SG91271A1 - Cleaning apparatus - Google Patents
Cleaning apparatusInfo
- Publication number
- SG91271A1 SG91271A1 SG200002017A SG200002017A SG91271A1 SG 91271 A1 SG91271 A1 SG 91271A1 SG 200002017 A SG200002017 A SG 200002017A SG 200002017 A SG200002017 A SG 200002017A SG 91271 A1 SG91271 A1 SG 91271A1
- Authority
- SG
- Singapore
- Prior art keywords
- compressed gas
- cleaning liquid
- ejection port
- path
- cleaning apparatus
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
- B05B7/02—Spray pistols; Apparatus for discharge
- B05B7/04—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge
- B05B7/0416—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning In General (AREA)
- Dicing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11094599A JP3410385B2 (ja) | 1999-04-19 | 1999-04-19 | 洗浄装置及び切削装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG91271A1 true SG91271A1 (en) | 2002-09-17 |
Family
ID=14548544
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200002017A SG91271A1 (en) | 1999-04-19 | 2000-04-10 | Cleaning apparatus |
Country Status (5)
Country | Link |
---|---|
US (1) | US6386466B1 (de) |
JP (1) | JP3410385B2 (de) |
DE (1) | DE10019472B4 (de) |
SG (1) | SG91271A1 (de) |
TW (1) | TW445499B (de) |
Families Citing this family (72)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1166883B1 (de) * | 2000-06-30 | 2005-10-05 | Shibuya Kogyo Co., Ltd | Reinigungsdüse und Reinigungsgerät |
US6951221B2 (en) * | 2000-09-22 | 2005-10-04 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing apparatus |
US6705331B2 (en) * | 2000-11-20 | 2004-03-16 | Dainippon Screen Mfg., Co., Ltd. | Substrate cleaning apparatus |
EP1361610B1 (de) * | 2001-01-18 | 2011-11-30 | Kabushiki Kaisha Watanabe Shoko | Verdampfer und die beschictungsvorrichtung mit dem verdampfer |
KR100433453B1 (ko) * | 2001-07-03 | 2004-05-31 | 주식회사 케이씨텍 | 반도체 세정용 버블 제트 샤워 모듈 |
JP2003145062A (ja) * | 2001-11-14 | 2003-05-20 | Mitsubishi Electric Corp | 洗浄用2流体ジェットノズル、洗浄装置およびこれらを用いた半導体装置の製造方法 |
JP3822135B2 (ja) * | 2002-05-13 | 2006-09-13 | 日本パイオニクス株式会社 | 気化供給装置 |
US6702202B1 (en) * | 2002-06-28 | 2004-03-09 | Lam Research Corporation | Method and apparatus for fluid delivery to a backside of a substrate |
KR100641026B1 (ko) * | 2002-12-03 | 2006-11-02 | 주식회사 케이씨텍 | 슬릿형 노즐을 가지는 혼합 유체 분사 기구 |
US7208389B1 (en) | 2003-03-31 | 2007-04-24 | Novellus Systems, Inc. | Method of porogen removal from porous low-k films using UV radiation |
US7241704B1 (en) | 2003-03-31 | 2007-07-10 | Novellus Systems, Inc. | Methods for producing low stress porous low-k dielectric materials using precursors with organic functional groups |
US7176144B1 (en) | 2003-03-31 | 2007-02-13 | Novellus Systems, Inc. | Plasma detemplating and silanol capping of porous dielectric films |
US7265061B1 (en) | 2003-05-09 | 2007-09-04 | Novellus Systems, Inc. | Method and apparatus for UV exposure of low dielectric constant materials for porogen removal and improved mechanical properties |
JP2005051094A (ja) * | 2003-07-30 | 2005-02-24 | Disco Abrasive Syst Ltd | 切削装置 |
JP2005072195A (ja) * | 2003-08-22 | 2005-03-17 | Watanabe Shoko:Kk | 気化器用分散器、この気化器用分散器を用いたmocvd用気化器、及びキャリアガスの気化方法 |
DE20321548U1 (de) * | 2003-09-19 | 2007-11-29 | Gallus Druckmaschinen Gmbh | Rotationsdruckmaschine |
US7445058B2 (en) * | 2003-10-21 | 2008-11-04 | Shell Oil Company | Nozzle unit and method for excavating a hole in an object |
US7390537B1 (en) | 2003-11-20 | 2008-06-24 | Novellus Systems, Inc. | Methods for producing low-k CDO films with low residual stress |
US7341761B1 (en) | 2004-03-11 | 2008-03-11 | Novellus Systems, Inc. | Methods for producing low-k CDO films |
US7381662B1 (en) | 2004-03-11 | 2008-06-03 | Novellus Systems, Inc. | Methods for improving the cracking resistance of low-k dielectric materials |
US7094713B1 (en) | 2004-03-11 | 2006-08-22 | Novellus Systems, Inc. | Methods for improving the cracking resistance of low-k dielectric materials |
US7781351B1 (en) | 2004-04-07 | 2010-08-24 | Novellus Systems, Inc. | Methods for producing low-k carbon doped oxide films with low residual stress |
US7253125B1 (en) | 2004-04-16 | 2007-08-07 | Novellus Systems, Inc. | Method to improve mechanical strength of low-k dielectric film using modulated UV exposure |
US7622400B1 (en) | 2004-05-18 | 2009-11-24 | Novellus Systems, Inc. | Method for improving mechanical properties of low dielectric constant materials |
US7326444B1 (en) | 2004-09-14 | 2008-02-05 | Novellus Systems, Inc. | Methods for improving integration performance of low stress CDO films |
US9659769B1 (en) | 2004-10-22 | 2017-05-23 | Novellus Systems, Inc. | Tensile dielectric films using UV curing |
US7790633B1 (en) | 2004-10-26 | 2010-09-07 | Novellus Systems, Inc. | Sequential deposition/anneal film densification method |
US7695765B1 (en) | 2004-11-12 | 2010-04-13 | Novellus Systems, Inc. | Methods for producing low-stress carbon-doped oxide films with improved integration properties |
KR100568873B1 (ko) * | 2004-11-30 | 2006-04-10 | 삼성전자주식회사 | 웨이퍼의 에지 비드 스트립용 노즐장치 |
US7510982B1 (en) | 2005-01-31 | 2009-03-31 | Novellus Systems, Inc. | Creation of porosity in low-k films by photo-disassociation of imbedded nanoparticles |
US7166531B1 (en) | 2005-01-31 | 2007-01-23 | Novellus Systems, Inc. | VLSI fabrication processes for introducing pores into dielectric materials |
US8980769B1 (en) | 2005-04-26 | 2015-03-17 | Novellus Systems, Inc. | Multi-station sequential curing of dielectric films |
US8889233B1 (en) | 2005-04-26 | 2014-11-18 | Novellus Systems, Inc. | Method for reducing stress in porous dielectric films |
US8282768B1 (en) | 2005-04-26 | 2012-10-09 | Novellus Systems, Inc. | Purging of porogen from UV cure chamber |
US8137465B1 (en) | 2005-04-26 | 2012-03-20 | Novellus Systems, Inc. | Single-chamber sequential curing of semiconductor wafers |
US8454750B1 (en) | 2005-04-26 | 2013-06-04 | Novellus Systems, Inc. | Multi-station sequential curing of dielectric films |
JP4813855B2 (ja) * | 2005-09-12 | 2011-11-09 | 株式会社ディスコ | 切削装置および加工方法 |
US7892985B1 (en) | 2005-11-15 | 2011-02-22 | Novellus Systems, Inc. | Method for porogen removal and mechanical strength enhancement of low-k carbon doped silicon oxide using low thermal budget microwave curing |
US8110493B1 (en) | 2005-12-23 | 2012-02-07 | Novellus Systems, Inc. | Pulsed PECVD method for modulating hydrogen content in hard mask |
US7381644B1 (en) | 2005-12-23 | 2008-06-03 | Novellus Systems, Inc. | Pulsed PECVD method for modulating hydrogen content in hard mask |
US7923376B1 (en) | 2006-03-30 | 2011-04-12 | Novellus Systems, Inc. | Method of reducing defects in PECVD TEOS films |
US10037905B2 (en) | 2009-11-12 | 2018-07-31 | Novellus Systems, Inc. | UV and reducing treatment for K recovery and surface clean in semiconductor processing |
US7851232B2 (en) | 2006-10-30 | 2010-12-14 | Novellus Systems, Inc. | UV treatment for carbon-containing low-k dielectric repair in semiconductor processing |
US8465991B2 (en) * | 2006-10-30 | 2013-06-18 | Novellus Systems, Inc. | Carbon containing low-k dielectric constant recovery using UV treatment |
US7906174B1 (en) | 2006-12-07 | 2011-03-15 | Novellus Systems, Inc. | PECVD methods for producing ultra low-k dielectric films using UV treatment |
US8242028B1 (en) | 2007-04-03 | 2012-08-14 | Novellus Systems, Inc. | UV treatment of etch stop and hard mask films for selectivity and hermeticity enhancement |
JP2008270627A (ja) * | 2007-04-24 | 2008-11-06 | Rix Corp | ダイシング装置およびダイシング方法 |
US7622162B1 (en) | 2007-06-07 | 2009-11-24 | Novellus Systems, Inc. | UV treatment of STI films for increasing tensile stress |
US8211510B1 (en) | 2007-08-31 | 2012-07-03 | Novellus Systems, Inc. | Cascaded cure approach to fabricate highly tensile silicon nitride films |
JP2009071235A (ja) * | 2007-09-18 | 2009-04-02 | Sokudo:Kk | 基板処理装置 |
JP2009111211A (ja) * | 2007-10-31 | 2009-05-21 | Tokyo Seimitsu Co Ltd | ダイシング装置 |
MY157402A (en) * | 2008-02-21 | 2016-06-15 | Unilever Plc | A process and a device to clean substrates |
JP2009285799A (ja) * | 2008-05-30 | 2009-12-10 | Disco Abrasive Syst Ltd | 切削装置 |
KR100874128B1 (ko) | 2008-09-09 | 2008-12-15 | 주식회사 이포스 | 랩핑장치용 오토 플레이트 클리너 |
US9050623B1 (en) | 2008-09-12 | 2015-06-09 | Novellus Systems, Inc. | Progressive UV cure |
KR101007688B1 (ko) | 2008-11-18 | 2011-01-13 | 세메스 주식회사 | 세정액을 분사하기 위한 노즐 및 이를 포함하는 기판 세정 장치 |
JP2010123823A (ja) * | 2008-11-21 | 2010-06-03 | Disco Abrasive Syst Ltd | 切削装置 |
MY159833A (en) | 2009-08-19 | 2017-02-15 | Unilever Plc | A process and a device to clean substrates |
MX2012002122A (es) | 2009-08-19 | 2012-03-07 | Unilever Nv | Un proceso para limpiar dientes. |
BR112012002953B1 (pt) | 2009-08-19 | 2021-06-15 | Unilever Ip Holdings B.V. | Processo para limpar uma superfície dura com um dispositivo de limpeza |
JP5758111B2 (ja) * | 2010-12-02 | 2015-08-05 | 株式会社ディスコ | 切削装置 |
CN102240694A (zh) * | 2011-05-09 | 2011-11-16 | 新兴铸管股份有限公司 | 一种清理挤压态高端钢管内外壁玻璃粉的方法 |
JP5769605B2 (ja) * | 2011-12-02 | 2015-08-26 | 株式会社ディスコ | 切削装置 |
JP6242162B2 (ja) * | 2013-11-05 | 2017-12-06 | 株式会社ディスコ | 切削装置及び切削方法 |
JP6317941B2 (ja) | 2014-02-07 | 2018-04-25 | 株式会社ディスコ | 切削装置 |
JP2016157738A (ja) * | 2015-02-23 | 2016-09-01 | 株式会社ディスコ | 洗浄装置 |
JP2016159376A (ja) * | 2015-02-27 | 2016-09-05 | 株式会社ディスコ | 切削装置 |
KR101704494B1 (ko) * | 2015-05-26 | 2017-02-09 | 주식회사 케이씨텍 | 고속 유체 분사 노즐 및 이를 이용한 기판 처리 장치 |
US9847221B1 (en) | 2016-09-29 | 2017-12-19 | Lam Research Corporation | Low temperature formation of high quality silicon oxide films in semiconductor device manufacturing |
CN111633833B (zh) * | 2020-06-09 | 2022-03-29 | 广东龙美达建材有限公司 | 一种超高压石材水喷射切割机 |
CN111921955B (zh) * | 2020-08-10 | 2021-12-10 | 哈尔滨工业大学 | 一种风刀装置 |
JP7355422B1 (ja) | 2022-11-02 | 2023-10-03 | 株式会社塩 | 流体混合出力装置及びそれを用いる流体利用装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3577808A (en) * | 1968-12-23 | 1971-05-04 | Boeing Co | Sub-zero cutting fluid generator |
US5035090A (en) * | 1984-08-14 | 1991-07-30 | Szuecs Johan | Apparatus and method for cleaning stone and metal surfaces |
US5918817A (en) * | 1996-12-02 | 1999-07-06 | Mitsubishi Denki Kabushiki Kaisha | Two-fluid cleaning jet nozzle and cleaning apparatus, and method utilizing the same |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4666083A (en) * | 1985-11-21 | 1987-05-19 | Fluidyne Corporation | Process and apparatus for generating particulate containing fluid jets |
US4815241A (en) * | 1986-11-24 | 1989-03-28 | Whitemetal Inc. | Wet jet blast nozzle |
US4787404A (en) * | 1987-06-12 | 1988-11-29 | International Business Machines Corporation | Low flow rate-low pressure atomizer device |
DE4225590C2 (de) * | 1992-08-03 | 1995-04-27 | Johann Szuecs | Vorrichtung für die Behandlung von empfindlichen Oberflächen, insbesondere von Skulpturen |
-
1999
- 1999-04-19 JP JP11094599A patent/JP3410385B2/ja not_active Expired - Lifetime
-
2000
- 2000-04-10 SG SG200002017A patent/SG91271A1/en unknown
- 2000-04-11 US US09/547,332 patent/US6386466B1/en not_active Expired - Lifetime
- 2000-04-12 TW TW089106834A patent/TW445499B/zh not_active IP Right Cessation
- 2000-04-19 DE DE10019472A patent/DE10019472B4/de not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3577808A (en) * | 1968-12-23 | 1971-05-04 | Boeing Co | Sub-zero cutting fluid generator |
US5035090A (en) * | 1984-08-14 | 1991-07-30 | Szuecs Johan | Apparatus and method for cleaning stone and metal surfaces |
US5918817A (en) * | 1996-12-02 | 1999-07-06 | Mitsubishi Denki Kabushiki Kaisha | Two-fluid cleaning jet nozzle and cleaning apparatus, and method utilizing the same |
Also Published As
Publication number | Publication date |
---|---|
JP2000306878A (ja) | 2000-11-02 |
DE10019472A1 (de) | 2001-03-15 |
TW445499B (en) | 2001-07-11 |
US6386466B1 (en) | 2002-05-14 |
DE10019472B4 (de) | 2010-09-30 |
JP3410385B2 (ja) | 2003-05-26 |
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