TW200406015A - Electrically isolated liquid metal micro-switches for integrally shielded microcircuits - Google Patents
Electrically isolated liquid metal micro-switches for integrally shielded microcircuits Download PDFInfo
- Publication number
- TW200406015A TW200406015A TW092112031A TW92112031A TW200406015A TW 200406015 A TW200406015 A TW 200406015A TW 092112031 A TW092112031 A TW 092112031A TW 92112031 A TW92112031 A TW 92112031A TW 200406015 A TW200406015 A TW 200406015A
- Authority
- TW
- Taiwan
- Prior art keywords
- liquid metal
- dielectric layer
- substrate
- ground plane
- cavity
- Prior art date
Links
- 229910001338 liquidmetal Inorganic materials 0.000 title claims abstract description 109
- 238000000034 method Methods 0.000 claims abstract description 45
- 239000000758 substrate Substances 0.000 claims description 92
- 238000010438 heat treatment Methods 0.000 claims description 50
- 239000007789 gas Substances 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 12
- 238000000059 patterning Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 8
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims description 8
- 229910052753 mercury Inorganic materials 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 4
- 239000011800 void material Substances 0.000 claims description 2
- 229910010293 ceramic material Inorganic materials 0.000 claims 2
- 238000002955 isolation Methods 0.000 abstract description 6
- 230000010354 integration Effects 0.000 abstract description 3
- 238000010276 construction Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 133
- 239000010408 film Substances 0.000 description 25
- 238000005516 engineering process Methods 0.000 description 22
- 239000007788 liquid Substances 0.000 description 15
- 238000007736 thin film deposition technique Methods 0.000 description 11
- 239000003989 dielectric material Substances 0.000 description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 238000000427 thin-film deposition Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910001004 magnetic alloy Inorganic materials 0.000 description 1
- 239000008267 milk Substances 0.000 description 1
- 210000004080 milk Anatomy 0.000 description 1
- 235000013336 milk Nutrition 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H29/00—Switches having at least one liquid contact
- H01H2029/008—Switches having at least one liquid contact using micromechanics, e.g. micromechanical liquid contact switches or [LIMMS]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H61/00—Electrothermal relays
- H01H2061/006—Micromechanical thermal relay
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H29/00—Switches having at least one liquid contact
- H01H29/28—Switches having at least one liquid contact with level of surface of contact liquid displaced by fluid pressure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H61/00—Electrothermal relays
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Micromachines (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/266,872 US6689976B1 (en) | 2002-10-08 | 2002-10-08 | Electrically isolated liquid metal micro-switches for integrally shielded microcircuits |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200406015A true TW200406015A (en) | 2004-04-16 |
Family
ID=30770714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092112031A TW200406015A (en) | 2002-10-08 | 2003-05-01 | Electrically isolated liquid metal micro-switches for integrally shielded microcircuits |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US6689976B1 (enExample) |
| JP (1) | JP2004134399A (enExample) |
| SG (1) | SG120114A1 (enExample) |
| TW (1) | TW200406015A (enExample) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IL150969A0 (en) * | 2000-02-02 | 2003-02-12 | Raytheon Co | Microelectromechanical micro-relay with liquid metal contacts |
| US7256669B2 (en) * | 2000-04-28 | 2007-08-14 | Northeastern University | Method of preparing electrical contacts used in switches |
| JP2004079288A (ja) * | 2002-08-13 | 2004-03-11 | Agilent Technol Inc | 液体金属を用いた電気接点開閉装置 |
| JP2004227858A (ja) * | 2003-01-21 | 2004-08-12 | Agilent Technol Inc | 電気接点開閉装置及び電気接点開閉装置の製造方法 |
| US6770827B1 (en) * | 2003-04-14 | 2004-08-03 | Agilent Technologies, Inc. | Electrical isolation of fluid-based switches |
| US6894237B2 (en) * | 2003-04-14 | 2005-05-17 | Agilent Technologies, Inc. | Formation of signal paths to increase maximum signal-carrying frequency of a fluid-based switch |
| JP4305293B2 (ja) * | 2003-10-14 | 2009-07-29 | 横河電機株式会社 | リレー |
| US6995329B2 (en) * | 2004-03-11 | 2006-02-07 | Agilent Technologies, Inc. | Switch, with lid mounted on a thickfilm dielectric |
| US7019236B2 (en) * | 2004-03-11 | 2006-03-28 | Agilent Technologies, Inc. | Switch with lid |
| US20050231070A1 (en) * | 2004-04-16 | 2005-10-20 | Fazzio Ronald S | Liquid metal processing and dispensing for liquid metal devices |
| US6822176B1 (en) * | 2004-04-16 | 2004-11-23 | Agilent Technologies, Inc. | Liquid metal switch and method of manufacture therefor |
| US20060260919A1 (en) * | 2005-05-17 | 2006-11-23 | Marco Aimi | Methods and apparatus for filling a microswitch with liquid metal |
| US7358452B2 (en) * | 2005-06-30 | 2008-04-15 | Agilent Technlolgies, Inc. | Architecture and method of fabrication for a liquid metal microswitch (LIMMS) |
| US7358833B2 (en) * | 2006-03-14 | 2008-04-15 | Lucent Technologies Inc. | Method and apparatus for signal processing using electrowetting |
| DE102006027730A1 (de) * | 2006-06-16 | 2007-12-20 | Bayer Cropscience Ag | Wirkstoffkombinationen mit insektiziden und akariziden Eigenschaften |
| US7645952B2 (en) * | 2006-09-11 | 2010-01-12 | Alcatel-Lucent Usa Inc. | Mechanical switch with melting bridge |
| JP2009117078A (ja) * | 2007-11-02 | 2009-05-28 | Yokogawa Electric Corp | リレー |
| US8039957B2 (en) * | 2009-03-11 | 2011-10-18 | Raytheon Company | System for improving flip chip performance |
| US9012254B2 (en) | 2012-02-15 | 2015-04-21 | Kadoor Microelectronics Ltd | Methods for forming a sealed liquid metal drop |
| US8830016B2 (en) * | 2012-09-10 | 2014-09-09 | Broadcom Corporation | Liquid MEMS magnetic component |
| CN104091717A (zh) * | 2014-07-25 | 2014-10-08 | 西安交通大学 | 一种新型自能式液态金属限流器及方法 |
| US11187891B1 (en) * | 2017-06-12 | 2021-11-30 | Hrl Laboratories, Llc | Spatial light modulator using phase-change matertals with improved fill factor |
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| GB1143822A (enExample) * | 1965-08-20 | |||
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-
2002
- 2002-10-08 US US10/266,872 patent/US6689976B1/en not_active Expired - Fee Related
-
2003
- 2003-05-01 TW TW092112031A patent/TW200406015A/zh unknown
- 2003-08-12 US US10/639,539 patent/US6781075B2/en not_active Expired - Fee Related
- 2003-09-22 SG SG200305559A patent/SG120114A1/en unknown
- 2003-09-29 JP JP2003338616A patent/JP2004134399A/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| US6689976B1 (en) | 2004-02-10 |
| US6781075B2 (en) | 2004-08-24 |
| SG120114A1 (en) | 2006-03-28 |
| JP2004134399A (ja) | 2004-04-30 |
| US20040066259A1 (en) | 2004-04-08 |
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