SG91941A1 - Aqueous dispersions, process for their production, and their use - Google Patents

Aqueous dispersions, process for their production, and their use

Info

Publication number
SG91941A1
SG91941A1 SG200106589A SG200106589A SG91941A1 SG 91941 A1 SG91941 A1 SG 91941A1 SG 200106589 A SG200106589 A SG 200106589A SG 200106589 A SG200106589 A SG 200106589A SG 91941 A1 SG91941 A1 SG 91941A1
Authority
SG
Singapore
Prior art keywords
production
aqueous dispersions
dispersion
oxide
dispersions
Prior art date
Application number
SG200106589A
Other languages
English (en)
Inventor
Wolfgang Lortz
Christoph Batz-Sohn
Gabriele Perlet
Werner Will
Original Assignee
Degussa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Degussa filed Critical Degussa
Publication of SG91941A1 publication Critical patent/SG91941A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31051—Planarisation of the insulating layers
    • H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31971—Of carbohydrate
    • Y10T428/31993—Of paper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Silicon Compounds (AREA)
  • Glass Melting And Manufacturing (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
  • Weting (AREA)
  • Surface Treatment Of Glass (AREA)
  • Paper (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
SG200106589A 2000-11-02 2001-10-25 Aqueous dispersions, process for their production, and their use SG91941A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2000154345 DE10054345A1 (de) 2000-11-02 2000-11-02 Wäßrige Dispersion, Verfahren zu deren Herstellung und Verwendung

Publications (1)

Publication Number Publication Date
SG91941A1 true SG91941A1 (en) 2002-10-15

Family

ID=7661929

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200106589A SG91941A1 (en) 2000-11-02 2001-10-25 Aqueous dispersions, process for their production, and their use

Country Status (9)

Country Link
US (1) US6663683B2 (zh)
EP (1) EP1203801B1 (zh)
JP (1) JP3990559B2 (zh)
KR (1) KR100526915B1 (zh)
AT (1) ATE426649T1 (zh)
DE (2) DE10054345A1 (zh)
MY (1) MY129156A (zh)
SG (1) SG91941A1 (zh)
TW (1) TWI294450B (zh)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10204471C1 (de) * 2002-02-05 2003-07-03 Degussa Wässerige Dispersion enthaltend mit Ceroxid umhülltes Siliciumdioxidpulver, Verfahren zu deren Herstellung und Verwendung
US20080219130A1 (en) * 2003-08-14 2008-09-11 Mempile Inc. C/O Phs Corporate Services, Inc. Methods and Apparatus for Formatting and Tracking Information for Three-Dimensional Storage Medium
DE102004010504B4 (de) * 2004-03-04 2006-05-04 Degussa Ag Hochtransparente lasermarkierbare und laserschweißbare Kunststoffmaterialien, deren Verwendung und Herstellung sowie Verwendung von Metallmischoxiden und Verfahren zur Kennzeichnung von Produktionsgütern
CN1980860B (zh) * 2004-05-04 2011-06-08 卡伯特公司 制备具有期望的聚集粒径的聚集的金属氧化物颗粒的分散体的方法
DE102004031785A1 (de) * 2004-07-01 2006-01-26 Degussa Ag Polyol enthaltende Siliciumdioxid-Dispersion
DE102004037044A1 (de) 2004-07-29 2006-03-23 Degussa Ag Mittel zur Ausstattung von auf Cellulose und/oder Stärke basierenden Substraten mit Wasser abweisenden und gleichzeitig pilz-, bakterien-, insekten- sowie algenwidrigen Eigenschaften
DE102004037045A1 (de) 2004-07-29 2006-04-27 Degussa Ag Wässrige Silan-Nanokomposite
DE102004037118A1 (de) * 2004-07-30 2006-03-23 Degussa Ag Titandioxid enthaltende Dispersion
DE102004049427A1 (de) 2004-10-08 2006-04-13 Degussa Ag Polyetherfunktionelle Siloxane, polyethersiloxanhaltige Zusammensetzungen, Verfahren zu deren Herstellung und deren Verwendung
AT501131B1 (de) * 2004-11-29 2008-05-15 Armin Dipl Ing Faltl Druckaufgeladene, thermochemische energieumwandlungsanlage
DE102005004872A1 (de) 2005-02-03 2006-08-10 Degussa Ag Wässrige Emulsionen von funktionellen Alkoxysilanen und deren kondensierten Oligomeren, deren Herstellung und Verwendung zur Oberflächenbehandlung
US7704586B2 (en) * 2005-03-09 2010-04-27 Degussa Ag Plastic molded bodies having two-dimensional and three-dimensional image structures produced through laser subsurface engraving
DE102005032427A1 (de) * 2005-07-12 2007-01-18 Degussa Ag Aluminiumoxid-Dispersion
US7553465B2 (en) * 2005-08-12 2009-06-30 Degussa Ag Cerium oxide powder and cerium oxide dispersion
DE102006006656A1 (de) 2005-08-26 2007-03-01 Degussa Ag Silan enthaltendes Bindemittel für Verbundwerkstoffe
DE102006006655A1 (de) * 2005-08-26 2007-03-01 Degussa Ag Cellulose- bzw. lignocellulosehaltige Verbundwerkstoffe auf der Basis eines auf Silan basierenden Komposits als Bindemittel
DE102005053071A1 (de) 2005-11-04 2007-05-16 Degussa Verfahren zur Herstellung von ultrafeinen Pulvern auf Basis Polymaiden, ultrafeinen Polyamidpulver sowie deren Verwendung
DE102005059960A1 (de) * 2005-12-15 2007-06-28 Degussa Gmbh Hochgefüllte Übergangs-Aluminiumoxid enthaltende Dispersion
WO2007086267A1 (ja) * 2006-01-27 2007-08-02 Konica Minolta Medical & Graphic, Inc. コア・シェル構造を有するナノ半導体粒子およびその製造方法
DE102006017701A1 (de) * 2006-04-15 2007-10-25 Degussa Gmbh Silicium-Titan-Mischoxidpulver, Dispersion hiervon und daraus hergestellter titanhaltiger Zeolith
US7846492B2 (en) * 2006-04-27 2010-12-07 Guardian Industries Corp. Photocatalytic window and method of making same
DE102007021199B4 (de) * 2006-07-17 2016-02-11 Evonik Degussa Gmbh Zusammensetzungen aus organischem Polymer als Matrix und anorganischen Partikeln als Füllstoff, Verfahren zu deren Herstellung sowie deren Verwendung und damit hergestellte Formkörper
US8155674B2 (en) * 2006-08-22 2012-04-10 Research In Motion Limited Apparatus, and associated method, for dynamically configuring a page message used to page an access terminal in a radio communication system
DE102006039269A1 (de) * 2006-08-22 2008-02-28 Evonik Degussa Gmbh Dispersion von Aluminiumoxid, Beschichtungszusammensetzung und tintenaufnehmendes Medium
ES2725499T3 (es) 2007-04-20 2019-09-24 Evonik Degussa Gmbh Mezcla que contiene un compuesto de organosilicio y su uso
DE102007038314A1 (de) 2007-08-14 2009-04-16 Evonik Degussa Gmbh Verfahren zur kontrollierten Hydrolyse und Kondensation von Epoxy-funktionellen Organosilanen sowie deren Condensation mit weiteren organofunktionellen Alkoxysilanen
DE102007040246A1 (de) * 2007-08-25 2009-02-26 Evonik Degussa Gmbh Strahlenhärtbare Formulierungen
DE102008007261A1 (de) 2007-08-28 2009-03-05 Evonik Degussa Gmbh Wässrige Silansysteme basierend auf Bis(trialkoxysilyalkyl)aminen
DE102007049743A1 (de) * 2007-10-16 2009-04-23 Evonik Degussa Gmbh Silicium-Titan-Mischoxidpulver, Dispersion hiervon und daraus hergestellter titanhaltiger Zeolith
DE102007054885A1 (de) * 2007-11-15 2009-05-20 Evonik Degussa Gmbh Verfahren zur Fraktionierung oxidischer Nanopartikel durch Querstrom-Membranfiltration
ES2644759T3 (es) * 2008-07-18 2017-11-30 Evonik Degussa Gmbh Dispersión de partículas de dióxido de silicio hidrofobizadas y granulado de la misma
DE102009002477A1 (de) 2009-04-20 2010-10-21 Evonik Degussa Gmbh Quartäre-aminofunktionelle, siliciumorganische Verbindungen enthaltende Zusammensetzung sowie deren Herstellung und Verwendung
DE102009002499A1 (de) 2009-04-20 2010-10-21 Evonik Degussa Gmbh Dispersion enthaltend mit quartären, aminofunktionellen siliciumorganischen Verbindungen oberflächenmodifizierte Siliciumdioxidpartikel

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999008838A1 (en) * 1997-08-14 1999-02-25 Ekc Technology, Inc. Chemical mechanical polishing composition
WO2000013218A1 (en) * 1998-08-31 2000-03-09 Micron Technology, Inc. Slurries for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
DE19847161A1 (de) * 1998-10-14 2000-04-20 Degussa Mittels Aerosol dotiertes pyrogen hergestelltes Siliciumdioxid

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5382272A (en) * 1993-09-03 1995-01-17 Rodel, Inc. Activated polishing compositions
DE69611653T2 (de) * 1995-11-10 2001-05-03 Tokuyama Corp Poliersuspensionen und Verfahren zu ihrer Herstellung
US5897675A (en) * 1996-04-26 1999-04-27 Degussa Aktiengesellschaft Cerium oxide-metal/metalloid oxide mixture
KR19980019046A (ko) 1996-08-29 1998-06-05 고사이 아키오 연마용 조성물 및 이의 용도(Abrasive composition and use of the same)
DE19650500A1 (de) * 1996-12-05 1998-06-10 Degussa Dotierte, pyrogen hergestellte Oxide
DE19756840A1 (de) 1997-01-23 1998-07-30 Degussa Pyrogene Oxide und Verfahren zu ihrer Herstellung
JP3359535B2 (ja) 1997-04-25 2002-12-24 三井金属鉱業株式会社 半導体装置の製造方法
KR20000006595A (ko) * 1998-09-22 2000-02-07 유현식 반도체소자 cmp용 금속산화물 슬러리의 제조방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999008838A1 (en) * 1997-08-14 1999-02-25 Ekc Technology, Inc. Chemical mechanical polishing composition
WO2000013218A1 (en) * 1998-08-31 2000-03-09 Micron Technology, Inc. Slurries for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
DE19847161A1 (de) * 1998-10-14 2000-04-20 Degussa Mittels Aerosol dotiertes pyrogen hergestelltes Siliciumdioxid

Also Published As

Publication number Publication date
TWI294450B (zh) 2008-03-11
EP1203801B1 (de) 2009-03-25
EP1203801A3 (de) 2004-01-02
KR100526915B1 (ko) 2005-11-09
DE10054345A1 (de) 2002-05-08
MY129156A (en) 2007-03-30
US6663683B2 (en) 2003-12-16
JP3990559B2 (ja) 2007-10-17
US20020095873A1 (en) 2002-07-25
DE50114784D1 (de) 2009-05-07
KR20020034951A (ko) 2002-05-09
JP2002211915A (ja) 2002-07-31
ATE426649T1 (de) 2009-04-15
EP1203801A2 (de) 2002-05-08

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