SU415285A1 - - Google Patents

Info

Publication number
SU415285A1
SU415285A1 SU1686979A SU1686979A SU415285A1 SU 415285 A1 SU415285 A1 SU 415285A1 SU 1686979 A SU1686979 A SU 1686979A SU 1686979 A SU1686979 A SU 1686979A SU 415285 A1 SU415285 A1 SU 415285A1
Authority
SU
USSR - Soviet Union
Prior art keywords
abrasive
grains
abrasive grains
paste
diamond
Prior art date
Application number
SU1686979A
Other languages
English (en)
Russian (ru)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to SU1686979A priority Critical patent/SU415285A1/ru
Application granted granted Critical
Publication of SU415285A1 publication Critical patent/SU415285A1/ru

Links

Landscapes

  • Polishing Bodies And Polishing Tools (AREA)
SU1686979A 1971-07-27 1971-07-27 SU415285A1 (en:Method)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SU1686979A SU415285A1 (en:Method) 1971-07-27 1971-07-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SU1686979A SU415285A1 (en:Method) 1971-07-27 1971-07-27

Publications (1)

Publication Number Publication Date
SU415285A1 true SU415285A1 (en:Method) 1974-02-15

Family

ID=20484737

Family Applications (1)

Application Number Title Priority Date Filing Date
SU1686979A SU415285A1 (en:Method) 1971-07-27 1971-07-27

Country Status (1)

Country Link
SU (1) SU415285A1 (en:Method)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7407601B2 (en) * 2003-04-24 2008-08-05 Taiwan Semiconductor Manufacturing Co., Ltd Polymeric particle slurry system and method to reduce feature sidewall erosion

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7407601B2 (en) * 2003-04-24 2008-08-05 Taiwan Semiconductor Manufacturing Co., Ltd Polymeric particle slurry system and method to reduce feature sidewall erosion

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