CN1665656A - 脆性材料衬底的划线装置以及划线方法 - Google Patents

脆性材料衬底的划线装置以及划线方法 Download PDF

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Publication number
CN1665656A
CN1665656A CN038157926A CN03815792A CN1665656A CN 1665656 A CN1665656 A CN 1665656A CN 038157926 A CN038157926 A CN 038157926A CN 03815792 A CN03815792 A CN 03815792A CN 1665656 A CN1665656 A CN 1665656A
Authority
CN
China
Prior art keywords
glass substrate
laser
material substrate
scribing
laser facula
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN038157926A
Other languages
English (en)
Chinese (zh)
Inventor
音田健司
西尾仁孝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Publication of CN1665656A publication Critical patent/CN1665656A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B37/00—Manufacture or treatment of flakes, fibres, or filaments from softened glass, minerals, or slags
    • C03B37/10—Non-chemical treatment
    • C03B37/16—Cutting or severing
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Mining & Mineral Resources (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Manufacturing & Machinery (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Liquid Crystal (AREA)
CN038157926A 2002-07-01 2003-06-26 脆性材料衬底的划线装置以及划线方法 Pending CN1665656A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP192707/2002 2002-07-01
JP2002192707 2002-07-01

Publications (1)

Publication Number Publication Date
CN1665656A true CN1665656A (zh) 2005-09-07

Family

ID=29996982

Family Applications (1)

Application Number Title Priority Date Filing Date
CN038157926A Pending CN1665656A (zh) 2002-07-01 2003-06-26 脆性材料衬底的划线装置以及划线方法

Country Status (6)

Country Link
JP (1) JP4134033B2 (enExample)
KR (1) KR100647454B1 (enExample)
CN (1) CN1665656A (enExample)
AU (1) AU2003246209A1 (enExample)
TW (1) TW200407209A (enExample)
WO (1) WO2004002705A1 (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1958490B (zh) * 2006-05-08 2010-05-26 塔工程有限公司 利用同步的多轴对基板划线的装置及方法
CN101011845B (zh) * 2006-02-02 2010-11-17 Sfa工程股份有限公司 划线设备
CN101439928B (zh) * 2007-11-23 2012-02-29 三星康宁精密素材株式会社 玻璃基板激光裁切装置
CN102441931A (zh) * 2010-10-05 2012-05-09 三星钻石工业股份有限公司 脆性材料基板的分断装置
CN106470814A (zh) * 2014-06-26 2017-03-01 三星钻石工业股份有限公司 脆性衬底的切断方法及划线装置
CN106995274A (zh) * 2016-09-23 2017-08-01 广州市科卡通信科技有限公司 一种新式玻璃画线装置
CN114939718A (zh) * 2022-06-30 2022-08-26 广东利元亨技术有限公司 一种激光划线装置

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7820941B2 (en) * 2004-07-30 2010-10-26 Corning Incorporated Process and apparatus for scoring a brittle material
JP2007105888A (ja) * 2005-10-11 2007-04-26 Kyoto Seisakusho Co Ltd 脆性材料の初亀裂形成方法
TW200722218A (en) * 2005-12-05 2007-06-16 Foxsemicon Integrated Tech Inc Laser cutting apparatus
JP2008229716A (ja) * 2007-03-23 2008-10-02 Toray Eng Co Ltd レーザスクライブ方法および装置およびこの方法または装置を用いて割断した割断基板
WO2009128219A1 (ja) * 2008-04-15 2009-10-22 株式会社リンクスタージャパン 脆性材料基板の加工装置および切断方法
KR20100107253A (ko) 2009-03-25 2010-10-05 삼성모바일디스플레이주식회사 기판 절단 장치 및 이를 이용한 기판 절단 방법
JP5416445B2 (ja) * 2009-03-25 2014-02-12 三星ダイヤモンド工業株式会社 レーザスクライブ装置
KR101041137B1 (ko) 2009-03-25 2011-06-13 삼성모바일디스플레이주식회사 기판 절단 장치 및 이를 이용한 기판 절단 방법
KR101073563B1 (ko) * 2010-02-08 2011-10-14 삼성모바일디스플레이주식회사 표시 장치 및 이의 제조 방법
JP6668776B2 (ja) * 2016-01-22 2020-03-18 三星ダイヤモンド工業株式会社 ブレイク装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3526175B2 (ja) * 1997-06-11 2004-05-10 三菱電機株式会社 レーザ加工装置
JP2001130921A (ja) * 1999-10-29 2001-05-15 Mitsuboshi Diamond Industrial Co Ltd 脆性基板の加工方法及び装置
JP3439179B2 (ja) * 2000-07-28 2003-08-25 三菱重工業株式会社 レーザーエッチング方法
KR100673073B1 (ko) * 2000-10-21 2007-01-22 삼성전자주식회사 레이저 빔을 이용한 비금속 기판의 절단 방법 및 장치

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101011845B (zh) * 2006-02-02 2010-11-17 Sfa工程股份有限公司 划线设备
CN1958490B (zh) * 2006-05-08 2010-05-26 塔工程有限公司 利用同步的多轴对基板划线的装置及方法
CN101439928B (zh) * 2007-11-23 2012-02-29 三星康宁精密素材株式会社 玻璃基板激光裁切装置
CN102441931A (zh) * 2010-10-05 2012-05-09 三星钻石工业股份有限公司 脆性材料基板的分断装置
CN106470814A (zh) * 2014-06-26 2017-03-01 三星钻石工业股份有限公司 脆性衬底的切断方法及划线装置
CN106995274A (zh) * 2016-09-23 2017-08-01 广州市科卡通信科技有限公司 一种新式玻璃画线装置
CN114939718A (zh) * 2022-06-30 2022-08-26 广东利元亨技术有限公司 一种激光划线装置
CN114939718B (zh) * 2022-06-30 2024-02-13 广东舜元激光科技有限公司 一种激光划线装置

Also Published As

Publication number Publication date
JP4134033B2 (ja) 2008-08-13
AU2003246209A1 (en) 2004-01-19
WO2004002705A1 (ja) 2004-01-08
TW200407209A (en) 2004-05-16
TWI297295B (enExample) 2008-06-01
KR20050005525A (ko) 2005-01-13
JPWO2004002705A1 (ja) 2005-10-27
KR100647454B1 (ko) 2006-11-23

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication