TW200407209A - Device and method for scribing substrate of brittle material - Google Patents
Device and method for scribing substrate of brittle material Download PDFInfo
- Publication number
- TW200407209A TW200407209A TW092117387A TW92117387A TW200407209A TW 200407209 A TW200407209 A TW 200407209A TW 092117387 A TW092117387 A TW 092117387A TW 92117387 A TW92117387 A TW 92117387A TW 200407209 A TW200407209 A TW 200407209A
- Authority
- TW
- Taiwan
- Prior art keywords
- glass substrate
- laser light
- laser
- light spot
- line
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 156
- 239000000463 material Substances 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims description 39
- 238000009826 distribution Methods 0.000 claims description 22
- 230000015572 biosynthetic process Effects 0.000 claims description 14
- 238000001816 cooling Methods 0.000 claims description 14
- 239000004744 fabric Substances 0.000 claims description 9
- 239000002689 soil Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 description 145
- 230000003287 optical effect Effects 0.000 description 14
- 239000004973 liquid crystal related substance Substances 0.000 description 7
- 230000010355 oscillation Effects 0.000 description 7
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 5
- 229910052708 sodium Inorganic materials 0.000 description 5
- 239000011734 sodium Substances 0.000 description 5
- 239000002826 coolant Substances 0.000 description 4
- 239000012634 fragment Substances 0.000 description 4
- 230000001678 irradiating effect Effects 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 238000002438 flame photometric detection Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000497 Amalgam Inorganic materials 0.000 description 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 235000013405 beer Nutrition 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 210000001584 soft palate Anatomy 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229940098465 tincture Drugs 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B37/00—Manufacture or treatment of flakes, fibres, or filaments from softened glass, minerals, or slags
- C03B37/10—Non-chemical treatment
- C03B37/16—Cutting or severing
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
- C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Thermal Sciences (AREA)
- Mining & Mineral Resources (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Manufacturing & Machinery (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Liquid Crystal (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002192707 | 2002-07-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200407209A true TW200407209A (en) | 2004-05-16 |
| TWI297295B TWI297295B (enExample) | 2008-06-01 |
Family
ID=29996982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092117387A TW200407209A (en) | 2002-07-01 | 2003-06-26 | Device and method for scribing substrate of brittle material |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP4134033B2 (enExample) |
| KR (1) | KR100647454B1 (enExample) |
| CN (1) | CN1665656A (enExample) |
| AU (1) | AU2003246209A1 (enExample) |
| TW (1) | TW200407209A (enExample) |
| WO (1) | WO2004002705A1 (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7820941B2 (en) * | 2004-07-30 | 2010-10-26 | Corning Incorporated | Process and apparatus for scoring a brittle material |
| JP2007105888A (ja) * | 2005-10-11 | 2007-04-26 | Kyoto Seisakusho Co Ltd | 脆性材料の初亀裂形成方法 |
| TW200722218A (en) * | 2005-12-05 | 2007-06-16 | Foxsemicon Integrated Tech Inc | Laser cutting apparatus |
| KR100670600B1 (ko) * | 2006-02-02 | 2007-01-17 | 주식회사 에스에프에이 | 스크라이브 장치 |
| KR100863438B1 (ko) * | 2006-05-08 | 2008-10-16 | 주식회사 탑 엔지니어링 | 다축 동기 제어를 이용한 스크라이브 장치 및 그 방법 |
| JP2008229716A (ja) * | 2007-03-23 | 2008-10-02 | Toray Eng Co Ltd | レーザスクライブ方法および装置およびこの方法または装置を用いて割断した割断基板 |
| KR100949152B1 (ko) * | 2007-11-23 | 2010-03-25 | 삼성코닝정밀유리 주식회사 | 유리 기판 레이저 절단 장치 |
| WO2009128219A1 (ja) * | 2008-04-15 | 2009-10-22 | 株式会社リンクスタージャパン | 脆性材料基板の加工装置および切断方法 |
| KR20100107253A (ko) | 2009-03-25 | 2010-10-05 | 삼성모바일디스플레이주식회사 | 기판 절단 장치 및 이를 이용한 기판 절단 방법 |
| JP5416445B2 (ja) * | 2009-03-25 | 2014-02-12 | 三星ダイヤモンド工業株式会社 | レーザスクライブ装置 |
| KR101041137B1 (ko) | 2009-03-25 | 2011-06-13 | 삼성모바일디스플레이주식회사 | 기판 절단 장치 및 이를 이용한 기판 절단 방법 |
| KR101073563B1 (ko) * | 2010-02-08 | 2011-10-14 | 삼성모바일디스플레이주식회사 | 표시 장치 및 이의 제조 방법 |
| JP5309107B2 (ja) * | 2010-10-05 | 2013-10-09 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の分断装置 |
| TWI651182B (zh) * | 2014-06-26 | 2019-02-21 | 日商三星鑽石工業股份有限公司 | 脆性基板之切斷方法及劃線裝置 |
| JP6668776B2 (ja) * | 2016-01-22 | 2020-03-18 | 三星ダイヤモンド工業株式会社 | ブレイク装置 |
| CN106995274A (zh) * | 2016-09-23 | 2017-08-01 | 广州市科卡通信科技有限公司 | 一种新式玻璃画线装置 |
| CN114939718B (zh) * | 2022-06-30 | 2024-02-13 | 广东舜元激光科技有限公司 | 一种激光划线装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3526175B2 (ja) * | 1997-06-11 | 2004-05-10 | 三菱電機株式会社 | レーザ加工装置 |
| JP2001130921A (ja) * | 1999-10-29 | 2001-05-15 | Mitsuboshi Diamond Industrial Co Ltd | 脆性基板の加工方法及び装置 |
| JP3439179B2 (ja) * | 2000-07-28 | 2003-08-25 | 三菱重工業株式会社 | レーザーエッチング方法 |
| KR100673073B1 (ko) * | 2000-10-21 | 2007-01-22 | 삼성전자주식회사 | 레이저 빔을 이용한 비금속 기판의 절단 방법 및 장치 |
-
2003
- 2003-06-26 JP JP2004517303A patent/JP4134033B2/ja not_active Expired - Fee Related
- 2003-06-26 KR KR1020047019582A patent/KR100647454B1/ko not_active Expired - Fee Related
- 2003-06-26 AU AU2003246209A patent/AU2003246209A1/en not_active Abandoned
- 2003-06-26 CN CN038157926A patent/CN1665656A/zh active Pending
- 2003-06-26 TW TW092117387A patent/TW200407209A/zh not_active IP Right Cessation
- 2003-06-26 WO PCT/JP2003/008158 patent/WO2004002705A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| JP4134033B2 (ja) | 2008-08-13 |
| AU2003246209A1 (en) | 2004-01-19 |
| WO2004002705A1 (ja) | 2004-01-08 |
| TWI297295B (enExample) | 2008-06-01 |
| CN1665656A (zh) | 2005-09-07 |
| KR20050005525A (ko) | 2005-01-13 |
| JPWO2004002705A1 (ja) | 2005-10-27 |
| KR100647454B1 (ko) | 2006-11-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |