WO2008132919A1 - 高信頼性金合金ボンディングワイヤ及び半導体装置 - Google Patents

高信頼性金合金ボンディングワイヤ及び半導体装置 Download PDF

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Publication number
WO2008132919A1
WO2008132919A1 PCT/JP2008/055702 JP2008055702W WO2008132919A1 WO 2008132919 A1 WO2008132919 A1 WO 2008132919A1 JP 2008055702 W JP2008055702 W JP 2008055702W WO 2008132919 A1 WO2008132919 A1 WO 2008132919A1
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WO
WIPO (PCT)
Prior art keywords
semiconductor device
bonding wire
gold alloy
alloy bonding
highly reliable
Prior art date
Application number
PCT/JP2008/055702
Other languages
English (en)
French (fr)
Inventor
Hiroshi Murai
Jun Chiba
Fujio Amada
Original Assignee
Tanaka Denshi Kogyo K.K.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo K.K. filed Critical Tanaka Denshi Kogyo K.K.
Priority to EP08738890A priority Critical patent/EP2139032A4/en
Priority to US12/297,263 priority patent/US20100171222A1/en
Publication of WO2008132919A1 publication Critical patent/WO2008132919A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/02—Alloys based on gold
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0227—Rods, wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3013—Au as the principal constituent
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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  • Engineering & Computer Science (AREA)
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  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

半導体装置のＡｌ電極に対する低電気抵抗で接合信頼性を向上したＡｕ合金ボンディングワイヤ及び該ワイヤによりＡｌ電極パッドに接合した半導体装置を提供するために、Ａｇを０．０２～０．３質量％、ＧｅまたはＳｉの少なくとも1 種を合計で１０～２００質量ｐｐｍおよび／またはＡｌまたはＣｕの少なくとも1 種を合計で１０～２００質量ｐｐｍ含有し、残部がＡｕからなることを特徴とする金合金ボンディングワイヤ、及び、上記金合金ボンディングワイヤにより、ＡｌまたはＡｌ合金電極パッドと接続した半導体装置を用いる。
PCT/JP2008/055702 2007-04-17 2008-03-26 高信頼性金合金ボンディングワイヤ及び半導体装置 WO2008132919A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP08738890A EP2139032A4 (en) 2007-04-17 2008-03-26 VERY RELIABLE GOLD ALLOY CONNECTION WIRE AND SEMICONDUCTOR DEVICE
US12/297,263 US20100171222A1 (en) 2007-04-17 2008-03-26 HIGH RELIABILITY Au ALLOY BONDING WIRE AND SEMICONDUCTOR DEVICE OF SAME

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MY (1) MY148234A (ja)
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MY164643A (en) * 2009-07-30 2018-01-30 Nippon Steel & Sumikin Mat Co Bonding wire for semiconductor
US8692118B2 (en) 2011-06-24 2014-04-08 Tessera, Inc. Reliable wire structure and method
JP5080682B1 (ja) * 2011-12-02 2012-11-21 田中電子工業株式会社 金−白金−パラジウム合金ボンディングワイヤ
CN102489896A (zh) * 2011-12-18 2012-06-13 湖南科技大学 钎焊金属基复合封装材料的中温钎料薄带及其制备、钎焊
CN109003903B (zh) * 2018-07-02 2020-08-18 上杭县紫金佳博电子新材料科技有限公司 一种键合金丝及其制备方法
CN110284021B (zh) * 2019-06-27 2020-06-30 袁海 提高足金、足银硬度的中间合金及其制备方法与应用

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JPS5251867A (en) 1975-10-23 1977-04-26 Nec Corp Bonding wire for semiconductor device
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JPH02259032A (ja) * 1989-03-31 1990-10-19 Tatsuta Electric Wire & Cable Co Ltd ボンディング用金合金細線
JPH1083716A (ja) * 1996-09-09 1998-03-31 Nippon Steel Corp 半導体素子用金合金細線および半導体装置
JPH1098063A (ja) * 1996-07-31 1998-04-14 Tanaka Denshi Kogyo Kk ウエッジボンディング用金合金線
JPH10303239A (ja) * 1997-04-30 1998-11-13 Nippon Steel Corp 半導体素子
JPH10303236A (ja) * 1997-04-25 1998-11-13 Tanaka Denshi Kogyo Kk 半導体素子ボンディング用金合金線
JPH11126788A (ja) * 1997-10-23 1999-05-11 Tanaka Electron Ind Co Ltd Ｉｃチップ接続用金合金線

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JPS5251867A (en) 1975-10-23 1977-04-26 Nec Corp Bonding wire for semiconductor device
JPS6487734A (en) * 1987-09-29 1989-03-31 Tanaka Precious Metal Ind Material for gold extra fine wire
JPH02259032A (ja) * 1989-03-31 1990-10-19 Tatsuta Electric Wire & Cable Co Ltd ボンディング用金合金細線
JPH1098063A (ja) * 1996-07-31 1998-04-14 Tanaka Denshi Kogyo Kk ウエッジボンディング用金合金線
JPH1083716A (ja) * 1996-09-09 1998-03-31 Nippon Steel Corp 半導体素子用金合金細線および半導体装置
JPH10303236A (ja) * 1997-04-25 1998-11-13 Tanaka Denshi Kogyo Kk 半導体素子ボンディング用金合金線
JPH10303239A (ja) * 1997-04-30 1998-11-13 Nippon Steel Corp 半導体素子
JPH11126788A (ja) * 1997-10-23 1999-05-11 Tanaka Electron Ind Co Ltd Ｉｃチップ接続用金合金線

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See also references of EP2139032A4

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EP2139032A1 (en) 2009-12-30
CN101663743A (zh) 2010-03-03
TW200844241A (en) 2008-11-16
MY148234A (en) 2013-03-29
KR20100014748A (ko) 2010-02-11
EP2139032A4 (en) 2009-12-30
US20100171222A1 (en) 2010-07-08
JP2008270371A (ja) 2008-11-06
JP4130843B1 (ja) 2008-08-06

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