SG97849A1 - Flat flexible cable with ground conductors - Google Patents
Flat flexible cable with ground conductorsInfo
- Publication number
- SG97849A1 SG97849A1 SG200000944A SG200000944A SG97849A1 SG 97849 A1 SG97849 A1 SG 97849A1 SG 200000944 A SG200000944 A SG 200000944A SG 200000944 A SG200000944 A SG 200000944A SG 97849 A1 SG97849 A1 SG 97849A1
- Authority
- SG
- Singapore
- Prior art keywords
- flexible cable
- ground conductors
- flat flexible
- flat
- conductors
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/08—Flat or ribbon cables
- H01B7/0876—Flat or ribbon cables comprising twisted pairs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09263—Meander
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09672—Superposed layout, i.e. in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/097—Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Insulated Conductors (AREA)
- Communication Cables (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/271,538 US6300846B1 (en) | 1999-03-18 | 1999-03-18 | Flat flexible cable with ground conductors |
Publications (1)
Publication Number | Publication Date |
---|---|
SG97849A1 true SG97849A1 (en) | 2003-08-20 |
Family
ID=23036011
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200000944A SG97849A1 (en) | 1999-03-18 | 2000-02-24 | Flat flexible cable with ground conductors |
Country Status (9)
Country | Link |
---|---|
US (1) | US6300846B1 (ja) |
EP (1) | EP1037512B1 (ja) |
JP (1) | JP3336527B2 (ja) |
KR (1) | KR100344044B1 (ja) |
CN (1) | CN1201340C (ja) |
DE (1) | DE60022417T2 (ja) |
MY (1) | MY127986A (ja) |
SG (1) | SG97849A1 (ja) |
TW (1) | TW449089U (ja) |
Families Citing this family (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7336468B2 (en) | 1997-04-08 | 2008-02-26 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
US9054094B2 (en) | 1997-04-08 | 2015-06-09 | X2Y Attenuators, Llc | Energy conditioning circuit arrangement for integrated circuit |
US7321485B2 (en) | 1997-04-08 | 2008-01-22 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
US8847696B2 (en) * | 2002-03-18 | 2014-09-30 | Qualcomm Incorporated | Flexible interconnect cable having signal trace pairs and ground layer pairs disposed on opposite sides of a flexible dielectric |
US6951978B1 (en) * | 2002-12-30 | 2005-10-04 | Richard S. Norman | Conductive fabric with balanced mutual interference amongst conductors |
US7271985B1 (en) * | 2004-09-24 | 2007-09-18 | Storage Technology Corporation | System and method for crosstalk reduction in a flexible trace interconnect array |
KR100674916B1 (ko) * | 2004-10-28 | 2007-01-26 | 삼성전자주식회사 | 꼬인 다면 위상 클록 전송 라인 및 이를 이용한 반도체 장치 |
KR20070107746A (ko) | 2005-03-01 | 2007-11-07 | 엑스2와이 어테뉴에이터스, 엘.엘.씨 | 내부 중첩된 조절기 |
US8553364B1 (en) * | 2005-09-09 | 2013-10-08 | Magnecomp Corporation | Low impedance, high bandwidth disk drive suspension circuit |
JP5106411B2 (ja) * | 2006-10-24 | 2012-12-26 | パナソニック株式会社 | プリント配線板およびプリント配線板の製造方法 |
US7782572B2 (en) * | 2007-05-04 | 2010-08-24 | Hutchinson Technology Incorporated | Disk drive head suspension flexures having alternating width stacked leads |
TWI341152B (en) * | 2007-10-26 | 2011-04-21 | Ind Tech Res Inst | Conductive connection structure of printed circuit board (pcb) |
KR100969735B1 (ko) * | 2007-11-07 | 2010-07-13 | 엘지노텔 주식회사 | 전원라인을 포함하는 전자장치 |
US7830221B2 (en) * | 2008-01-25 | 2010-11-09 | Micron Technology, Inc. | Coupling cancellation scheme |
US8169746B1 (en) | 2008-04-08 | 2012-05-01 | Hutchinson Technology Incorporated | Integrated lead suspension with multiple trace configurations |
KR101490482B1 (ko) * | 2008-04-23 | 2015-02-06 | 삼성디스플레이 주식회사 | 액정 표시 장치의 제조 방법 |
TWI401493B (zh) * | 2008-12-24 | 2013-07-11 | Au Optronics Corp | 液晶顯示面板 |
KR101066540B1 (ko) | 2008-12-30 | 2011-09-21 | 홍승구 | 데이터 전송용 케이블의 배선 구조 |
CN102369636B (zh) * | 2009-03-30 | 2014-04-09 | 富士通株式会社 | 差动路径转换部件、印制基板以及电子装置 |
US20100307798A1 (en) * | 2009-06-03 | 2010-12-09 | Izadian Jamal S | Unified scalable high speed interconnects technologies |
TW201115997A (en) * | 2009-10-22 | 2011-05-01 | Inventec Corp | Prevention structure to prevent signal lines from time-skew |
US8233240B2 (en) * | 2009-12-10 | 2012-07-31 | Hitachi Global Storage Technologies Netherlands B.V. | Magnetic recording disk drive with integrated lead suspension having multiple segments for optimal characteristic impedance |
KR101130697B1 (ko) | 2010-05-07 | 2012-04-02 | 삼성전자주식회사 | 복수 층의 신축성 배선 |
US8885299B1 (en) | 2010-05-24 | 2014-11-11 | Hutchinson Technology Incorporated | Low resistance ground joints for dual stage actuation disk drive suspensions |
US9001469B2 (en) | 2012-03-16 | 2015-04-07 | Hutchinson Technology Incorporated | Mid-loadbeam dual stage actuated (DSA) disk drive head suspension |
WO2014035591A1 (en) | 2012-08-31 | 2014-03-06 | Hutchinson Technology Incorporated | Damped dual stage actuation disk drive suspensions |
JP6251745B2 (ja) | 2012-09-14 | 2017-12-20 | ハッチンソン テクノロジー インコーポレイテッドHutchinson Technology Incorporated | 2段始動構造部を有するジンバル形撓み部材及びサスペンション |
WO2014059128A2 (en) | 2012-10-10 | 2014-04-17 | Hutchinson Technology Incorporated | Co-located gimbal-based dual stage actuation disk drive suspensions with dampers |
US8941951B2 (en) | 2012-11-28 | 2015-01-27 | Hutchinson Technology Incorporated | Head suspension flexure with integrated strain sensor and sputtered traces |
US8891206B2 (en) | 2012-12-17 | 2014-11-18 | Hutchinson Technology Incorporated | Co-located gimbal-based dual stage actuation disk drive suspensions with motor stiffener |
US9131603B2 (en) * | 2013-03-15 | 2015-09-08 | Intel Corporation | Signal line pairs on a circuit board which are displaced from each other relative to a center line |
US9590339B2 (en) | 2013-05-09 | 2017-03-07 | Commscope, Inc. Of North Carolina | High data rate connectors and cable assemblies that are suitable for harsh environments and related methods and systems |
US8896969B1 (en) | 2013-05-23 | 2014-11-25 | Hutchinson Technology Incorporated | Two-motor co-located gimbal-based dual stage actuation disk drive suspensions with motor stiffeners |
US8717712B1 (en) | 2013-07-15 | 2014-05-06 | Hutchinson Technology Incorporated | Disk drive suspension assembly having a partially flangeless load point dimple |
US8792214B1 (en) | 2013-07-23 | 2014-07-29 | Hutchinson Technology Incorporated | Electrical contacts to motors in dual stage actuated suspensions |
US8675314B1 (en) | 2013-08-21 | 2014-03-18 | Hutchinson Technology Incorporated | Co-located gimbal-based dual stage actuation disk drive suspensions with offset motors |
US8965159B1 (en) * | 2013-11-07 | 2015-02-24 | International Business Machines Corporation | Implementing twisted pair waveguide for electronic substrates |
US8896970B1 (en) | 2013-12-31 | 2014-11-25 | Hutchinson Technology Incorporated | Balanced co-located gimbal-based dual stage actuation disk drive suspensions |
US8867173B1 (en) | 2014-01-03 | 2014-10-21 | Hutchinson Technology Incorporated | Balanced multi-trace transmission in a hard disk drive flexure |
US9070392B1 (en) | 2014-12-16 | 2015-06-30 | Hutchinson Technology Incorporated | Piezoelectric disk drive suspension motors having plated stiffeners |
US9318136B1 (en) | 2014-12-22 | 2016-04-19 | Hutchinson Technology Incorporated | Multilayer disk drive motors having out-of-plane bending |
US9296188B1 (en) | 2015-02-17 | 2016-03-29 | Hutchinson Technology Incorporated | Partial curing of a microactuator mounting adhesive in a disk drive suspension |
JP6689294B2 (ja) | 2015-06-30 | 2020-04-28 | ハッチンソン テクノロジー インコーポレイテッドHutchinson Technology Incorporated | 金誘電体接合部の信頼性を向上させたディスクドライブヘッドサスペンション構造 |
US10044085B2 (en) * | 2016-04-14 | 2018-08-07 | Wisconsin Alumni Research Foundation | Stretchable transmission lines and circuits for microwave and millimeter wave frequency wearable electronics |
US9646638B1 (en) | 2016-05-12 | 2017-05-09 | Hutchinson Technology Incorporated | Co-located gimbal-based DSA disk drive suspension with traces routed around slider pad |
CN215342918U (zh) * | 2018-11-14 | 2021-12-28 | 株式会社村田制作所 | 柔性基板以及电子设备 |
US11854720B2 (en) * | 2019-01-18 | 2023-12-26 | Autonetworks Technologies, Ltd. | Wiring member for suppressing increase in arrangment space |
CN211479699U (zh) * | 2019-07-31 | 2020-09-11 | 台湾立讯精密有限公司 | 软性排线及信号传输装置 |
EP3809517A1 (en) * | 2019-10-17 | 2021-04-21 | ALCAN Systems GmbH | Transmission line for radio frequency signals |
DE102020105012A1 (de) | 2020-02-26 | 2021-08-26 | Bayerische Motoren Werke Aktiengesellschaft | Folienleiter sowie Kraftfahrzeug mit einem Folienleiter |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07202358A (ja) * | 1993-12-28 | 1995-08-04 | Kel Corp | 2層構造フレキシブルプリント基板 |
EP0854664A1 (en) * | 1997-01-16 | 1998-07-22 | Lucent Technologies Inc. | Printed circuit board including crosstalk compensation |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3617952A (en) | 1969-08-27 | 1971-11-02 | Ibm | Stepped-impedance directional coupler |
US3761842A (en) | 1972-06-01 | 1973-09-25 | Bell Telephone Labor Inc | Twisted pair flat conductor cable with means to equalize impedance and propagation velocity |
US3764727A (en) | 1972-06-12 | 1973-10-09 | Western Electric Co | Electrically conductive flat cable structures |
IT211826Z2 (it) * | 1987-09-15 | 1989-05-25 | Microset Srl | Scheda madre a circuito stampato per bus di microprocessori. |
US4798918A (en) * | 1987-09-21 | 1989-01-17 | Intel Corporation | High density flexible circuit |
US4991665A (en) * | 1988-12-05 | 1991-02-12 | Buss Systems Incorporated | Flexible circuit conductor run |
US5036160A (en) * | 1989-11-07 | 1991-07-30 | Crosspoint Systems, Inc. | Twisted pair backplane |
JP3047572B2 (ja) | 1991-10-25 | 2000-05-29 | 住友電装株式会社 | フラット回路体 |
JPH06111642A (ja) | 1992-09-25 | 1994-04-22 | Yazaki Corp | 積層ワイヤハーネスにおける電磁妨害低減方法 |
US5296651A (en) * | 1993-02-09 | 1994-03-22 | Hewlett-Packard Company | Flexible circuit with ground plane |
US5397862A (en) | 1993-08-31 | 1995-03-14 | Motorola, Inc. | Horizontally twisted-pair planar conductor line structure |
US5675298A (en) * | 1995-11-21 | 1997-10-07 | Sun Microsystems, Inc. | Low-loss, low-inductance interconnect for microcircuits |
JP2860468B2 (ja) * | 1996-05-24 | 1999-02-24 | モレックス インコーポレーテッド | 擬似ツイストペア平型柔軟ケーブル |
JP3528484B2 (ja) * | 1996-12-27 | 2004-05-17 | モレックス インコーポレーテッド | 擬似ツイストペア平型柔軟ケーブル |
-
1999
- 1999-03-18 US US09/271,538 patent/US6300846B1/en not_active Expired - Lifetime
-
2000
- 2000-02-24 SG SG200000944A patent/SG97849A1/en unknown
- 2000-03-09 TW TW089203740U patent/TW449089U/zh not_active IP Right Cessation
- 2000-03-13 EP EP00105207A patent/EP1037512B1/en not_active Expired - Lifetime
- 2000-03-13 DE DE60022417T patent/DE60022417T2/de not_active Expired - Fee Related
- 2000-03-15 JP JP2000071901A patent/JP3336527B2/ja not_active Expired - Fee Related
- 2000-03-17 MY MYPI20001056A patent/MY127986A/en unknown
- 2000-03-17 KR KR1020000013514A patent/KR100344044B1/ko not_active IP Right Cessation
- 2000-03-20 CN CNB001043676A patent/CN1201340C/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07202358A (ja) * | 1993-12-28 | 1995-08-04 | Kel Corp | 2層構造フレキシブルプリント基板 |
EP0854664A1 (en) * | 1997-01-16 | 1998-07-22 | Lucent Technologies Inc. | Printed circuit board including crosstalk compensation |
Also Published As
Publication number | Publication date |
---|---|
DE60022417T2 (de) | 2006-06-22 |
MY127986A (en) | 2007-01-31 |
KR20000076886A (ko) | 2000-12-26 |
TW449089U (en) | 2001-08-01 |
JP3336527B2 (ja) | 2002-10-21 |
CN1268020A (zh) | 2000-09-27 |
DE60022417D1 (de) | 2005-10-13 |
JP2000307204A (ja) | 2000-11-02 |
KR100344044B1 (ko) | 2002-07-20 |
CN1201340C (zh) | 2005-05-11 |
US6300846B1 (en) | 2001-10-09 |
EP1037512A2 (en) | 2000-09-20 |
EP1037512B1 (en) | 2005-09-07 |
EP1037512A3 (en) | 2002-06-19 |
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