SG81297A1 - Micro-discharge truing device and fine machining method using the device - Google Patents

Micro-discharge truing device and fine machining method using the device

Info

Publication number
SG81297A1
SG81297A1 SG9904134A SG1999004134A SG81297A1 SG 81297 A1 SG81297 A1 SG 81297A1 SG 9904134 A SG9904134 A SG 9904134A SG 1999004134 A SG1999004134 A SG 1999004134A SG 81297 A1 SG81297 A1 SG 81297A1
Authority
SG
Singapore
Prior art keywords
micro
machining method
fine machining
discharge truing
truing device
Prior art date
Application number
SG9904134A
Other languages
English (en)
Inventor
Ohmori Hitoshi
Yamagata Yutaka
Original Assignee
Riken
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Riken filed Critical Riken
Publication of SG81297A1 publication Critical patent/SG81297A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H1/00—Electrical discharge machining, i.e. removing metal with a series of rapidly recurring electrical discharges between an electrode and a workpiece in the presence of a fluid dielectric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/04—Devices or means for dressing or conditioning abrasive surfaces of cylindrical or conical surfaces on abrasive tools or wheels
    • B24B53/053—Devices or means for dressing or conditioning abrasive surfaces of cylindrical or conical surfaces on abrasive tools or wheels using a rotary dressing tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/001—Devices or means for dressing or conditioning abrasive surfaces involving the use of electric current

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
SG9904134A 1998-08-19 1999-08-19 Micro-discharge truing device and fine machining method using the device SG81297A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10232520A JP2000061839A (ja) 1998-08-19 1998-08-19 マイクロ放電ツルーイング装置とこれを用いた微細加工方法

Publications (1)

Publication Number Publication Date
SG81297A1 true SG81297A1 (en) 2001-06-19

Family

ID=16940625

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9904134A SG81297A1 (en) 1998-08-19 1999-08-19 Micro-discharge truing device and fine machining method using the device

Country Status (8)

Country Link
US (1) US6244939B1 (ko)
EP (1) EP0980735B1 (ko)
JP (1) JP2000061839A (ko)
KR (1) KR100594082B1 (ko)
CA (1) CA2280342C (ko)
DE (1) DE69937324T2 (ko)
SG (1) SG81297A1 (ko)
TW (1) TW436367B (ko)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000061839A (ja) * 1998-08-19 2000-02-29 Rikagaku Kenkyusho マイクロ放電ツルーイング装置とこれを用いた微細加工方法
JP2000079561A (ja) * 1998-09-04 2000-03-21 Inst Of Physical & Chemical Res 単結晶ＳｉＣの切断・鏡面加工方法及び装置
JP3463796B2 (ja) * 1999-03-03 2003-11-05 理化学研究所 プラズマ放電ツルーイング装置とこれを用いた微細加工方法
JP4144725B2 (ja) * 1999-09-30 2008-09-03 独立行政法人理化学研究所 ガラス基板のチャンファリング方法及び装置
US6547648B1 (en) * 1999-10-15 2003-04-15 Trustees Of Stevens Institute Of Technology - Graduate School And Research Services Method and device for high speed electrolytic in-process dressing for ultra-precision grinding
JP4558881B2 (ja) * 2000-03-03 2010-10-06 独立行政法人理化学研究所 マイクロｖ溝加工装置及び方法
JP2001353648A (ja) * 2000-06-16 2001-12-25 Inst Of Physical & Chemical Res 大口径工作物のｅｌｉｄ鏡面研削装置及び方法
JP4895440B2 (ja) * 2001-07-04 2012-03-14 独立行政法人理化学研究所 被加工物の表面機能改善方法及び装置
JP4737492B2 (ja) * 2001-09-04 2011-08-03 独立行政法人理化学研究所 メタルレスボンド砥石とそれによる電解ドレッシング研削方法及び装置
CN1313245C (zh) * 2001-12-26 2007-05-02 光洋机械工业株式会社 磨削磨具的整形修整方法及其整形修整装置与磨削装置
DE102005023060B4 (de) 2005-05-19 2011-01-27 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Gasentladungs-Strahlungsquelle, insbesondere für EUV-Strahlung
JP5095159B2 (ja) * 2006-08-31 2012-12-12 富士重工業株式会社 電解ドレッシング研削装置
DE502007004211D1 (de) * 2007-12-19 2010-08-05 Agathon Ag Maschf Schleifmaschine mit einer Vorrichtung zum Konditionieren einer Schleifscheibe und Verfahren dazu
JP5164758B2 (ja) * 2008-09-16 2013-03-21 トーヨーエイテック株式会社 砥石加工方法及び同装置
JP2012183614A (ja) * 2011-03-07 2012-09-27 Fuji Heavy Ind Ltd ホーニング装置
CN102501175A (zh) * 2011-11-10 2012-06-20 大连永明数控机床有限公司 一种砂轮修正装置
JP6223862B2 (ja) * 2014-02-27 2017-11-01 株式会社ディスコ 切削装置
US10232491B2 (en) * 2015-05-29 2019-03-19 Inland Diamond Products Company Retruing of a grinding wheel using EDM machine
CN105345179B (zh) * 2015-11-16 2018-04-06 四川明日宇航工业有限责任公司 一种钛合金材料电铣削加工方法
CN107243837A (zh) * 2017-07-20 2017-10-13 江苏省艾格森数控设备制造有限公司 金刚石砂棒的电火花整形修锐机及其整形修锐方法
CN108177030A (zh) * 2018-01-30 2018-06-19 华南理工大学 一种粗金刚石砂轮的镜面磨削方法
CN110438856A (zh) * 2019-08-14 2019-11-12 上海两擎机电科技合伙企业(有限合伙) 一种用于铁轨高速放电打磨的设备及方法
TWI715298B (zh) * 2019-11-20 2021-01-01 國立臺灣師範大學 線上放電削銳系統及其方法
CN110890866B (zh) * 2019-12-23 2023-10-27 中国电子科技集团公司第二十九研究所 一种星载固态功率放大器抗微放电的方法及匹配电路
CN114603484B (zh) * 2022-03-08 2023-02-21 湖南科技大学 一种金属结合剂砂轮微波直接修整方法及系统

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997006922A1 (fr) * 1995-08-15 1997-02-27 The Institute Of Physical And Chemical Research Procede de controle des formes et machines a commande numerique fonctionnant selon ce procede
WO1999029469A1 (de) * 1997-12-10 1999-06-17 Vollmer Werke Maschinenfabrik Gmbh Verfahren und vorrichtung zum funkenerosiven abrichten einer schleifscheibe

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US81297A (en) * 1868-08-18 William m
US2280342A (en) * 1940-03-26 1942-04-21 Int Harvester Co Adjusting mechanism
US3420759A (en) * 1966-03-16 1969-01-07 Inoue K Electromachining using an electrolyte having substantially the same resistivity as the electrode
US3551310A (en) * 1967-10-04 1970-12-29 Inoue K Gas-pressure gate arrangement for electrochemical machining
DE2302040A1 (de) * 1972-06-01 1973-12-13 Nicolas Mironoff Schaltung zur verwendung bei elektroerosionsmaschinen
JP2660512B2 (ja) * 1987-05-15 1997-10-08 哲太郎 植松 メタルボンド砥石の機上放電ツルーイング方法
JP2666197B2 (ja) * 1987-08-03 1997-10-22 威雄 中川 放電ツルーイング／ドレッシング装置を備えたターニングセンタ
US5910404A (en) * 1990-12-14 1999-06-08 Innogenetics N.V. Synthetic antigens for the detection of antibodies to hepatitis C virus
JP3286941B2 (ja) * 1991-07-09 2002-05-27 株式会社日立製作所 ダイヤモンド研削砥石のツルーイング法
JPH05277938A (ja) * 1992-03-31 1993-10-26 Nachi Fujikoshi Corp 機上放電ツルーイング方法及び装置
DE69306049T2 (de) * 1992-06-19 1997-03-13 Rikagaku Kenkyusho Vorrichtung zum Schleifen von Spiegeloberfläche
JPH068141A (ja) * 1992-06-25 1994-01-18 Fuji Elelctrochem Co Ltd 放電ツルーイングによる加工方法
JP2601750B2 (ja) * 1992-09-30 1997-04-16 株式会社不二越 機上放電ツルーイング法による砥石側面整形法
JP2626552B2 (ja) * 1994-05-23 1997-07-02 日本電気株式会社 球面加工装置及び方法
JPH09103940A (ja) * 1995-08-07 1997-04-22 Ricoh Co Ltd 電解インプロセスドレッシング研削砥石および電解インプロセスドレッシング研削方法および電解インプロセスドレッシング研削装置
US6043961A (en) * 1995-09-08 2000-03-28 Kao Corporation Magnetic recording medium and method for producing the same
JPH1076448A (ja) * 1996-08-30 1998-03-24 Riken Seiko Kk Ｅｌｉｄ研削方法
JPH10175165A (ja) * 1996-12-12 1998-06-30 Koyo Mach Ind Co Ltd メタルボンド砥石を用いたセンタレス研削方法及びその装置
JP3214694B2 (ja) * 1997-12-02 2001-10-02 理化学研究所 動圧発生電極
JP2000061839A (ja) * 1998-08-19 2000-02-29 Rikagaku Kenkyusho マイクロ放電ツルーイング装置とこれを用いた微細加工方法
KR100436367B1 (ko) * 2001-12-14 2004-06-19 삼성전자주식회사 수직 진동 질량체를 갖는 멤스 자이로스코프

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997006922A1 (fr) * 1995-08-15 1997-02-27 The Institute Of Physical And Chemical Research Procede de controle des formes et machines a commande numerique fonctionnant selon ce procede
WO1999029469A1 (de) * 1997-12-10 1999-06-17 Vollmer Werke Maschinenfabrik Gmbh Verfahren und vorrichtung zum funkenerosiven abrichten einer schleifscheibe

Also Published As

Publication number Publication date
US6244939B1 (en) 2001-06-12
KR100594082B1 (ko) 2006-06-28
DE69937324D1 (de) 2007-11-29
DE69937324T2 (de) 2008-02-07
CA2280342C (en) 2006-07-18
TW436367B (en) 2001-05-28
JP2000061839A (ja) 2000-02-29
EP0980735A3 (en) 2004-01-21
EP0980735B1 (en) 2007-10-17
CA2280342A1 (en) 2000-02-19
KR20000017369A (ko) 2000-03-25
EP0980735A2 (en) 2000-02-23

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