SG87207A1 - Gold wire for semiconductor element bonding - Google Patents

Gold wire for semiconductor element bonding

Info

Publication number
SG87207A1
SG87207A1 SG200101081A SG200101081A SG87207A1 SG 87207 A1 SG87207 A1 SG 87207A1 SG 200101081 A SG200101081 A SG 200101081A SG 200101081 A SG200101081 A SG 200101081A SG 87207 A1 SG87207 A1 SG 87207A1
Authority
SG
Singapore
Prior art keywords
ppm
mass
semiconductor element
gold wire
element bonding
Prior art date
Application number
SG200101081A
Other languages
English (en)
Inventor
Itabashi Ichimitsu
Takaura Shin
Original Assignee
Tanaka Electronics Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Electronics Ind filed Critical Tanaka Electronics Ind
Publication of SG87207A1 publication Critical patent/SG87207A1/en

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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/012—Semiconductor purity grades
    • H01L2924/01204—4N purity grades, i.e. 99.99%
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/012—Semiconductor purity grades
    • H01L2924/01205—5N purity grades, i.e. 99.999%
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/20—Parameters
    • H01L2924/207—Diameter ranges
    • H01L2924/20751—Diameter ranges larger or equal to 10 microns less than 20 microns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/20—Parameters
    • H01L2924/207—Diameter ranges
    • H01L2924/20752—Diameter ranges larger or equal to 20 microns less than 30 microns
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    • H01L2924/20—Parameters
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    • H01L2924/20—Parameters
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/20—Parameters
    • H01L2924/207—Diameter ranges
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/20—Parameters
    • H01L2924/207—Diameter ranges
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/20—Parameters
    • H01L2924/207—Diameter ranges
    • H01L2924/20757—Diameter ranges larger or equal to 70 microns less than 80 microns
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/20—Parameters
    • H01L2924/207—Diameter ranges
    • H01L2924/20758—Diameter ranges larger or equal to 80 microns less than 90 microns
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/20—Parameters
    • H01L2924/207—Diameter ranges
    • H01L2924/20759—Diameter ranges larger or equal to 90 microns less than 100 microns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/20—Parameters
    • H01L2924/207—Diameter ranges
    • H01L2924/2076—Diameter ranges equal to or larger than 100 microns

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
SG200101081A 2000-06-19 2001-02-24 Gold wire for semiconductor element bonding SG87207A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000183521A JP3323185B2 (ja) 2000-06-19 2000-06-19 半導体素子接続用金線

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SG87207A1 true SG87207A1 (en) 2002-03-19

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KR (1) KR100695925B1 (zh)
CN (1) CN1267991C (zh)
DE (1) DE60127768T2 (zh)
MY (1) MY136914A (zh)
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Publication number Priority date Publication date Assignee Title
EP1811555A4 (en) * 2004-09-30 2012-06-20 Tanaka Electronics Ind AU-ALLOY BOND WIRE
CN100501956C (zh) 2004-11-26 2009-06-17 田中电子工业株式会社 半导体组件用金焊接线
JP4595018B2 (ja) * 2009-02-23 2010-12-08 株式会社新川 半導体装置の製造方法およびボンディング装置
CN107644716B (zh) * 2017-09-15 2019-09-13 绍兴市高砚智生物科技有限公司 添加蜜胺甲醛树脂的复合铜丝生产方法
CN107958850A (zh) * 2017-11-28 2018-04-24 宁波尚进自动化科技有限公司 一种焊点焊接质量监控系统及其监控方法
CN109811176A (zh) * 2019-03-25 2019-05-28 杭州辰卓科技有限公司 一种电子器件封装高阻尼键合线用金合金及其工艺

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5649534A (en) * 1979-09-28 1981-05-06 Tanaka Kikinzoku Kogyo Kk Bonding wire for semiconductor device
GB2116208A (en) * 1981-12-04 1983-09-21 Mitsubishi Metal Corp Fine gold alloy wire for bonding of a semiconductor device
JPS61110735A (ja) * 1984-10-31 1986-05-29 Tatsuta Electric Wire & Cable Co Ltd 耐熱性に優れた金合金
JPS62228440A (ja) * 1986-03-28 1987-10-07 Matsuda Kikinzoku Kogyo Kk 半導体素子ボンデイング用金線
EP0743679A2 (en) * 1995-05-17 1996-11-20 Tanaka Denshi Kogyo Kabushiki Kaisha Gold wire for chip bonding
JPH10172998A (ja) * 1996-12-11 1998-06-26 Sumitomo Metal Mining Co Ltd Ａｕボンディングワイヤー
JPH10303235A (ja) * 1997-04-25 1998-11-13 Tanaka Denshi Kogyo Kk 半導体素子ボンディング用金合金線

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5945065A (en) * 1996-07-31 1999-08-31 Tanaka Denshi Kogyo Method for wedge bonding using a gold alloy wire
JP3657087B2 (ja) * 1996-07-31 2005-06-08 田中電子工業株式会社 ウエッジボンディング用金合金線
US5745418A (en) * 1996-11-25 1998-04-28 Macronix International Co., Ltd. Flash memory mass storage system
JP2000040710A (ja) * 1998-07-24 2000-02-08 Sumitomo Metal Mining Co Ltd ボンディング用金合金細線

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5649534A (en) * 1979-09-28 1981-05-06 Tanaka Kikinzoku Kogyo Kk Bonding wire for semiconductor device
GB2116208A (en) * 1981-12-04 1983-09-21 Mitsubishi Metal Corp Fine gold alloy wire for bonding of a semiconductor device
JPS61110735A (ja) * 1984-10-31 1986-05-29 Tatsuta Electric Wire & Cable Co Ltd 耐熱性に優れた金合金
JPS62228440A (ja) * 1986-03-28 1987-10-07 Matsuda Kikinzoku Kogyo Kk 半導体素子ボンデイング用金線
EP0743679A2 (en) * 1995-05-17 1996-11-20 Tanaka Denshi Kogyo Kabushiki Kaisha Gold wire for chip bonding
JPH10172998A (ja) * 1996-12-11 1998-06-26 Sumitomo Metal Mining Co Ltd Ａｕボンディングワイヤー
JPH10303235A (ja) * 1997-04-25 1998-11-13 Tanaka Denshi Kogyo Kk 半導体素子ボンディング用金合金線

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EP1168439A3 (en) 2002-04-10
MY136914A (en) 2008-11-28
JP3323185B2 (ja) 2002-09-09
JP2002009101A (ja) 2002-01-11
TW480635B (en) 2002-03-21
CN1330404A (zh) 2002-01-09
EP1168439A2 (en) 2002-01-02
EP1168439B1 (en) 2007-04-11
KR20010113459A (ko) 2001-12-28
KR100695925B1 (ko) 2007-03-20
DE60127768T2 (de) 2007-12-27
DE60127768D1 (de) 2007-05-24

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