and the wafer 40 will be ejected, and the adhesive force between the adhesive film 40 and the wafer 30 has been largely destroyed. However, the adhesiveness of the rubber capsule 4 has not been eliminated. With the remaining adhesive force, it is still enough to position the crystal # 3 0 on the adhesive film 40. The illustration is deliberately emphasized to explain the action of the vacuum adsorption hole 51. The separation state between the adhesive film 40 and the wafer 30, so the key point of the present invention is that the vacuum adsorption hole 51 acts on the adhesive film 40 first, so that a plurality of the wafers 30 and the adhesive film 40 are appropriately separated. Then pick up the wafer 30 one by one by the pick-and-place head 10. You can use a visual positioning to determine the position of the pick-and-place head 10 and pick and place the wafer 30, such as , Can greatly reduce the pick-up time, and the pick-and-place head 10 does not have any other external force in the process of sucking the wafer 30, so the wafer 30 does not shift, which can ensure the accuracy of picking and placing; it is also worth noting that During the process of picking and placing the head i 〇 picking and placing the wafer 30, the vacuum suction hole 51 still continues to act on the film 40, in other words, the actions of picking and placing the wafer 30 and tearing the film 40 can be performed simultaneously. Tinan production efficiency. Please refer to Figure 6. The plural pick-and-place heads 10 can be set in a revolvable rotation.

200408035

On the turntable 14, a plurality of wafers can be sucked to a fixed point in one cycle to increase the production speed.

Please refer to FIG. 7A to FIG. 7c again, to disclose the specific configuration of another preferred embodiment of the present invention. Still taking wafer picking as an example, the wafer 30 is adhered to the light-curing adhesive film 40, and the wafer 30 is adhered to The adhesive film 40 is set on a stationary machine (not shown). A movable pick-and-place head 10 is provided above the machine. The pick-and-place head 10 is set at the bottom of a body. An elastic element 12 is provided between the top of the head 丨 and the base 11. The base 丨 丨 has a connecting rod 丨 3. In summary, the steps of tearing off the adhesive film in this embodiment are as follows: a. Setting a A machine for carrying the wafer 30 with the adhesive film 40 adhered to the bottom, a movable pick-and-place head 10 is provided above the machine; b. A link 13 is arranged next to the pick-and-place head 丨 〇, And the link 丨 3 can be raised and lowered synchronously with the pick-and-place head 10; 〆, c · Move the pick-and-place head 10 to the top of the wafer 30 and position it, and the pick-and-place head 丨 0 drops in contact with the wafer 30 and adsorbs on the wafer 3 Before the 0 surface, the connecting rod 13 can be driven down on the surface of the adhesive film 40, and the connecting rod 13 can be used to generate a tearing force on the adhesive film 40 that can be separated from the wafer 30; and d · After the pick-and-place head 10 has indeed adsorbed the wafer 30, the pick-and-place head 10 is raised to suck up the wafer 300, and the connecting rod 13 releases the adhesive film 40 at the same time.

In this embodiment, the driving link 13 presses down the adhesive film 40 and the wafer 30 moderately. The link 13 is disposed on the side of the pick-and-place head 10 and the link 13 and the wafer 30 have an appropriate distance D1. The distance D 1 can be used for the connecting rod 13 to be pressed against the win film 40 without touching the wafer 30 when the connecting rod 13 is moved downward. The length of the connecting rod 1 3 is slightly longer than the pick-and-place head 10, which makes the pick-and-place head 10 lower. When not in contact with the wafer 30, the connecting rod 1 3 has been

Page 14 20040035 V. Description of the Invention (ίο) | The pressure under the contact with the film 40 can reduce the crystal | The film 40 does not fully emphasize the adhesion between the film 40 and the wafer 3 0 | Surface tension, so the bonding piece 30 between the connecting rod and the wafer 30 can still be positioned at the glue I, first separated by the connecting rod 13 down, and then by the pick-and-place head 1 0 and the connecting rod 1 Reduction of picking time has other external effects, I accuracy. Another strong method, can be mm) long and wide film size, the more the suction strength I linkage effect overview | pieces and film objects moderate I fit, and then adjust to explain a suitable for each wafer, small, vacuum, so the method is the aforementioned The two separation methods are as follows: to pick and place the head and press the film sheet 30 and separate it, and to apply the force of 13 to the sheet 30 to 40, you can apply pressure to the film 40 to press and place the head 13 on the film. The crystal point, the size of the picture is shown in Fig. 4. The adsorption hole is based on the crystal one. It is more suitable to use the crystal method, and the torn matter 40 is removed, and the illustration of the adhesive film 40 is in a separated state. With glue, therefore, 40, so that complex 10 can pick up and place the chip synchronously. 10 will borrow the chip from 30 to 30. Especially, Wu Zhizhen must also pick the chip according to the size of the film. It is characterized by the external force, the component, because the connecting rod 13 acts on the adhesiveness of the adhesive film 40, and the wafer 30 and the rubber explain the action of the connecting rod 13, with a length of 5 mm (mm) due to The pressure of the film 40 is below a certain pressure enough to destroy the film 40. The remaining adhesive force of the film 40 makes the crystal The main point is that the number of wafers 30 and the film 40 are suitable for picking up. If multiple wafers 30 are picked up in parallel, the process of wafer 30 suctioning is no longer shifted, which ensures that subsequent processes The implementation of the adhesive film under the rod is suitable for the air absorption method with a size of less than 5 mm. When the size of the crystal is reduced, and then the development trend of the vacuum gain is reduced, this example illustrates that the present invention uses: Can reduce the external force between the object and the adhesive film without acting on the object,

15th 200408035

V. Description of the invention (11) Therefore, the amount of deformation of the object can be controlled to a minimum degree, the object can be prevented from being damaged, and the object cannot be displaced, and multiple wafers can be directly peeled off at one time, increasing the production speed, and shortening the picking time. Experiments by the inventor It is learned that for a 5 mm (mm) length and width wafer, the stress required to separate the film from the object by using the aforementioned peeling method is only 1 gram (g), which not only greatly improves the traditional thimble picking method. The damage caused by objects is especially suitable for thin objects such as thin wafers. The industrial applicability and progress should be obvious; however, the ^ descriptions and illustrations disclosed above are only preferred embodiments of the present invention. When it can not be used to limit the actual implementation scope of the invention, all the changes made in the structural features and functions described in the above description and the following patent application patents, for example, ^ ^ more or the replacement of equivalent components should still belong to this Paradigm of invention. & In addition, the present invention has not been seen on any public place before the application. Therefore, the present invention case has the invention patent elements of "industrial availability, novelty and progressive publication", and the invention patent application is submitted according to law. Qi asked your examiner to allow time for examination and grant patents as early as possible. ⑺

200408035 Brief description of the diagrams Brief description of the diagrams: Figures 1 to 1 are the schematic diagrams of the conventional method of using an ejector to take out objects and separate the film from the film. Figures 2A to 2C are schematic diagrams of another known method of using an ejector to eject objects and separate the film from the film. Figures 3A to 3C are schematic diagrams of the conventional "fine wafer picking method and fine wafer picking equipment". Figures 4A to 4C are schematic diagrams of one preferred embodiment of the present invention for tearing off the film from an object.

5A to 5C are side views corresponding to the embodiment of FIGS. 4A to 4C. FIG. 6 is a schematic diagram of another preferred embodiment of the pick-and-place head of the present invention. Figures 7A to 7C are schematic diagrams of the action of the preferred embodiment of the method for tearing the adhesive film from an object according to the present invention. Drawing number description: 1-Vacuum tray device Γ-Adhesive sheet 2-Thimble

3 -Cylinder structure 3 ′ -Fine wafer 4- Pick-and-place head 4 ’-Collet 5- Object

Page 17 200408035 Brief description of drawings 6-Adhesive layer 7-Elastic film 7a ', 7b'-Suction hole 8-Separation section 8 '-Machine 1 0, 1 0A-Pick-and-place head 1 1-Base body 1 2-Elastic element 13-Connecting rod 1 4-Turntable 2 0-Ejector 2 1-Contact point 3 0-Wafer 30A-Wafer 4 0 _ Adhesive film 5 0-Vacuum suction seat 5 1-Vacuum suction hole D1-Distance

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Claims (1)

200408035 6. Scope of patent application 1. A method for separating an object from an adhesive film, comprising the following steps: a_setup—a fixed table for carrying an object with a plastic meal stuck on the bottom, a table is provided above the table with a movable Pick-and-place head; b. Set up a vacuum suction mount with a vacuum suction hole; •. The vacuum suction seat is located at the bottom of the object. The suction force generated by the vacuum suction hole of the vacuum suction seat is used to generate external force such as tearing off the adhesive film, so as to separate the d object from the adhesive film and reduce the adhesion between the object and the hazy film; • Move the pick-and-place head above the object to position it. The pick-and-place head descends to contact the object and attracts to the surface of the object; and 6 • After the pick-and-place head has indeed attracted the object, lift the pick-and-place head to pick it up. According to the method of separating the object from the film as described in the first item of the scope of the patent application, wherein 'the vacuum suction seat is a repeated action to properly separate a plurality of objects from the film', and then the pick-and-place head will appropriately separate the film from the film. Objects start one by one. Take the method of separating the object from the adhesive film as described in item 1 of the scope of the patent application, wherein the suction of the vacuum suction seat on the adhesive film can reduce the adhesion of the adhesive film. Completely separated. And 4 · The method of separating the object from the adhesive film as described in item 1 of the scope of the patent application, where the size of the vacuum suction hole of the vacuum suction base can cover objects as small as possible. Less one 5. The method of separating the object from the adhesive film as described in item 1 of the scope of the patent application, wherein the plurality of pick-and-place heads are set on a turntable which can rotate in a circle '~ one can suck a plurality of wafers. Page 19, 200408035 6. Scope of patent application 6-A method for separating an object from an adhesive film, which includes the following steps: a. Setting up a stationary machine for carrying an object with an adhesive film at the bottom, on the machine There is a movable pick-and-place head on the top; b. A link is set next to the pick-and-place head, and the link and pick-and-place head can be raised and lowered synchronously; c. Move the pick-and-place head above the object to locate and pick up Before the head is brought into contact with the object and adsorbed on the surface of the object, the connecting rod can be driven to be pressed down on the surface of the adhesive film, and the adhesive film can be separated from the object by the connecting rod; and d. After the object, the pick-and-place head is raised to suck up the object, and the connecting rod releases the film at the same time. 7 · The method for separating an object from a film as described in item 6 of the scope of patent application, wherein the length of the connecting rod is slightly longer than the pick-and-place head, so that when the pick-and-place head is lowered without contacting the object, the link has Those who come into contact with the adhesive film and press down the adhesive film. 8, 8 The method for separating an object from an adhesive film as described in item 6 of the scope of the patent application, wherein the pressure applied by the connecting rod under the adhesive film can reduce the adhesion between the object and the adhesive film, and Not completely separated. 9 · A method for separating an object from a film as described in item 6 of the scope of the patent application, wherein a plurality of parallel pick-and-place heads and connecting rods are provided according to the distance between the objects. The adhesive film is pressed down by the connecting rod to suck multiple objects simultaneously.